Avalanche diode based on transverse structure and preparation method thereof
A horizontal structure and diode technology, applied in the field of microelectronics, can solve the problems that avalanche diodes cannot exert high-frequency performance and limited application scenarios, and achieve the effect of increasing the working frequency and increasing the application range
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Embodiment 1
[0014] See figure 1 , figure 1 It is a schematic diagram of an avalanche diode structure based on a lateral structure provided by an embodiment of the present invention, and the diode includes: a substrate layer 1, an N-polar GaN layer 2, an n-type Al x Ga 1-x N barrier layer 3 , Schottky contact electrode 4 and ohmic contact electrode 5 .
[0015] The diode of the present invention is a high electron mobility transistor with low ohmic contact resistance. It should be noted that the Schottky contact electrode is used as an anode, and the ohmic contact electrode is used as a cathode.
[0016] Optionally, the N-polarity GaN layer 2 is located above the substrate layer 1 .
[0017] Optionally, the n-type Al x Ga 1-x The N barrier layer 3 is located above the N polarity GaN layer 2 .
[0018] Optionally, the N-polar GaN layer 2 and the n-type Al x Ga 1-x N barrier layer 3 constitutes Al x Ga 1-x N / GaN heterojunction, the Al x Ga 1-x Both sides of the N / GaN heterojunct...
Embodiment 2
[0025] See figure 2 , figure 2 It is a schematic flow chart of a method for preparing an avalanche diode based on a lateral structure provided by an embodiment of the present invention, and the method includes:
[0026] Step 1: grow an N-polar GaN layer based on the substrate layer according to the first growth parameter, wherein the first growth parameter includes: triethylgallium flow parameter, first nitrogen gas flow parameter, first growth temperature parameter, first A growth pressure parameter and a first growth time parameter.
[0027] In the present invention, the N-polar GaN layer and the n-type Al x Ga 1-x For the growth of the N barrier layer, the preset reaction chamber is selected by those skilled in the art according to business needs, which is not specifically limited in the present invention. In the present invention, the preset reaction chamber is exemplified by a MOCVD (Metal-Organic Chemical Vapor Deposition, Metal-Organic Chemical Vapor Deposition) r...
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Abstract
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