Curing agent and copper-clad plate

A technology of curing agent and copper clad laminate, which is applied in the direction of printed circuit components, etc., can solve the problems of poor heat resistance, high price, poor interlayer bonding force, etc., and achieve the effect of low cost and easy availability of raw materials

Pending Publication Date: 2021-06-15
建滔覆铜板(深圳)有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] In the early stage, many manufacturers were developing halogen-free flame-retardant copper-clad laminates, and they mostly used the method of adding phosphorus compounds to epoxy resins. However, these patented inventions encountered a common problem: the heat resistance and moisture resistance of the produced copper-clad laminates. Low resistance and poor interlayer bonding, low tracking index and high dielectric loss
In order to improve the flame retardancy without reducing the heat resistance of the board, many manufacturers currently add semi-dehydrated aluminum hydroxide to synergize the flame retardancy. In order to improve the tracking index, some manufacturers use expensive hydrogenated bisphenol A epoxy, alicyclic ring Oxygen and hydrocarbon resins make the cost of the board higher than the market demand and it is difficult to promote
[0004] Early halogen-free copper-clad laminates had problems of poor heat resistance and poor processing performance. Later, technological progress improved the heat resistance and processing problems. However, with the continuous improvement of terminal demand, the cost still needs to be reached when the processability and reliability are satisfied. CTI600V and lower dielectric loss (5G frequency Df<0.01)

Method used

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  • Curing agent and copper-clad plate
  • Curing agent and copper-clad plate
  • Curing agent and copper-clad plate

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0022] Step 1: Preparation of hydroxylphenol

[0023] Raw material ratio:

[0024] Phenol: a double-toroidal olefin = 1.3: 1 (Mol ratio); olefin is propylene.

[0025] The addition of phenol is selected from the four-mouth flask equipped with a stirrer, a thermometer, a constant voltage drip funnel, and a condenser, and a dioble olefin uses a dropwise method, and the drip speed is 50 g / min.

[0026] Catalyst: Cation exchange resin, catalytic reaction temperature 95 ° C and 100 ° C, reaction time, and purified to obtain a hydrohydrohydrothyol intermediate.

[0027] Step 2: Preparation of long chain carbon-based curing agent:

[0028] The resulting hydroxophenol intermediate 0.25 mol is melted in four flasks equipped with a stirrer, a thermometer, a constant pressure drip funnel and a condenser, and 0.005 mol catalyst acetate, and zinc. The reaction was reacted in 4 to 6 hours under 90 to 100 ° C, toluene, fractionated dehydration layer, dense benzene in 240 to 260 ° C, and the re...

Embodiment 2

[0042] Generally with Example 1, different places in, in step 1, phenol: a di-bond olefin = 1.1: 1 (Mol ratio); olefin is diusobutylene.

[0043] In step 2, the molar ratio of the hydroxophenol intermediate, formaldehyde, and the first catalyst is 0.25: 0.2: 0.006.

Embodiment 3

[0045] In general, in the first embodiment, in terms of, in step 1, phenol: a di-bond olefin = 1.4: 1 (mol ratio); olefin is cyclopentene.

[0046] In step 2, the molar ratio of the hydrocarbylpol intermediate, formaldehyde, and the first catalyst is 0.25: 0.4: 0.004.

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PUM

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Abstract

The invention belongs to the field of new materials, and discloses a curing agent. The curing agent is obtained by reacting a hydrocarbon-based phenol intermediate and formaldehyde in the presence of a first catalyst, wherein the hydrocarbon-based phenol intermediate is obtained by reacting phenol and double-bond-containing olefin in the presence of a second catalyst, and the molar ratio of phenol to double-bond-containing olefin is (1.1-1.5): 1. The curing agent is low in cost. The invention further discloses a copper-clad plate.

Description

Technical field [0001] The present invention relates to the field of new materials, and more particularly to a curing agent and a copper copper. Background technique [0002] In the early stage, many manufacturers were developing a halogen-free flame retardant copper plate, which was used in the epoxy resin to add phosphorus compounds, but these patent inventions have encountered a common problem: the heat resistance, moisture resistance of the copper produced plate Sexual and low interlayer binding force, low-resistance, low-resistance, and high dielectric loss. Some process routes that use a large amount of aluminum hydroxide are the main flame retardant to solve the problem of halogen-free copper flame retardancy, but there is a large negative impact on the heat resistance and physical properties of the board. [0003] Thereafter, a resin synthesis process technique directly reacted with the phosphorus compound occurs, and the epoxy resin is selected from the group consisting ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G8/08C08G8/12C08G59/40C08L63/00H05K1/02
CPCC08G8/08C08G8/12C08G59/4007C08L63/00H05K1/02C08L2203/20C08L2201/08
Inventor 张志勤
Owner 建滔覆铜板(深圳)有限公司
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