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Copper alloy surface polishing solution and preparation method thereof

A technology of surface polishing and copper alloy, applied in the field of metal polishing liquid, can solve the problems that the surface gloss needs to be improved, and can not have both pickling, polishing, sealing, copper alloy surface over-etching, etc., so as to improve the surface scratch repair performance , The effect of stable foaming and uniform dispersion

Active Publication Date: 2022-03-22
广东欣科兴五金制品有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The purpose of the present invention is to provide a copper alloy surface polishing liquid and its preparation method, which is used to solve the problem that the prior art cannot have multiple functions of pickling, polishing, and sealing. After polishing, the surface gloss needs to be improved. Technical problems where over-corrosion occurs

Method used

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  • Copper alloy surface polishing solution and preparation method thereof
  • Copper alloy surface polishing solution and preparation method thereof
  • Copper alloy surface polishing solution and preparation method thereof

Examples

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Embodiment 1

[0030] The present embodiment provides a copper alloy surface polishing solution, which includes 12vt% phosphoric acid, 8vt% sulfuric acid, 40g / L sodium chloride, 0.45g / L compound corrosion inhibitor, 0.23g / L surfactant, 8vt% methanol, 2.8g / L dodecylphenol ethoxylate, 28vt% hydrogen peroxide, 5g / L ethanol, and the rest is deionized water.

[0031] The preparation method of the copper alloy surface polishing liquid of the present embodiment comprises the following steps:

[0032] Add 5kg diethanolamine, 0.9kg quinoline, 21kg deionized water into the reaction kettle, then add 2.8kg thiourea, heat up to 92°C, keep warm and stir evenly, add 0.6kg benzotriazole, cocamide propyl hydroxyl For sulfobetaine, after cooling to room temperature, add 0.46kg sodium molybdate, keep stirring at 46°C for 25min to obtain a compound corrosion inhibitor.

[0033] Add 12kg of cocoic acid, 75kg of toluene, and 0.25kg of catalyst trimethylaluminum successively in the reactor, raise the temperature...

Embodiment 2

[0041] The present embodiment provides a copper alloy surface polishing solution, which includes 9vt% phosphoric acid, 8vt% sulfuric acid, 39g / L sodium chloride, 0.45g / L compound corrosion inhibitor, 0.22g / L surfactant, 7vt% methanol, 2.8g / L dodecylphenol ethoxylate, 30vt% hydrogen peroxide, 7g / L ethanol, and the rest is deionized water.

[0042] The preparation method of the copper alloy surface polishing liquid of the present embodiment comprises the following steps:

[0043] Add 5kg diethanolamine, 1.3kg quinoline, 20kg deionized water into the reaction kettle, then add 2.5kg thiourea, heat up to 92°C, heat and stir evenly, then add 0.7kg benzotriazole, 0.09kg cocoamidopropyl Hydroxysultaine, cooled to room temperature, added 0.09kg sodium molybdate, and stirred at 47°C for 27 minutes to obtain a compound corrosion inhibitor.

[0044] Add 12.35kg of coconut oil, 100kg of toluene, and 0.36kg of catalyst trimethylaluminum to the reactor in turn, raise the temperature to 72°...

Embodiment 3

[0048] The present embodiment provides a copper alloy surface polishing solution, which includes 14vt% phosphoric acid, 8vt% sulfuric acid, 42g / L sodium chloride, 0.45g / L compound corrosion inhibitor, 0.19g / L surfactant, 8vt% methanol, 3.2g / L dodecylphenol ethoxylate, 28vt% hydrogen peroxide, 6g / L ethanol, and the rest is deionized water.

[0049] The preparation method of the copper alloy surface polishing liquid of the present embodiment comprises the following steps:

[0050] Add 5kg diethanolamine, 1.2kg quinoline, 20kg deionized water into the reaction kettle, then add 3.5kg thiourea, heat up to 92°C, heat and stir evenly, then add 0.8kg benzotriazole, 0.12kg cocoamidopropyl Hydroxysultaine, after cooling to room temperature, add 0.56kg sodium molybdate, keep stirring at 48°C for 25min to obtain compound corrosion inhibitor.

[0051] Add 12.70kg of cocoic acid, 110kg of toluene, and 0.21kg of catalyst trimethylaluminum to the reaction kettle in sequence, raise the tempe...

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Abstract

The invention discloses a copper alloy surface polishing solution and a preparation method thereof, and relates to the technical field of metal polishing solutions. The polishing solution comprises phosphoric acid, sulfuric acid, sodium chloride, a compound corrosion inhibitor, a surfactant, methanol, dodecylphenol polyoxyethylene ether, hydrogen peroxide, ethanol and the balance of deionized water. The preparation method comprises the following steps: adding deionized water into a reactor, sequentially adding phosphoric acid and sulfuric acid under mechanical stirring, sequentially adding sodium chloride, the compound corrosion inhibitor, the surfactant and dodecylphenol polyoxyethylene ether, finally adding hydrogen peroxide, methanol and ethanol, and uniformly stirring. No nitric acid or hydrochloric acid is adopted in a main corrosion system, toxic yellow smoke cannot be generated, harm to the environment and workers is avoided, the three functions of acid pickling, polishing and sealing are achieved at the same time, and the cost of sequential treatment of an acid pickling solution, a polishing solution and a sealing solution is reduced; the copper alloy is high in surface glossiness after being polished, and the over-corrosion phenomenon is avoided.

Description

technical field [0001] The invention relates to the technical field of metal polishing liquid, in particular to a copper alloy surface polishing liquid and a preparation method thereof. Background technique [0002] Generally, the pickling, polishing and sealing process of copper and copper alloys is: pickling with mixed solution of nitric acid and hydrochloric acid → polishing with mixed solution of chromic acid, nitric acid and hydrochloric acid → sealing treatment with chromic acid or chromate solution. This process is to use acid solution to remove the oxide film on the surface of copper and brass parts; and chemical polishing is carried out through the oxidation of copper by chromic acid, nitric acid and other acid solutions and the dissolution of copper by chromic acid and nitric acid and other acid solutions; And a method of sealing the surface by chromic acid or chromate, but this method has the following disadvantages in the process of processing: 1. It produces a l...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09G1/18
CPCC09G1/18
Inventor 唐凌松
Owner 广东欣科兴五金制品有限公司
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