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A kind of tin plating electroplating solution for reducing impurity content of coating layer and preparation method thereof

A technology of impurity content and electroplating solution is applied in the field of tin plating electroplating solution for reducing impurity content of the coating layer and its preparation field, which can solve the problems of coating layer inclusion, surface oxidation, affecting the quality of the coating layer, etc., and achieves improved solderability, uniform thickness and suitable for Sexually wide effect

Active Publication Date: 2022-07-08
新机金属(深圳)有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, these pretreatment methods lead to the dissolution of many impurities such as nickel ions and chromium ions and the deposition on the surface of the cathode during the electroplating process.
The deposition of these impurities on the surface of the cathode causes the inclusion of the coating. The coating may change the surface oxidation state due to the inclusion, making the surface more easily oxidized, or changing the size and orientation of the crystal grains of the deposited layer, which ultimately affects the quality of the coating.

Method used

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  • A kind of tin plating electroplating solution for reducing impurity content of coating layer and preparation method thereof
  • A kind of tin plating electroplating solution for reducing impurity content of coating layer and preparation method thereof
  • A kind of tin plating electroplating solution for reducing impurity content of coating layer and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0026] Example 1. Preparation of Quaternized Polyhydroxy Gemini Surfactant

[0027] Take 0.22mol N,N-dimethyldodecyl tertiary amine, add 0.1mol 1,3-dibromopropane and 20ml absolute ethanol, reflux under stirring for 72h, remove the solvent by rotary evaporation, and wash with ether for 3 times to remove Excessive N,N-dimethyldodecyl tertiary amine is filtered, and the filter cake is recrystallized with ethanol / ethyl acetate mixture to obtain; wherein, the volume ratio of ethanol to ethyl acetate in the ethanol / ethyl acetate mixture is 0.5:2.

Embodiment 2~4

[0028] Examples 2-4 Tin plating solution (calculated by 1L deionized water)

[0029]

[0030] Preparation:

[0031] Add deionized water to the electroplating tank, add methanesulfonic acid while stirring, continue to add stannous methanesulfonate under stirring, and after stirring evenly, add benzoic acid and quaternized polyhydroxy Gemini surfactant in sequence , resorcinol, glutaraldehyde and gluconolactone, stir evenly, that is, get.

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Abstract

The invention belongs to the technical field of electroplating, and in particular relates to a tin-plating electroplating solution for reducing the impurity content of a coating layer and a preparation method thereof. Deionized water is used as a solvent, which comprises the following components: 0.1-0.5 mol of stannous methanesulfonate / L; Methanesulfonic acid 0.3~1mol / L; Benzoic acid 10~50g / L; Quaternized polyhydroxy Gemini surfactant 1~5g / L; Antioxidant 1~6g / L; Brightener 1~5g / L L; complexing agent 1~10g / L. The tin-plating electroplating solution provided by the invention is added with quaternized polyhydroxy Gemini surfactant and benzoic acid, which can form a tight covering film layer on the surface of the cathode, thereby effectively inhibiting the reduction and deposition of impurity metal ions on the surface of the cathode. The impurity content of the tin plating layer is reduced, the plating layer is more uniform, dense and detailed, the thickness is more uniform, and the solderability is improved.

Description

technical field [0001] The invention belongs to the technical field of electroplating. More specifically, it relates to a tin-plating electroplating solution for reducing the impurity content of the coating layer and a preparation method thereof. Background technique [0002] Aluminum alloy is the most widely used non-ferrous metal structural material in the industry, and has been widely used in aviation, aerospace, automobile, machinery manufacturing, shipbuilding and chemical industries. With the rapid development of the industrial economy, the demand for aluminum alloy welded structural parts is increasing, and the research on the weldability of aluminum alloys has also deepened. Tin plating on aluminum and aluminum alloys can improve the solderability of aluminum and aluminum alloys, but it cannot be directly tinned on aluminum surfaces, and requires a series of pretreatments, such as electroless nickel plating, electroplating hard chromium, and other metal coatings, T...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C25D3/32
CPCC25D3/32
Inventor 蔡国隆
Owner 新机金属(深圳)有限公司