A polyimide adhesive film with excellent comprehensive properties and its preparation method and application

A technology of polyimide adhesive film and comprehensive performance, applied in the field of polyimide, can solve the problems of low dielectric constant, low dielectric loss, etc. force effect

Active Publication Date: 2022-06-21
INST OF CHEM CHINESE ACAD OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] In view of the above analysis, the present invention aims to provide a polyimide film with excellent comprehensive properties and its preparation method and application, in order to solve the problems of existing polyimide films with excellent heat resistance, good adhesion, etc. Performance, low dielectric constant and low dielectric loss at high frequency are difficult to achieve at the same time

Method used

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  • A polyimide adhesive film with excellent comprehensive properties and its preparation method and application
  • A polyimide adhesive film with excellent comprehensive properties and its preparation method and application
  • A polyimide adhesive film with excellent comprehensive properties and its preparation method and application

Examples

Experimental program
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Effect test

Embodiment 1

[0052] In a three-necked flask equipped with mechanical stirring, water separator, nitrogen conduit and thermometer, add 38.54 g (0.09 mol) of 1,4-bis(2-trifluoromethyl-4-aminophenoxy)benzene (6FAPB) , 8.00 g (0.01 mol) of bis(3-aminopropyl) polydimethylsiloxane (PDMS) and 200 g of N,N-dimethylacetamide (DMAc), stirred at room temperature under nitrogen protection until completely dissolved A homogeneous solution was obtained. After cooling the above reaction system to 5°C, add 21.81 g (0.1 mol) 1,2,4,5-pyromellitic anhydride (PMDA) and 187 g DMAc, stir for 3 hours until completely dissolved, and continue stirring at room temperature After 14 hours of reaction, a polyamic acid solution with a solid content of 15 wt.% was obtained. After filtration and vacuum defoaming, the obtained polyamic acid solution was coated on a polytetrafluoroethylene plate with a smooth surface, and most of the solvent was removed by thermal drying at 60°C for 1.5 hours, and then peeled off from the...

Embodiment 2

[0054] In a three-necked flask equipped with mechanical stirring, water separator, nitrogen conduit and thermometer, add 50.81 g (0.098 mol) of 2,2-bis[4-(4-aminophenoxybenzene)]hexafluoropropane (HFBAPP) , 0.49 g (0.002 mol) of 1,3-bis(3-aminopropyl)-1,1,3,3-tetramethyldisiloxane (SiDA) and N,N-dimethylacetamide (DMAc ) 249 g, stirred at room temperature under nitrogen protection until completely dissolved to obtain a homogeneous solution. After cooling the above reaction system to 0°C, add 21.81 g (0.1 mol) 1,2,4,5-pyromellitic anhydride (PMDA) and 200 g DMAc, stir for 2 hours until completely dissolved, and continue stirring at room temperature After 11 hours of reaction, a polyamic acid solution with a solid content of 14 wt.% was obtained. After filtering and vacuum defoaming, the obtained polyamic acid solution was coated on a glass plate with a smooth surface, and most of the solvent was removed by heating at 80°C / 1 hour, and then peeled off from the glass plate, and t...

Embodiment 3

[0056] In a three-necked flask equipped with mechanical stirring, water separator, nitrogen conduit and thermometer, add 49.25 g (0.095 mol) of 2,2-bis[4-(4-aminophenoxybenzene)]hexafluoropropane (HFBAPP) , 1.24 g (0.005 mol) of 1,3-bis(3-aminopropyl)-1,1,3,3-tetramethyldisiloxane (SiDA) and N,N-dimethylacetamide (DMAc ) 250 g, stirred at room temperature under nitrogen protection until completely dissolved to obtain a homogeneous solution. After cooling the above reaction system to 5°C, add 21.81 g (0.1 mol) 1,2,4,5-pyromellitic anhydride (PMDA) and 129 g DMAc, stir for 2 hours until completely dissolved, and continue stirring at room temperature After 10 hours of reaction, a polyamic acid solution with a solid content of 16 wt.% was obtained. After filtering and vacuum defoaming, the obtained polyamic acid solution was coated on a glass plate with a smooth surface, and most of the solvent was removed by thermal drying at 70°C for 1.5 hours, and then peeled off from the glas...

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Abstract

The invention relates to a polyimide film with excellent comprehensive performance and its preparation method and application, which belongs to the technical field of polyimide and solves the problem of the excellent heat resistance and good adhesion of the existing polyimide film. Performance, low dielectric constant at high frequency and low dielectric loss are difficult to be compatible. The polyimide film is prepared from aromatic dianhydride, aromatic diamine containing diphenyl ether structure and diamine containing siloxane structure. The polyimide adhesive film has excellent heat resistance, high-frequency low-dielectric performance and good adhesion performance, the glass transition temperature is greater than 330 ° C, the dielectric constant at 10 GHz is less than 3, and the dielectric loss value is 0.003 Between ‑0.006, the peel strength after thermocompression bonding with copper foil is greater than 10N / cm, which can meet the application requirements of interlayer bonding and insulation in the manufacture of flexible printed circuit boards and multilayer circuit board laminated wiring processing, and can be widely used It is used in high-frequency flexible printed circuit boards, high-frequency film antennas and other fields.

Description

technical field [0001] The invention relates to the technical field of polyimide, in particular to a polyimide adhesive film with excellent comprehensive properties and a preparation method and application thereof, and more particularly to a polyimide film with excellent heat resistance, high-frequency dielectric properties and good A polyimide adhesive film with adhesive properties and a preparation method and application thereof. Background technique [0002] Polyimide material has been widely used as an indispensable high-performance insulating material in the manufacture of flexible printed circuit boards in the field of microelectronics due to its excellent heat resistance and insulating properties. In recent years, microelectronic products tend to be miniaturized, thin, flexible, integrated and multifunctional, and electronic devices are increasingly manufactured by means of high-density multi-layer wiring based on flexible printed circuit boards. With the development...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08G73/10C09J179/08C09J7/10
CPCC08G73/1071C08G73/106C08G73/1039C08G73/1007C09J179/08C09J7/10C09J2479/08C09J2203/326
Inventor 范琳周永标刘仪莫松翟磊何民辉
Owner INST OF CHEM CHINESE ACAD OF SCI
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