Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

A kind of oxygen-free copper, preparation method and application

An oxygen-free copper and intermediate alloy technology, applied in the field of copper alloys, can solve the problems of product macro surface roughness, coarse recrystallized grains, and potential safety hazards, so as to reduce the size of grain clusters, inhibit grain growth, Effect of improving heat resistance

Active Publication Date: 2022-05-20
CENT SOUTH UNIV
View PDF12 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Compared with ordinary red copper and pure copper, the oxygen-free copper prepared by the above method has significantly improved heat resistance. However, after continuous high-temperature treatment above 500°C, the crystal grains will still increase rapidly, resulting in rough surface of the product ( aka cellulite)
In addition, if the thermal and electrical loads increase rapidly during service, traditional oxygen-free copper is also prone to produce coarse recrystallized grains, resulting in shortened service life and potential safety hazards

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • A kind of oxygen-free copper, preparation method and application
  • A kind of oxygen-free copper, preparation method and application
  • A kind of oxygen-free copper, preparation method and application

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0114] This example provides a kind of oxygen-free copper and preparation method thereof, and concrete steps are as follows:

[0115] (1) Weigh Cu-Zr master alloy, Cu-Sr master alloy, Cu-Ce master alloy, Cu-Yb master alloy block and Electrolytic copper plate.

[0116] (2) In the graphite crucible, place a weighed electrolytic copper plate, a uniformly mixed intermediate alloy block, a refining agent accounting for 5% of the sum of electrolytic copper and alloy mass, and a 20cm covering agent (charcoal block and graphite crucible) from bottom to top. pink).

[0117] (3) in N 2 Under +CO gas atmosphere, melt the material in step (2) with an intermediate frequency induction furnace at a melting temperature of 1200°C.

[0118] (4) Under a protective atmosphere, cast the melt with uniform composition in step (3) at 1130°C.

[0119] (5) Under a protective atmosphere, the ingot obtained in step (4) is subjected to a homogenization treatment at a treatment temperature of 600° C. f...

Embodiment 2

[0124] This example provides an oxygen-free copper and its preparation method. The difference between the specific steps and Example 1 is: in step (1), the addition amount of alloying elements is 20ppm Zr, 20ppm Sr, 40ppm Ce, and 80ppm Yb.

[0125] In this example, oxygen-free copper sample 2 was prepared.

[0126] The metallographic structure of oxygen-free copper sample 2 is as follows figure 2 shown.

Embodiment 3

[0128] This example provides an oxygen-free copper and its preparation method. The difference between the specific steps and Example 1 is: in step (1), the addition amount of alloying elements is 15ppm Zr, 15ppm Sr, 15ppm Ce, and 40ppm Yb.

[0129] In this example, an oxygen-free copper sample 3 was prepared.

[0130] The metallographic structure of oxygen-free copper sample 3 is as follows image 3 shown.

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
thicknessaaaaaaaaaa
particle diameteraaaaaaaaaa
hardnessaaaaaaaaaa
Login to View More

Abstract

The invention provides an oxygen-free copper, a preparation method and an application. Among them, four alloying elements Zr, Sr, Ce, and Yb are added to the oxygen-free copper. The preparation method comprises the following steps: S1. After uniformly mixing electrolytic copper, Zr, Sr, Ce and Yb, adding a covering agent and a refining agent, and melting under a reducing atmosphere; S2. Casting the composition obtained in step S1 under a protective atmosphere Uniform melt; S3. the ingot obtained in step S2 is subjected to homogenization treatment under a protective atmosphere; S4. the ingot after homogenization is carried out in a cycle of "cold deformation-recrystallization-air cooling under a protective atmosphere "Craft. The oxygen-free copper provided by the invention has good heat resistance, and the grain size does not increase significantly after high temperature treatment at 900°C.

Description

technical field [0001] The invention relates to the technical field of copper alloys, in particular to an oxygen-free copper, a preparation method and an application. Background technique [0002] Copper has good electrical conductivity, thermal conductivity, weldability, plasticity, ductility and excellent cold workability, and is non-magnetic. Oxygen-free copper refers to pure copper with very low oxygen content and impurity content. Oxygen-free copper partly overcomes the shortcomings of low yield strength and poor creep resistance at high temperature of impurity-containing copper after annealing. It has higher strength and higher thermal conductivity, and has been highly valued by electronic material experts. [0003] Oxygen-free copper is an important material for the preparation of new energy vehicle power module circuit boards and their peripheral components. With the innovation of new energy vehicle technology, the power module circuit board that controls the vehic...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): C22C9/00C22C1/03C22C1/06C22F1/08
CPCC22C9/00C22C1/03C22C1/06C22F1/06Y02P10/20
Inventor 李周马牧之邱文婷肖柱龚深姜雁斌
Owner CENT SOUTH UNIV
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com