Thermal interface material with high thermal conductivity and preparation process thereof

Abstract

The invention discloses a beta-Si3N4 / Al2O3 / epoxy resin thermal interface material and a preparation method thereof. The problem to be solved is how to improve the heat conductivity of the epoxy resin-based composite material on the premise of not influencing the insulativity. And the problem of high solid content caused by filling epoxy resin with a single Al2O3 inorganic filler is solved. The preparation method of the material comprises the following steps: 1) preparing an epoxy matrix by using a certain amount of epoxy resin, a coupling agent and a thixotropic agent; (2) uniformly dispersing beta-Si3N4 and Al2O3 in an epoxy matrix through a gravity mixing method; and (3) adding a curing agent into the mixed solution prepared in the step (2) to carry out curing reaction. The preparation method disclosed by the invention is simple and easy to implement, and the beta-Si3N4 / Al2O3 / epoxy resin composite material obtained by adopting the method has a relatively high heat conductivity coefficient while keeping insulativity, and can be applied to the field of heat dissipation of high-density electronic devices.

Description

technical field [0001] The invention belongs to the field of electronic packaging materials, in particular to the design and preparation of thermal interface materials. Background technique [0002] With the rapid development of electronic devices towards high integration and miniaturization, there is a large amount of heat accumulation, which leads to overheating of the system and further reduces the service life of the devices. Using insulating materials with high thermal conductivity to improve the heat dissipation capability of electronic devices is a potential way at present. Epoxy resin is a commonly used packaging material, which has the advantages of light weight, strong adaptability, fatigue resistance, corrosion resistance, and good electrical insulation performance. However, compared with metal and ceramics, the thermal conductivity of epoxy resin is low, about 0.3Wm -1 K -1 , can not meet the needs of high heat dissipation. In this case, filling the epoxy mat...

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Problems solved by technology

According to literature reports, YK Kim et al. adopted Al 2 o 3 Hybridization of spheres with BN nanosheets improves single spherical Al 2 o 3 The thermal conductivity of the particles in the epoxy matrix, the thermal conductivity reaches 3.6Wm -1 K -1 , but the use of BN nanoparticles is easy to aggregate, and the price is more expensive

As a structural ceramic material, silicon nitride has excellent comprehensive physical properties such as high thermal conductivity, oxidation resistance, low thermal expansion coefficient and high bending strength, which makes it receive special attention as a high thermal conductivity filler, such as T People such as Kusunose use silicon nitride nanowires to improve the thermal conductivity of epoxy resin, but the cost of raw material silicon nitride nanowires is high, and strict process control is required; as mentioned in CN1935926A, the use of β-Si 3 N 4 Powder or β-Si 3 N 4 Ceramic mixed powders such as silicon oxide, aluminum oxide, aluminum nitride, boron nitride, etc. are used as filler powder to add epoxy resin to prepare high thermal conductivity electronic packaging materials to obtain high thermal conductivity materials, but the β-phase silicon nitride used in the materials The span of the particle size range is too large, it is easy to cause the problem of uneven dispersion, and the thermal conductivity of the material is not improved after mixing the β-phase silicon nitride and alumina powder, and the synergistic effect has not appeared, so the purpose of mixing fillers has not been achieved.

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