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Ultraviolet curing heat-conducting adhesive tape, and preparation method and application thereof

A UV-light and light-curing resin technology, which is applied in the direction of adhesives, amide/imide polymer adhesives, film/sheet adhesives, etc., can solve problems such as capacity limitations and reduce the impact of thermal conductivity , Improve the effect of reducing expenditure and saving manual lamination process

Active Publication Date: 2021-11-19
矽时代材料科技股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the use of this kind of tape can only be manually pasted, which has certain limitations in terms of production capacity.

Method used

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  • Ultraviolet curing heat-conducting adhesive tape, and preparation method and application thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0030] This embodiment provides a UV-curable thermally conductive tape, the UV-curable adhesive includes the following components in parts by weight: 5 parts of photocurable resin, 10 parts of polyacrylate, 70 parts of filler, 8 parts of acrylate active monomer, 5 parts of photoinitiator, 1 part of coupling agent, 1 part of leveling agent.

[0031] Wherein, the photocurable resin is 5 parts of self-synthesized urethane acrylate; 10 parts of the polyacrylate; the filler is: 40 parts of aluminum oxide (3000 mesh), 30 parts of aluminum hydroxide (600 mesh); The acrylate reactive monomer is made up of the following components by weight: 3 parts of isobornyl acrylate, 5 parts of isooctyl acrylate; the leveling agent is 1 part of acrylate leveling agent; the coupling agent is 1 part of KH550 coupling agent; The photoinitiator is made up of the following components by weight: 1 part of 2-phenylbenzyl-2-dimethylamine-1-(4-morpholine benzylphenyl) butanone and 4 parts of 1-hydroxy-cyc...

Embodiment 2

[0043] This embodiment provides a UV curable thermally conductive adhesive tape, which includes the following components in parts by weight: 10 parts of photocurable resin, 5 parts of polyacrylate, 75 parts of filler, 5 parts of acrylate active monomer part, 3.5 parts of photoinitiator, 1 part of coupling agent, and 0.5 part of leveling agent.

[0044] Wherein, the photocurable resin is 10 parts of self-synthesized urethane acrylate; 5 parts of the polyacrylate; the filler is: 60 parts of alumina (3000 mesh), 15 parts of hexagonal boron nitride (3 microns); The acrylate reactive monomer is composed of the following components by weight: 1 part of isobornyl acrylate, 2.5 parts of lauryl acrylate, 1.5 parts of N,N-dimethylacrylamide; the leveling agent is modified acrylic acid 0.5 part of ester leveling agent; the coupling agent is 1 part of KH792 coupling agent; the photoinitiator is composed of the following components by weight: 1.5 parts of benzoin dimethyl ketal and 2 parts...

Embodiment 3

[0047] This embodiment provides a UV-curable thermally conductive adhesive tape, which includes the following components in parts by weight: 15 parts of photocurable resin, 8 parts of polyacrylate, 60 parts of filler, and 10 parts of acrylate active monomer. parts, 4.7 parts of photoinitiator, 2 parts of coupling agent, and 0.3 parts of leveling agent.

[0048] Wherein, the photocurable resin is 15 parts of self-synthesized urethane acrylate; 8 parts of the polyacrylate; the filler is: 55 parts of aluminum hydroxide (600 mesh), 5 parts of silicon carbide (1200 mesh); The acrylate active monomer is composed of the following components by weight: 2 parts of hydroxyethyl acrylate, 6 parts of butyl acrylate, 2 parts of trimethylolpropane trimethacrylate; the leveling agent is silicone fluid 0.3 parts of leveling agent; the coupling agent is 2 parts of KH570 coupling agent; the photoinitiator is made up of the following components by weight: 2-hydroxyl-2-methyl-1-phenyl-1-acetone 1...

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Abstract

The invention provides an ultraviolet curing heat-conducting adhesive tape, and a preparation method and application thereof. The ultraviolet curing heat-conducting adhesive tape is prepared from, by weight, 5 to 15 parts of light-cured resin, 5 to 10 parts of polyacrylate, 60 to 80 parts of a filler, 5 to 10 parts of an acrylate active monomer, 3 to 8 parts of a photoinitiator, 0.5 to 3 parts of a coupling agent and 0.3 to 1 part of a leveling agent. The invention also provides a preparation method of the heat-conducting adhesive tape. According to the heat-conducting adhesive tape, the manual laminating process of the heat-conducting adhesive tape can be omitted, automatic dispensing is achieved, and the production efficiency is improved.

Description

technical field [0001] The invention relates to an adhesive tape, in particular to a thermally conductive adhesive tape curable by ultraviolet light and a preparation method thereof, belonging to the technical field of thermally conductive adhesive tapes. Background technique [0002] With the development of large-scale integrated circuits and micro-encapsulation technology, the integration density of electronic components and equipment is getting higher and higher, and the volume is shrinking, so heat dissipation has become a prominent problem. Not only does the life of electronic components decrease significantly with the increase of operating temperature, but also, during use, excessive operating temperature will cause problems such as system crash or thermal deformation. [0003] The main function of using pressure-sensitive adhesive-based thermally conductive tape is to provide the bonding function while reducing the heat transfer resistance in the structural design, an...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J133/08C09J175/16C09J7/38C09J11/08C09J11/04
CPCC09J133/24C09J7/385C09J11/08C09J11/04C09J2203/326C09J2203/318C09J2301/416C08K2003/2227C08K2003/385C08L75/16C08K3/22C08K3/38C08K3/34
Inventor 黄山柯明新
Owner 矽时代材料科技股份有限公司
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