Heat conduction composite material and preparation method thereof

A technology of thermally conductive composite materials and thermally conductive fillers, applied in the field of thermally conductive composite materials and their preparation, can solve problems such as poor thermal conductivity, achieve the effects of improving thermal conductivity, increasing wettability, and being beneficial to large-scale industrial applications

Inactive Publication Date: 2021-02-26
SHENZHEN INST OF ADVANCED TECH CHINESE ACAD OF SCI
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0005] In view of the deficiencies in the prior art, the present invention provides a thermally conductive composite material and its preparation method to solve the problem of poor thermal conductivity of existing polymer composite materials

Method used

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  • Heat conduction composite material and preparation method thereof
  • Heat conduction composite material and preparation method thereof
  • Heat conduction composite material and preparation method thereof

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preparation example Construction

[0037] The embodiment of the present invention also provides the preparation method of the above-mentioned heat-conducting composite material, refer to figure 1 , the preparation method comprises:

[0038] S10. Preparation of thermally conductive filler dispersion: grafting amino functional groups on the edges of boron nitride nanosheets through surface modification to obtain thermally conductive fillers; dispersing the thermally conductive fillers in a dispersant to form a thermally conductive filler dispersion.

[0039] In the preferred scheme, hexagonal boron nitride is used as raw material, urea is used as modifier, hexagonal boron nitride is mixed with urea and ball milling aid is added, and then placed in ball milling equipment for ball milling process to obtain edge-grafted amino groups. Functional group boron nitride nanosheet powder. Then, the boron nitride nanosheet powder is washed and dried, and then added to the dispersion liquid for dispersion to obtain the ther...

Embodiment 1

[0058] Embodiment 1: Preparation of thermally conductive filler dispersion

[0059] Hexagonal boron nitride, urea and sodium chloride are mixed in the planetary ball mill according to the mass ratio of 1:20:5, and the N 2 Under the protection of the atmosphere, at a speed of 500r / min, use ZrO with ball diameters of 10mm and 1mm respectively. 2 Grinding balls, ball milling for 10 hours. Wash and dry the obtained powder with deionized water to remove excess urea and sodium chloride to obtain pure boron nitride nanopowder, and then choose deionized water as a dispersant to make pure boron nitride nanopowder The body is dispersed in deionized water, and finally a pure and stable thermal conductive filler is obtained. The urea added during the ball milling process modified the boron nitride nanosheets, and grafted -NH 2 functional group.

Embodiment 2

[0060] Embodiment 2: the preparation of polymer matrix solution

[0061] In this embodiment, the polymer matrix is ​​selected as cyanate resin, and its preparation process is as follows:

[0062] Put 7g of bisphenol A type cyanate ester monomer and catalyst (dibutyltin dilaurate, 0.05g) into the reaction vessel successively, heat with an oil bath, the heating temperature is 90°C, the heating time is 30min, and polymerize After the reaction is completed, a light yellow transparent cyanate polymer liquid is obtained, that is, a polymer matrix solution is obtained.

[0063] Add 3g of E51 type epoxy resin to the prepared cyanate polymer solution, continue stirring and heating for 15min to obtain a mixture of cyanate resin and epoxy resin.

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Abstract

The invention provides a heat conduction composite material, which comprises a polymer matrix and a heat conduction filler filled in the polymer matrix, and the heat conduction filler is a boron nitride nano sheet of which the edge is grafted with an amino functional group. The preparation method of the heat conduction composite material comprises the following steps: preparation of a heat conduction filler dispersion liquid: grafting amino functional groups to the edges of boron nitride nano sheets through surface modification to obtain the heat conduction filler; dispersing the heat conduction filler in a dispersing agent to form heat conduction filler dispersion liquid; preparation of a polymer matrix solution: carrying out polymerization reaction on monomers for forming a polymer matrix under the action of heating and a catalyst to obtain a polymer matrix solution; adding the heat conduction filler dispersion liquid into the polymer matrix solution according to a preset proportion,and stirring and mixing to obtain mixed slurry; and curing the mixed slurry to form a film to obtain the heat conduction composite material. The heat conduction composite material provided by the invention has a good heat conduction property and mechanical property.

Description

technical field [0001] The invention belongs to the technical field of heat-conducting materials, and in particular relates to a heat-conducting composite material and a preparation method thereof. Background technique [0002] The arrival of the 5G era has made electronic equipment more and more thin and miniaturized. The highly integrated and complex structure of the internal electronic components has greatly increased the heating power per unit area of ​​the device, and the heating of the device will seriously affect the use of equipment. performance and longevity. Statistics show that 55% of electronic product failures are caused by overheating. Therefore, heat dissipation of electronic devices has become an urgent problem to be solved. [0003] Compared with traditional metal and ceramic materials, polymers are widely used due to their light weight, low cost, good insulation performance and processing performance. For example, printed circuit boards used in the field...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L79/04C08L63/00C08K3/38C08K7/00C08K9/04C08J5/18C09K5/14
CPCC08L79/04C08J5/18C09K5/14C08K2201/011C08K2003/385C08J2379/04C08J2463/00C08L2203/16C08L63/00C08K3/38C08K7/00C08K9/04
Inventor 鲁济豹郭蕊冉小能刘永超李呈龙印浩
Owner SHENZHEN INST OF ADVANCED TECH CHINESE ACAD OF SCI
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