Micro-foaming low-dielectric cyanate ester resin and preparation method thereof

A technology of cyanate resin and electrocyanate, applied in the field of materials, can solve the problems of reducing the dielectric property of cyanate resin, not checking, sacrificing the mechanical properties of the resin, etc., and achieve good wave transmission performance and excellent dielectric properties. , the effect of avoiding the risk of explosion

Active Publication Date: 2021-04-06
AEROSPACE INST OF ADVANCED MATERIALS & PROCESSING TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, this kind of physical filler has poor compatibility with cyanate resin, is not easy to conduct heat, and the resin has the risk of implosion, and the mechanical properties of the resin are sacrificed to a certain extent.
[0004] According to the search of relevant information, there is no reference to the relevant literature on reducing the dielectric properties of cyanate resin through micro-foaming technology

Method used

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  • Micro-foaming low-dielectric cyanate ester resin and preparation method thereof
  • Micro-foaming low-dielectric cyanate ester resin and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0026] Proportioning (number of parts by mass):

[0027] Cyanate: bisphenol A type cyanate, 80 parts by weight;

[0028] Epoxy resin: bisphenol A type epoxy resin, 15 parts by weight;

[0029] Thermoplastic resin: polyethersulfone, 20 parts by weight, the molar ratio of cyanate functional group to terminal hydroxyl group is 25:1;

[0030] Foaming agent: azodicarbonamide, 3 parts by weight;

[0031] Catalyst solution: 1 part by weight; bis-n-butyltin oxide is the main catalyst, the concentration is 0.7%; nonylphenol is the auxiliary catalyst, the concentration is 15%; the solvent is dichloroethane.

[0032] Preparation Process:

[0033] In the first step, the cyanate resin is heated to 90-95°C and melted to a homogeneous liquid.

[0034] In the second step, the thermoplastic resin is heated to 105-110°C to melt, and then mixed with epoxy resin, fully stirred evenly to obtain a toughening component;

[0035] The third step is to mix the molten cyanate resin and the tougheni...

Embodiment 2

[0039] Proportioning (number of parts by mass):

[0040] Cyanate: bisphenol F type cyanate, 90 parts by weight;

[0041] Epoxy resin: bisphenol F type epoxy resin, 20 parts by weight;

[0042] Thermoplastic resin: polyethersulfone, 20 parts by weight, the molar ratio of cyanate functional group to terminal hydroxyl group is 18:1;

[0043] Foaming agent: azodicarbonamide, 5 parts by weight;

[0044] Catalyst solution: 2 parts by weight; bis-n-octyltin oxide is the main catalyst with a concentration of 1%; nonylphenol is an auxiliary catalyst with a concentration of 10%; the solvent is dichloromethane.

[0045] Preparation Process:

[0046] In the first step, the cyanate resin is heated to 115-120°C and melted to a uniform liquid.

[0047] In the second step, the thermoplastic resin is heated to 105-110°C to melt, and then mixed with epoxy resin, fully stirred evenly to obtain a toughening component;

[0048] The third step is to mix the molten cyanate resin and the toughen...

Embodiment 3

[0052] Proportioning (number of parts by mass):

[0053] Cyanate: bisphenol M type cyanate, 80 parts by weight;

[0054] Epoxy resin: aliphatic glycidyl ether epoxy resin, 5 parts by weight;

[0055] Thermoplastic resin: polyether ether ketone, 5 parts by weight, the molar ratio of cyanate functional group to terminal hydroxyl group is 25:1;

[0056] Foaming agent: 4'4-oxobisbenzenesulfonyl hydrazide, 0.25 parts by weight;

[0057] Catalyst solution: 0.5 parts by weight; bis-n-octyltin oxide is the main catalyst with a concentration of 0.8%; nonylphenol is an auxiliary catalyst with a concentration of 15%; the solvent is dichloromethane.

[0058] Preparation Process:

[0059] In the first step, the cyanate resin is heated to 115-120°C and melted to a uniform liquid.

[0060] In the second step, the thermoplastic resin is heated to 125-130°C to melt, and then mixed with epoxy resin, and fully stirred evenly to obtain a toughening component;

[0061] The third step is to mi...

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Abstract

The invention discloses micro-foaming low-dielectric cyanate ester resin and a preparation method thereof, and belongs to the technical field of materials, the micro-foaming low-dielectric cyanate ester resin comprises the following components in parts by mass: 75-95 parts of cyanate ester resin, 5-25 parts of epoxy resin, 5-20 parts of thermoplastic resin, 0.25-5 parts of foaming agent and 0.5-3 parts of catalyst, wherein the thermoplastic resin contains a terminal hydroxyl group, and the foaming agent is an azo monomer containing two formamide reaction groups. The micro-foaming low-dielectric cyanate ester resin has micron-scale pores, so that air is introduced into the resin to reduce interface loss, the resin has a relatively low dielectric constant and loss tangent, the dielectric property has small fluctuation along with frequency change, and meanwhile, the resin has relatively good thermal conductivity, and the mechanical property and dielectric property of the resin are balanced.

Description

technical field [0001] The invention relates to a microfoaming low-dielectric cyanate resin and a preparation method thereof, belonging to the field of material technology. Background technique [0002] Under the action of heat and catalyst, cyanate resin forms a highly cross-linked network structure, which has excellent dielectric properties, mechanical properties and heat resistance, and is widely used in the field of resin-based wave-transparent composite materials. With the development of new-generation antenna technology towards ultra-broadband, multi-band, high-transmission, etc., higher requirements are placed on the dielectric properties of wave-transparent materials for radar radomes. At present, the dielectric constant and dielectric loss tangent of ordinary cyanate resin are still high in the high frequency range, which is difficult to meet the application requirements of the new generation of antenna technology. [0003] A common way to improve the dielectric pr...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L79/04C08L63/00C08L63/02C08L61/16C08L71/00C08L71/12C08L81/06C08J9/10
CPCC08J9/0061C08J9/103C08J9/105C08J2379/04C08J2463/00C08J2463/02C08J2461/16C08J2471/00C08J2471/12C08J2481/06C08J2205/044C08J2203/18
Inventor 徐畅欧秋仁董大为陈哲明周子群
Owner AEROSPACE INST OF ADVANCED MATERIALS & PROCESSING TECH
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