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Cyanide-free gold electroplating solution and application thereof, method for electroplating gold bump, gold bump and electronic component

A gold electroplating and plating solution technology, which is applied in the field of gold bumps, can solve problems such as difficulty in meeting semiconductor processing requirements, and achieve the effects of regular shape, high precipitation efficiency, and low roughness

Active Publication Date: 2021-12-24
SHENZHEN UNITED BLUEOCEAN TECH DEV +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] The purpose of the present invention is to overcome the problem that the hardness of gold bumps made by using cyanide-free gold plating technology after heat treatment is difficult to meet the requirements of semiconductor processing, provide cyanide-free electroplating gold plating solution and its application and electroplating method for making gold bumps and Gold bumps and electronic components

Method used

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  • Cyanide-free gold electroplating solution and application thereof, method for electroplating gold bump, gold bump and electronic component
  • Cyanide-free gold electroplating solution and application thereof, method for electroplating gold bump, gold bump and electronic component
  • Cyanide-free gold electroplating solution and application thereof, method for electroplating gold bump, gold bump and electronic component

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0062] In a 1L beaker, add 60g of sodium sulfite, 30g of sodium sulfate, 10g of hydroxyethylidene diphosphoric acid and 10g of disodium ethylenediamine tetraacetate, add 600mL of deionized water, and stir to dissolve completely. 8g of sodium gold sulfite aqueous solution and sodium arsenite solution with arsenic content of 0.01g, adding deionized water to adjust the volume of the plating solution to 1L and adjusting the pH value to 8.0 to obtain plating solution-1.

[0063] Heat the bath from -1 to 55°C. Platinum-titanium mesh was used as the anode for electroplating, the pre-gold-plated brass sheet was used as the cathode, the cathode area was 2×2cm, the current density was adjusted to 0.5ASD, and the electroplating was performed for 100 minutes to obtain a gold-plated piece.

[0064] The calculated precipitation efficiency after electroplating is 99%. After electroplating, the surface of the coating is smooth and uniform in color; the hardness of the coating is 147HV before ...

Embodiment 2

[0066] According to the method of Example 1, the difference is that "20g of hydroxyethylidene diphosphoric acid" is added to replace "10g of hydroxyethylidene diphosphoric acid", "gold sodium sulfite aqueous solution with a gold element content of 12g" is added to replace "gold element content 8g of gold sodium sulfite aqueous solution" and "sodium arsenite with 0.01g of arsenic content" replace "sodium arsenite solution with 0.01g of arsenic content", and the "pH value of the plating solution is 7.4" replaces "pH value of 8.0 ”, to obtain plating solution-2.

[0067] After electroplating, the surface of the coating is smooth and uniform in color, and the calculated precipitation efficiency is 99%. The hardness of the coating is 143HV before heat treatment, and the hardness of the coating after heat treatment is 101HV.

Embodiment 3

[0069] According to the method of Example 1, the difference is that "4g of aminotrimethylene phosphonic acid" is added to replace "10g of hydroxyethylidene diphosphoric acid" and "10g of disodium hydrogen phosphate" is added to replace "10g of ethylenediaminetetraacetic acid Disodium", "gold sodium sulfite aqueous solution with a gold element content of 12g" replaced "gold sodium sulfite aqueous solution with a gold element content of 8g" and "sodium arsenite with arsenic content of 0.2g" replaced "arsenic content of 0.01g Sodium arsenite solution", the "pH value of the plating solution is 8.5" is replaced by "pH value is 8.0", and the plating solution-3 is obtained.

[0070] After electroplating, the surface of the coating is smooth and uniform in color, and the calculated precipitation efficiency is 100%. The hardness of the coating is 144HV before heat treatment, and the hardness of the coating after heat treatment is 107HV.

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Abstract

The invention relates to the field of semiconductor gold bump preparation, and discloses a cyanide-free gold electroplating solution and an application thereof, a method for electroplating a gold bump, the gold bump and an electronic component. The electroplating solution comprises a gold source, conductive salt, a buffering agent, an additive and organic phosphonic acid, and the additive is selected from antimony-containing compounds and / or arsenic-containing compounds. The cyanide-free gold electroplating solution provided by the invention can be used for preparing the high-hardness gold bump on a semiconductor, and the obtained gold bump can still keep high hardness (90-110HV) after being subjected to heat treatment. The precipitation efficiency of the electroplating solution is high and is larger than 99%, and a prepared gold plating layer is low in roughness (smaller than 100 nm) and high in purity (99.99%). And the shape of the obtained gold bump is regular.

Description

technical field [0001] The present invention relates to the field of semiconductor gold bump preparation, in particular to a cyanide-free electroplating gold plating solution and its application, a method for making gold bumps by electroplating, gold bumps made by the method and electronic components with the gold bumps. Background technique [0002] The most commonly used metal interconnect materials for semiconductors are aluminum, copper and gold. Gold has excellent chemical stability, second only to silver and copper in terms of electrical and thermal conductivity. Gold will not be oxidized at room temperature or under heating conditions, and does not react with most chemical substances. It has good solderability, can be bonded by thermocompression, and has low contact resistance. Therefore, electroplating gold is widely used in fields such as electronic circuit boards, electronic connectors, and semiconductor manufacturing. [0003] Heat treatment is often performed a...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D3/48C25D7/12H01L21/60H01L23/488
CPCC25D3/48C25D7/12H01L24/11H01L24/13H01L2224/11462
Inventor 王彤任长友邓川刘鹏
Owner SHENZHEN UNITED BLUEOCEAN TECH DEV
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