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Low-surface-energy fluorosilicone additive for epoxy resin and preparation method of low-surface-energy fluorosilicone additive

A technology for epoxy resin with low surface energy, applied in epoxy resin coatings, coatings, etc., can solve the problems of not being widely promoted, unable to participate in the curing reaction of epoxy resin, only applicable, etc., to achieve excellent migration characteristics, excellent Hydrophobic and oleophobic properties and reactive properties, the effect of reducing dosage

Active Publication Date: 2021-06-22
无锡龙驰氟硅新材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Traditional modification methods generally introduce silicone or organic fluorine alone, and cannot combine the respective advantages of silicone and organic fluorine; moreover, most of the low surface energy resins used in traditional modification methods cannot participate in the curing reaction of epoxy resin, resulting in Additives are easy to precipitate; in addition, traditional modification methods have great limitations and are only suitable for specific coating systems and cannot be widely promoted

Method used

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  • Low-surface-energy fluorosilicone additive for epoxy resin and preparation method of low-surface-energy fluorosilicone additive
  • Low-surface-energy fluorosilicone additive for epoxy resin and preparation method of low-surface-energy fluorosilicone additive

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0025] Hydrolysis: Add a mixture of 1mol dimethyldichlorosilane, 3mol (1H, 1H, 2H, 2H-perfluorohexyl) methyldichlorosilane and 1212g of toluene dropwise while stirring, and control The reaction temperature is 20°C. After the dropwise addition, continue to stir for 2 hours, separate and discharge the lower layer of acidic water, wash the organic layer with 5% sodium carbonate solution until neutral, then heat up and distill to recover toluene to obtain the hydrolyzed material.

[0026] Catalytic cracking: transfer the hydrolyzed material to a cracking kettle, then add potassium hydroxide powder with a mass of 0.5% of the hydrolyzed material, stir and turn on the vacuum pump, raise the temperature to 150°C, and collect the obtained cracked material.

[0027] Polymerization: Add 500g of cracking material and 1000g of high hydrogen-containing silicone oil (hydrogen content 1.6%) into the polymerization kettle, stir evenly, add 75g of concentrated sulfuric acid, heat up to 35°C and ...

Embodiment 2

[0030] It is basically the same as Example 1, the difference is: in the hydrolysis step, the fluorocarbonyl methyl dichlorosilane used is (1H, 1H, 2H, 2H-perfluorooctyl) methyl dichlorosilane, the amount of toluene It is 1512g.

Embodiment 3

[0032] It is basically the same as Example 1, the difference is: in the hydrolysis step, the fluoroalkylmethyldichlorosilane used is (1H, 1H, 2H, 2H-perfluorodecyl)methyldichlorosilane, the amount of toluene It is 2112g.

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Abstract

The invention discloses a low-surface-energy fluorosilicone additive for epoxy resin and a preparation method of the low-surface-energy fluorosilicone additive. The preparation method comprises four steps of hydrolysis, catalytic cracking, polymerization and hydrosilylation. The main chain of the low-surface-energy fluorosilicone additive for epoxy resin prepared by the invention is composed of a flexible silicon-oxygen chain, so that excellent migration characteristic is achieved, automatic migration to the surface of a coating can be realized without influencing the adhesiveness of the coating, and the dosage is reduced; the side group contains a long-chain fluorocarbon group and an epoxy group, can provide excellent hydrophobic and oleophobic properties and reaction characteristics, can be bonded into an epoxy resin cross-linked network, and is prevented from being separated out in the later use process. In addition, the additive can be applied to almost all epoxy resin systems, including UV photocuring systems.

Description

technical field [0001] The invention relates to the field of fluorosilicon materials, in particular to a low surface energy fluorosilicon additive for epoxy resin and a preparation method thereof. Background technique [0002] Epoxy resin is a type of polymer prepolymer containing at least two epoxy groups in its molecular structure. Under the action of a curing agent or a catalyst, a crosslinked network can be obtained through the ring-opening reaction of epoxy groups. It is one of the thermosetting resins. important one. By matching the types of epoxy resin and curing agent, coatings with different properties can be obtained, so epoxy resin is widely used in the field of coatings. For example, various surface protective coatings formulated with epoxy resin as the base polymer can be used for anti-rust of steel, anti-corrosion of wood, anti-plankton of hull, anti-wear of pavement, etc. However, the surface energy of epoxy resin coating is high. Although it can effectively...

Claims

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Application Information

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IPC IPC(8): C08G77/24C08G77/38C09D163/00C09D7/65
CPCC08G77/24C08G77/38C09D163/00C09D7/65C08L83/08
Inventor 王宇郑晓强白永平
Owner 无锡龙驰氟硅新材料有限公司