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Adhesive sheet

A technology of adhesive sheets and adhesives, which is applied in the direction of adhesive types, hydrocarbon copolymer adhesives, adhesives, etc., and can solve problems such as insufficient fixation of the ground object, heavy peeling, and residual glue. , to achieve the effect of excellent fixation and low pollution

Active Publication Date: 2021-04-09
NITTO DENKO CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in the back grinding process of hard and brittle substrates, grinding is carried out under high load as described above, therefore, a large frictional resistance will be generated between the object to be ground (hard and brittle substrate) and the grindstone, and its As a result, the adhesive force of the adhesive sheet decreases due to frictional heat, and the object to be ground (hard and brittle substrate) cannot be sufficiently fixed.
On the other hand, when using a pressure-sensitive adhesive sheet that exhibits strong adhesion at high temperatures, there are problems such as heavy peeling, generation of adhesive residue, or the need to clean the object to be ground (hard and brittle substrate) contaminated by adhesive residue. )And other issues

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0129] Maleic acid modified styrene·ethylene·butylene·styrene block copolymer (a) (SEBS: styrene part / ethylene·butylene part (weight ratio) = 30 / 70, acid value: 10 (mg -CH 3 ONa / g), Asahi Kasei Chemical Co., Ltd., trade name "Tuftec M1913") 100 parts by weight, terpene phenolic tackifier resin (YASUHARA CHEMICAL CO., LTD., trade name "YS Polystar T80") 25 parts by weight , 3 parts by weight of an epoxy-based crosslinking agent (manufactured by Mitsubishi Gas Chemical Co., Ltd., trade name "TETRAD-C"), heat-expandable microspheres (manufactured by Matsumoto Yushi Pharmaceutical Co., Ltd., trade name "Matsumoto Microsphere F-50D"), foaming Initial temperature 120° C., average particle diameter 14 μm) 30 parts by weight, phosphate-based surfactant (manufactured by Toho Chemical Industry Co., Ltd., trade name “Phosphamol RL210”, molecular weight 422.57, chemical formula: C 22 h 47 o 5 P, carbon number of the alkyl group: 18) 3 parts by weight, and toluene as a solvent were mixe...

Embodiment 2～5

[0132] A pressure-sensitive adhesive sheet was obtained in the same manner as in Example 1 except that the added amounts of the tackifier resin and thermally expandable microspheres were the amounts shown in Table 1. The obtained pressure-sensitive adhesive sheet was subjected to the above evaluations (1) to (4). The results are shown in Table 1.

Embodiment 6

[0134] Instead of the maleic acid-modified styrene-ethylene-butylene-styrene block copolymer (a), a maleic acid-modified styrene with a styrene moiety / ethylene-butene moiety (weight ratio) of 20 / 80 was used ·Ethylene·butylene·styrene block copolymer (b) (acid value: 10(mg-CH 3ONa / g), manufactured by Asahi Kasei Chemical Co., Ltd., trade name "Tuftec M1943"), the addition amount of the tackifying resin and thermally expandable microspheres is set to the amount shown in Table 1, except that, the same operation as in Example 1 , to obtain an adhesive sheet. The obtained pressure-sensitive adhesive sheet was subjected to the above evaluations (1) to (4). The results are shown in Table 1.

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Abstract

Provided is an adhesive sheet that can be used to grind a hard and brittle substrate during back-grinding of the hard and brittle substrate and that makes it possible to reduce pollution and achieve excellent grinding precision, productivity, and fixation. This adhesive sheet comprises an adhesive layer. The adhesive layer includes: an adhesive that includes a base polymer; and a foaming agent that has a foaming temperature of at least 90 DEG C. The shear adhesive strength of the adhesive sheet when a silicon chip has been stuck to an adhesive surface thereof is at least 1.0 MPa at 25 DEG C and at least 0.2 MPa at 80 DEG C.

Description

technical field [0001] The present invention relates to an adhesive sheet. Background technique [0002] In recent years, substrates for white LEDs, sapphire substrates used in electronic devices such as SOS (Silicon on Sapphire), and / or cover glasses for smartphones and / or watches have been produced with high precision, and are expected to be used as substrates for power semiconductors. Silicon carbide substrates, gallium nitride substrates, gallium oxide substrates, diamond substrates, silicon nitride substrates used as heat dissipation circuit board materials for power semiconductors, aluminum oxynitride substrates, crystal oscillators of glass and / or lenses, etc. Demand for hard and brittle ceramic substrates such as quartz substrates (hereinafter collectively referred to as hard and brittle substrates) has increased. As a representative example of the process of manufacturing such a substrate, a back grinding process of grinding the back surface of the substrate (wafer...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J7/38C09J11/06C09J11/08C09J125/08C09J201/00H01L21/304
CPCC09J7/38C09J201/00H01L21/304C09J153/025C08J2207/02C08J2300/22C08J2300/26C08J9/32C08J2203/22C08J2353/02C09J7/10C09J2400/24C09J2203/326C09J2301/412C09J2453/00C09J2301/124H01L21/6836H01L2221/68327H01L2221/6834H01L2221/68318H01L2221/68381C09J2301/502C09J11/06C09J11/08C09J125/10C09J153/02
Inventor 上野周作由藤拓三平山高正
Owner NITTO DENKO CORP
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