Titanium anode plate for electrolytic copper foil and back treatment process
A technology of titanium anode plate and electrolytic copper foil, applied in electrolysis process, metal material coating process, electroforming, etc., can solve the problems of high local current density of titanium anode plate, poor copper foil uniformity, short service life, etc. Achieve the effect of reducing energy consumption, uniform speed and improving service life
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Embodiment 1
[0038] Embodiment 1 (no conductive coating)
[0039] A back coating process for producing titanium anode plates for electrolytic copper foil
[0040] Specifically include the following steps:
[0041] (1) Select a titanium base material with a thickness of 1 mm, a smooth surface, good flatness, and no cracks, and perform annealing and leveling treatment on the selected titanium base material. anode plate;
[0042] (2) The annealed titanium anode plate obtained in step (1) was pickled with 100g / L oxalic acid for 10 hours. The pickling process was carried out in a boiling state, and finally a layer of titanium hydride was formed on the surface of the titanium anode. , that is, to obtain the titanium anode plate after pickling;
[0043](3) Coating an aqueous solution of an iridium compound and a tantalum compound with a concentration ratio of 2:1 on the back of the titanium anode plate obtained in step (2), with a coating thickness of 5 μm, to obtain a coated titanium anode pl...
Embodiment 2
[0048] Embodiment 2 (copper conductive coating)
[0049] A backside treatment process for producing titanium anode plates for electrolytic copper foil, specifically comprising the following steps:
[0050] (1) Select a titanium base material with a thickness of 1 mm, a smooth surface, good flatness, and no cracks, and perform annealing and leveling treatment on the selected titanium base material. anode plate;
[0051] (2) One side of the annealed titanium anode plate obtained in step (1) is used as the back side, and the back side of the titanium anode plate is polished, and the back surface roughness of the polished titanium anode plate is 8 μm;
[0052] (3) The annealed titanium anode plate obtained in step (2) is pickled with oxalic acid of 100g / L for 10 hours at a pickling temperature of 90°C. The pickling process is carried out in a boiling state. A layer of titanium hydride is formed on the surface of the titanium anode, that is, a pickled titanium anode plate is obta...
Embodiment 3
[0060] Embodiment 3 (copper conductive coating)
[0061] It is substantially the same as in Example 2, except that the thickness of the electroplated copper layer is 22 μm.
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