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Cooling equipment for semiconductor manufacturing process and cooling liquid

A technology of cooling equipment and semiconductors, applied in the field of cooling equipment and coolant, can solve the problems of poor environmental friendliness and achieve good fluidity and low greenhouse effect potential

Pending Publication Date: 2021-12-28
SANMING HEXAFLUO CHEM CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Most of the coolants used in cooling equipment in the prior art use perfluoropolymers or compounds. Although the cooling performance can meet the standard, because of the stability of perfluoropolymers, the GWP (Greenhouse Effect Potential) value is high and the environmental friendliness is poor.

Method used

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  • Cooling equipment for semiconductor manufacturing process and cooling liquid
  • Cooling equipment for semiconductor manufacturing process and cooling liquid
  • Cooling equipment for semiconductor manufacturing process and cooling liquid

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0082] A cooling liquid, prepared by the following method:

[0083] (1) In methanol aqueous solution with a volume ratio of 1:1, add 30% H 2 o 2 (1 molar part), 1 molar part of KOH and 0.02 molar parts of tetrabutylammonium bromide carry out nucleophilic oxidation reaction for 4 hours to obtain perfluoropropylene oxide;

[0084] (2) The standard hexafluoropropylene oxide pentamer was detected by online gas chromatography, and the corresponding peak time was 11.441 minutes;

[0085] (3) Using 0.02 mole parts of cesium fluoride as a catalyst, adding hexafluoropropylene oxide into the aprotic solvent tetraethylene glycol dimethyl ether (the volume ratio of the aprotic solvent to hexafluoropropylene oxide is 1:1), Carry out the polymerization, 7 minutes after the signal appears at the peak time of the pentamer, add 1 mol / L potassium hydroxide aqueous solution (the addition amount is 1.05 mole parts in terms of potassium hydroxide) to the reaction solution, remove carbon dioxide,...

Embodiment 2

[0090] A cooling liquid, prepared by the following method:

[0091] (1) In methanol aqueous solution with a volume ratio of 1:1, add 30% H 2 o 2 (1 molar part), 1 molar part of KOH and 0.02 molar parts of tetrabutylammonium chloride carried out nucleophilic oxidation reaction for 4 hours to obtain perfluoropropylene oxide;

[0092] (2) The standard hexafluoropropylene oxide pentamer was detected by online gas chromatography, and the corresponding peak time was 11.441 minutes;

[0093] (3) Using 0.02 mole parts of cesium fluoride as a catalyst, in the aprotic solvent diethylene glycol dimethyl ether, polymerize hexafluoropropylene oxide according to the volume ratio of aprotic solvent and hexafluoropropylene oxide at 1:1 10 minutes after the signal appeared at the peak time of the pentamer, add 1 mol / L potassium hydroxide aqueous solution (1.05 mole parts in terms of potassium hydroxide) to the reaction solution to remove carbon dioxide and obtain the 2-position with Hexafluor...

Embodiment 3

[0098] A cooling liquid, prepared by the following method:

[0099] (1) In methanol aqueous solution with a volume ratio of 1:1, add 30% H 2 o 2 (1 molar part), 1 molar part of KOH and 0.02 molar parts of tetrabutylammonium bromide for nucleophilic oxidation reaction for 4 hours, and then add 1,2-dimethoxyethane to the product for extractive distillation to remove The extraction solvent (containing the extracted impurities) is then passed through an absorption tower filled with solid potassium hydroxide to remove a small amount of impurities such as HF, water, acyl fluoride, and hexafluoroacetone to obtain hexafluoropropylene oxide with a purity of 99.5%;

[0100] (2) The standard hexafluoropropylene oxide pentamer was detected by online gas chromatography, and the corresponding peak time was 11.441 minutes;

[0101] (3) Using 0.02 mole parts of cesium fluoride as a catalyst, add high-purity hexafluoropropylene oxide into the aprotic solvent diethylene glycol dimethyl ether ...

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Abstract

The invention relates to cooling equipment for a semiconductor manufacturing process and cooling liquid. The cooling equipment for the semiconductor manufacturing process comprises a refrigerating machine which is used for performing circulating cooling on a cooling agent and a heat exchanger. A cold circulation pipeline of the heat exchanger is communicated with the refrigerating machine, and a heat circulation pipeline of the heat exchanger is communicated with a helium pipeline of the semiconductor processing unit; a cooling agent is contained in the cooling agent container, and the cooling agent is prepared from the following components in parts by weight: 80 to 92 parts of 2-hydrogen-perfluoro-5, 8-dimethyl-3, 6, 9-trioxa dodecane, 3 to 7 parts of 2-hydrogen-perfluoro-5, 8, 11-trimethyl-3, 6, 9, 12-tetraoxa pentadecane and 1 to 17 parts of other components. The cooling equipment for the semiconductor manufacturing process can cool the manufacturing process unit with the highest manufacturing process temperature of 85-115 DEG C, the cooling agent in the cooling equipment has good flowability, the GWP (global warming potential) value is low, and the cooling equipment is environmentally friendly.

Description

technical field [0001] The invention belongs to the field of refrigeration, and in particular relates to a cooling device and a cooling liquid used in a semiconductor manufacturing process. Background technique [0002] With the development of society, cooling technology involves various fields, and for semiconductor manufacturing process, multiple processes require higher process temperature, such as dry etching (DRY ETCH), chemical vapor deposition (CVD), etc., in the process During the process, it is necessary to feed helium gas to take away the heat of etching, and to cool down the object to be etched. The helium gas carrying heat needs to exchange heat with the cooling liquid, and the cooled helium gas is sent to the inside of the process unit again to carry the heat. The output is reciprocated to realize the cooling of the process. [0003] Most of the coolants used in cooling equipment in the prior art use perfluoropolymers or compounds. Although the cooling performa...

Claims

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Application Information

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IPC IPC(8): H01L21/67C09K5/10C07C41/18C07C43/12
CPCH01L21/67011C09K5/10C07C41/18C07C43/126Y02C20/30
Inventor 曾一铮刘星米欣
Owner SANMING HEXAFLUO CHEM CO LTD