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A kind of anti-spatter tin wire for electronic packaging and preparation method thereof

An electronic packaging and anti-splash technology, applied in welding equipment, manufacturing tools, auxiliary devices, etc., can solve problems such as poor solder joint firmness, welding spatter, and different expansion coefficients, so as to improve anti-splash performance and reduce production costs , improve the splash effect

Active Publication Date: 2022-07-26
苏州柯仕达电子材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In view of the above-mentioned related technologies, the inventor believes that the mixed preparation of the flux and the solder alloy used leads to the difference in expansion coefficient between the flux and the solder in the actual use process, and the thermal expansion and cracking during the welding process leads to welding spatter, resulting in welding spatter. Poor firmness of solder joints after

Method used

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  • A kind of anti-spatter tin wire for electronic packaging and preparation method thereof
  • A kind of anti-spatter tin wire for electronic packaging and preparation method thereof

Examples

Experimental program
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Effect test

Embodiment 1

[0030] According to the mass ratio of 1:5:20, polyvinyl alcohol and polyglycerol ester were added to deionized water, stirred and mixed and placed at 75°C for thermal insulation and dissolution, and the dissolved solution was collected; 1:15, add monoglyceride to the molten beeswax, stir and mix and ultrasonically disperse for 10min, collect the emulsion, control the dropping ratio to be 1:3 by mass ratio, add the dissolved dropwise to the emulsion, at 55 Incubate the reaction at ℃ for 3h, stand to cool to room temperature, separate and collect the upper layer solidified body to obtain modified beeswax;

[0031] According to the mass ratio of 1:1, the rosin and toluene were mixed and placed at 65 °C for 25 minutes, and the mixed stirring liquid was collected and 45 mL of the mixed stirring liquid, 1 g of zinc chloride and 3 mL of 0.5 mol / L sulfuric acid were respectively weighed. Under a nitrogen atmosphere, react in an oil bath at 125 °C for 6 hours, stand to cool to room tempe...

Embodiment 2

[0037] According to the mass ratio of 1:5:20, polyvinyl alcohol and polyglycerol ester were added to deionized water, stirred and mixed, and placed at 80 °C for insulation and dissolution, and the dissolved solution was collected; 1:15, add monoglyceride to molten beeswax, stir and mix and ultrasonically disperse for 12min, collect the emulsion, control the dropping ratio to be 1:3 by mass ratio, add the dissolved dropwise to the emulsion, at 58 Incubate the reaction at ℃ for 4h, stand to cool to room temperature, separate and collect the upper layer solidified body to obtain modified beeswax;

[0038] According to the mass ratio of 1:1, the rosin and toluene were mixed and kept at 70°C for 27 minutes, and the mixed stirring liquid was collected and weighed respectively 47 mL of the mixed stirring liquid, 1 g of zinc chloride and 4 mL of 0.5 mol / L sulfuric acid. Under a nitrogen atmosphere, react in an oil bath at 127°C for 7 hours, stand to cool to room temperature and filter...

Embodiment 3

[0044] According to the mass ratio of 1:5:20, polyvinyl alcohol and polyglycerol ester were added to deionized water, stirred and mixed, and placed at 85 °C for insulation and dissolution, and the dissolved solution was collected; 1:15, add the monoglyceride to the molten beeswax, stir and mix and ultrasonically disperse for 15min, collect the emulsion, control the dropping ratio to be 1:3 by mass ratio, add the dissolved dropwise to the emulsion, at 60 Incubate the reaction at ℃ for 5h, stand to cool to room temperature, separate and collect the upper layer solidified body to obtain modified beeswax;

[0045] According to the mass ratio of 1:1, mix the rosin and toluene and keep stirring at 75°C for 25-30 minutes, collect the mixed stirring liquid and weigh 50 mL of the mixed stirring liquid, 2 g of zinc chloride and 5 mL of 0.5 mol / L sulfuric acid, respectively, and stir. Mixed and placed under nitrogen atmosphere, reacted in oil bath at 130°C for 8 hours, left to cool to ro...

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Abstract

The application relates to the field of catalysts, and specifically discloses an anti-splash tin wire for electronic packaging and a preparation method thereof. It includes flux and tin-copper alloy solder coated on the surface of the flux, and the alloy solder is Sn-0.7Cu alloy solder; the flux includes the following parts by weight: 45-50 parts of modified matrix particles; 3-5 parts of hexadecyl diester; 10-15 parts of dihydroxy acid; 6-8 parts of organic acid; 10-15 parts of surfactant; 25-30 parts of modified solvent; the modified matrix particles are polymerized rosin resin. In the present application, polymerized rosin is used as the main material in the flux, which replaces the common rosin material used in the traditional solution, which can effectively form a good flow in the flux, and effectively wrap the impurities generated by welding. The surface of the solder joint forms a good surface coating performance, which further improves the anti-spatter performance of the tin wire during the welding process, thereby improving the firm strength of the solder joint after welding.

Description

technical field [0001] The present application relates to the field of soldering materials, and more particularly, to an anti-spatter tin wire for electronic packaging and a preparation method thereof. Background technique [0002] Flux-cored solder wire consists of two parts: solder alloy and flux. It is formed by extruding the flux into the core of the solder alloy during the production process. It is mainly used for soldering iron. According to the type of flux in the solder wire, the flux cored solder wire can be divided into three types: resin type flux cored solder wire, water-soluble flux cored solder wire and no-clean flux cored solder wire. The resin-type flux-cored solder wire adopts halogen-containing rosin-type flux, and the main component is rosin. Due to the addition of halogen-containing active substances, the flux has strong activity, so it is widely used. [0003] With the introduction of lead-free slogans, lead-free soldering materials have developed rapi...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23K3/00B23K3/08
CPCB23K3/00B23K3/082
Inventor 李春方宋波程龙祝刘斌
Owner 苏州柯仕达电子材料有限公司
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