UV viscosity-reducing adhesive with antistatic effect and preparation method of viscosity-reducing adhesive

An antistatic and antistatic agent technology, applied in the direction of conductive adhesives, adhesives, adhesive types, etc., can solve the problem of no antistatic effect and limited application range of viscosifying adhesives, and achieve good adhesion and interface bonding performance, improving cohesive strength and interface bonding strength, and avoiding the effect of residual glue

Pending Publication Date: 2021-12-31
HUBEI INST OF AEROSPACE CHEMOTECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the UV viscosifying adhesive has no antis

Method used

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  • UV viscosity-reducing adhesive with antistatic effect and preparation method of viscosity-reducing adhesive
  • UV viscosity-reducing adhesive with antistatic effect and preparation method of viscosity-reducing adhesive
  • UV viscosity-reducing adhesive with antistatic effect and preparation method of viscosity-reducing adhesive

Examples

Experimental program
Comparison scheme
Effect test

Example Embodiment

[0034] UV antistatic effect having a reduced preparation of adhesives, comprising the steps of:

[0035] 1) dual-cure urethane acrylate pressure-sensitive adhesive Synthesis: Save the adhesive material in accordance with UV formulation having the antistatic effect are weighed acrylate, n-butyl acrylate, 2-ethylhexyl acrylate, hydroxyethyl acrylate , acrylic acid, benzoyl peroxide, four-necked flask, uniformly mixed with 50 parts of ethyl acetate with a free radical polymerization process for the random copolymerization, i.e., to obtain a polyacrylate prepolymer. Then, four-necked flask, pentaerythritol triacrylate, isophorone diisocyanate, 50 parts of ethyl acetate, to continue addition polymerization, to obtain a preparation of dual-cure urethane acrylate pressure-sensitive adhesive;

[0036] 2) having an antistatic effect reduction UV adhesive was prepared: The formulation of raw materials having antistatic effect according to the UV adhesive are weighed Save dual-cure urethane ...

Example Embodiment

[0041] Example 1

[0042] 1) Preparation of dual-cure urethane acrylate pressure-sensitive adhesive:

[0043] In the following component parts by mass of the raw material with a free radical polymerization process and the addition polymerization processes to obtain dual-cure urethane acrylate pressure-sensitive adhesive:

[0044] 16 parts of n-butyl acrylate

[0045] Acrylate, 2-ethylhexyl acrylate 23 parts

[0046] 8 parts of hydroxyethyl acrylate

[0047] 5 parts of acrylic acid

[0048] 4 parts of benzoyl peroxide

[0049] 35 parts of pentaerythritol triacrylate

[0050] 9 parts of isophorone diisocyanate

[0051] 100 parts of ethyl acetate

[0052] Radical polymerization temperature was controlled to 80-85 deg.] C, constant pressure dropping funnel 1.5 hours, the reaction was refluxed for 2.5 hours; addition polymerization temperature is controlled at 80 ± 3 ℃, refluxed 2.5 hours, cooled, it can be prepared by dual curable urethane acrylate pressure-sensitive adhesive.

[0053...

Example Embodiment

[0065] Example 2

[0066] 1) Preparation of dual-cure urethane acrylate pressure-sensitive adhesive:

[0067] In the following component parts by mass of the raw material with a free radical polymerization process and the addition polymerization processes to obtain dual-cure urethane acrylate pressure-sensitive adhesive:

[0068] 20 parts of n-butyl acrylate

[0069] 2-ethylhexyl acrylate, 21 parts of

[0070] 10 parts of hydroxyethyl acrylate

[0071] 4 parts of acrylic acid

[0072] 3 parts of benzoyl peroxide

[0073] 33 parts of pentaerythritol triacrylate

[0074] 9 parts of isophorone diisocyanate

[0075] 100 parts of ethyl acetate

[0076] Radical polymerization temperature was controlled to 80-85 deg.] C, constant pressure dropping funnel 1.5 hours, the reaction was refluxed for 2.5 hours; addition polymerization temperature is controlled at 80 ± 3 ℃, refluxed 2.5 hours, cooled, it can be prepared by dual curable urethane acrylate pressure-sensitive adhesive.

[0077] 2) ...

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Abstract

The invention discloses a UV viscosity-reducing adhesive with an antistatic effect and a preparation method of the viscosity-reducing adhesive. The UV viscosity-reducing adhesive is prepared from the following materials in percentage by mass: 43 to 45 percent of dual-curable polyurethane acrylate pressure-sensitive adhesive, 0.1 to 0.5 percent of trimethylolpropane triglycidyl ether cross-linking agent, 1.5 to 2.0 percent of photoinitiator 184, 3.0 to 5.0 percent of antistatic agent and 50 percent of ethyl acetate. The dual-curable polyurethane acrylate pressure-sensitive adhesive is prepared by adopting a free radical polymerization process to carry out random copolymerization and then carrying out addition polymerization: 16 to 20 parts of n-butyl acrylate, 21 to 25 parts of 2-ethylhexyl acrylate, 8 to 10 parts of hydroxyethyl acrylate, 4 to 5 parts of acrylic acid, 3 to 4 parts of benzoyl peroxide, 33 to 36 parts of pentaerythritol triacrylate, 7 to 9 parts of isophorone diisocyanate, and 100 parts of acetic ether. The UV viscosity-reducing film has relatively high peel strength after being thermally cured, and the peel strength is greatly reduced after being irradiated by UV light; and the introduction effect of the antistatic agent is good. The adhesive-reducing film is not easy to form residual adhesive on the surface of the protected material.

Description

technical field [0001] The invention relates to a UV viscosifying adhesive and a method for preparing the UV viscous reducing film thereof, in particular to a UV viscous reducing adhesive with an antistatic effect and a method for preparing the viscous reducing film thereof. Background technique [0002] With the rapid development of electronic technology, the processing protection requirements of various electronic materials are getting higher and higher. For example, chip electronic components, SMT components, MLCC chip capacitors, positioning cutting in the manufacturing process of chip inductors, semiconductor wafer surface processing, LCD and TP touch panel glass thinning and grinding and polishing, LED cutting, grinding and polishing, sapphire Substrate thinning and grinding processing, wafer grinding and cutting, various silicon wafers, packaging substrates, processing of crystal fine electronic parts and processing and cutting of tiny parts of various materials. In ...

Claims

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Application Information

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IPC IPC(8): C09J175/14C08F220/18C08F220/20C08F220/06C08G18/62C08G18/67C09J7/38C09J7/40C09J9/02
CPCC09J175/14C09J7/38C09J7/40C09J9/02C08F220/1808C08G18/672C08G18/6229C09J2301/122C09J2301/302C09J2301/314C09J2203/326C08F220/1804C08F220/20C08F220/06C08G18/62
Inventor 张宏元夏萍徐涛潘炜罗国旗刘东方高梦婷姚俊张宁
Owner HUBEI INST OF AEROSPACE CHEMOTECH
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