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Titanium anode plate for electrolytic copper foil and back treatment process

A technology of titanium anode plate and electrolytic copper foil, applied in electrolysis process, metal material coating process, electroforming, etc., can solve the problems of high local current density of titanium anode plate, poor copper foil uniformity, short service life, etc. Achieve the effect of reducing energy consumption, uniform speed and improving service life

Active Publication Date: 2022-05-03
建滔(连州)铜箔有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] Based on the problems and deficiencies in the prior art, the present invention aims to solve the problems of high local current density, large contact resistance, waste of electric energy, short service life and poor uniformity of the copper foil in the prior art. And other issues

Method used

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  • Titanium anode plate for electrolytic copper foil and back treatment process
  • Titanium anode plate for electrolytic copper foil and back treatment process

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0038] Embodiment 1 (no conductive coating)

[0039] A back coating process for producing titanium anode plates for electrolytic copper foil

[0040] Specifically include the following steps:

[0041] (1) Select a titanium base material with a thickness of 1 mm, a smooth surface, good flatness, and no cracks, and perform annealing and leveling treatment on the selected titanium base material. anode plate;

[0042] (2) The annealed titanium anode plate obtained in step (1) was pickled with 100g / L oxalic acid for 10 hours. The pickling process was carried out in a boiling state, and finally a layer of titanium hydride was formed on the surface of the titanium anode. , that is, to obtain the titanium anode plate after pickling;

[0043](3) Coating an aqueous solution of an iridium compound and a tantalum compound with a concentration ratio of 2:1 on the back of the titanium anode plate obtained in step (2), with a coating thickness of 5 μm, to obtain a coated titanium anode pl...

Embodiment 2

[0048] Embodiment 2 (copper conductive coating)

[0049] A backside treatment process for producing titanium anode plates for electrolytic copper foil, specifically comprising the following steps:

[0050] (1) Select a titanium base material with a thickness of 1 mm, a smooth surface, good flatness, and no cracks, and perform annealing and leveling treatment on the selected titanium base material. anode plate;

[0051] (2) One side of the annealed titanium anode plate obtained in step (1) is used as the back side, and the back side of the titanium anode plate is polished, and the back surface roughness of the polished titanium anode plate is 8 μm;

[0052] (3) The annealed titanium anode plate obtained in step (2) is pickled with oxalic acid of 100g / L for 10 hours at a pickling temperature of 90°C. The pickling process is carried out in a boiling state. A layer of titanium hydride is formed on the surface of the titanium anode, that is, a pickled titanium anode plate is obta...

Embodiment 3

[0060] Embodiment 3 (copper conductive coating)

[0061] It is substantially the same as in Example 2, except that the thickness of the electroplated copper layer is 22 μm.

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Abstract

The invention belongs to the technical field of electrolytic copper foil, and discloses a titanium anode plate for electrolytic copper foil, the back of the titanium anode plate has at least two layers of sintered coating; the coating is composed of iridium compound and tantalum compound and sintered Obtained; wherein the mass ratio of iridium compound and tantalum compound is 1‑3:1. The invention also discloses the back treatment process of the titanium anode plate used for the electrolytic copper foil. The invention aims to solve the problems of high local current density, high contact resistance, waste of electric energy, short service life and poor uniformity of copper foil in the prior art of the titanium anode plate used for electrolytic copper foil.

Description

technical field [0001] The invention belongs to the technical field of electrolytic copper foil, and in particular relates to a titanium anode plate for electrolytic copper foil and a back treatment process. Background technique [0002] Titanium anode, also known as titanium-based metal oxide coating anode, is based on metal titanium and coated with noble metal materials on metal titanium, so that metal titanium has better electrical conductivity and electrocatalytic reactivity. According to the classification of the gas released from the anode in the electrochemical reaction, it is divided into chlorine analysis anode and oxygen analysis anode. The chloride electrolyte system uses the chlorine analysis anode, and the sulfate, nitrate and other electrolyte systems use the oxygen analysis anode. [0003] In the past 30 years, the use of iridium dioxide as the surface coating of titanium anodes has been developed in many fields, such as: copper recovery from etching solutions...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C25D1/04C23C18/12C23C18/04C23C28/00
CPCC25D1/04C23C18/1216C23C18/04C23C18/1225C23C28/32C23C28/3455
Inventor 林家宝
Owner 建滔(连州)铜箔有限公司