Method for preparing ultra-light thermal insulation material by using foam dispersed fly ash fibers
A technology of fly ash fiber and thermal insulation materials, which is applied in the field of foam dispersion technology, and can solve problems such as unsuitability for light and ultra-light boards, defects, and poor density consistency
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment 1
[0022] Example 1 detection: thermal conductivity 0.038W / (m K), apparent density 0.08g / cm 3 .
specific Embodiment 2
[0024]1. Precursor preparation: add 50kg of water, 25kg of cement clinker by mass, 1.5kg of ultra-fine fly ash fiber by mass, and 0.025kg of gypsum into the fiber foam dispersing device, and stir at low speed for 10 minutes. 2. Fiber foam dispersion Preparation: Add 2.25kg of S35 and diethanolamine mixed foaming agent 40 times diluent to the above precursor slurry, turn on the high-speed gear and stir for 2 minutes, then turn on the fly ash fiber feeder, feed while stirring, and gradually add a total of 75kg Fly ash fiber, continue stirring to reach 1m 3 3. Forming: Pour the above-mentioned foam slurry that has reached the volume into a mold with a tray at the bottom and detachable four sides, and let it stand for 1.5 hours to open the mold and remove the four sides. 4. Curing: Put the above tray and the formed materials in the room Curing in the environment for 28 days. 5. Drying: Cut some materials into an oven at 55°C to dry to constant weight.
Embodiment 2
[0025] Example 2 detection: thermal conductivity 0.042W / (m K), apparent density 0.1g / cm 3 .
PUM
Property | Measurement | Unit |
---|---|---|
Thermal conductivity | aaaaa | aaaaa |
Apparent density | aaaaa | aaaaa |
Thermal conductivity | aaaaa | aaaaa |
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com