A kind of tin plating electroplating solution for reducing impurity content of coating layer and preparation method thereof
A technology of impurity content and electroplating solution is applied in the field of tin plating electroplating solution for reducing impurity content of the coating layer and its preparation field, which can solve the problems of coating layer inclusion, surface oxidation, affecting the quality of the coating layer, etc., and achieves improved solderability, uniform thickness and suitable for Sexually wide effect
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Embodiment 1
[0026] Example 1. Preparation of Quaternized Polyhydroxy Gemini Surfactant
[0027] Take 0.22mol N,N-dimethyldodecyl tertiary amine, add 0.1mol 1,3-dibromopropane and 20ml absolute ethanol, reflux under stirring for 72h, remove the solvent by rotary evaporation, and wash with ether for 3 times to remove Excessive N,N-dimethyldodecyl tertiary amine is filtered, and the filter cake is recrystallized with ethanol / ethyl acetate mixture to obtain; wherein, the volume ratio of ethanol to ethyl acetate in the ethanol / ethyl acetate mixture is 0.5:2.
Embodiment 2~4
[0028] Examples 2-4 Tin plating solution (calculated by 1L deionized water)
[0029]
[0030] Preparation:
[0031] Add deionized water to the electroplating tank, add methanesulfonic acid while stirring, continue to add stannous methanesulfonate under stirring, and after stirring evenly, add benzoic acid and quaternized polyhydroxy Gemini surfactant in sequence , resorcinol, glutaraldehyde and gluconolactone, stir evenly, that is, get.
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