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High-crosslinking-degree organosilicon polymer/metal composite microsphere and preparation method thereof

A high cross-linking, metal composite technology, applied in metal processing equipment, metal material coating process, liquid chemical plating and other directions, can solve the problem of limited thickness of conductive particle coating, conductive microspheres not resistant to solvent swelling, serious environmental pollution and other problems, to achieve the effect of excellent anti-solvent swelling, good monodispersity and stable chemical properties

Pending Publication Date: 2022-05-24
LESCENT CHINA ADVANCED MATERIALS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] In the preparation process of traditional resin core conductive microspheres, multiple steps such as degreasing, coarsening, sensitization, activation, and electroless plating are required for the resin microspheres, and the preparation process is relatively cumbersome.
The patent application number CN202011488043.0 discloses the use of roughening solution (a mixture of chromium trioxide and concentrated sulfuric acid) to roughen polystyrene microspheres to improve the surface adhesion of PS microspheres, but this method is more serious for environmental pollution The patents whose application numbers are CN201210154648.5 and CN201110162698.3 all disclose the direct adsorption of metal ions on the surface of polymer microspheres and the preparation of gold-plated particles by chemical deposition, so that the prepared conductive particle coating thickness is limited, the cost is higher, and the used Polymer microspheres are non-highly cross-linked polymer microspheres, which leads to the defect that the prepared conductive microspheres are not resistant to solvent swelling

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  • High-crosslinking-degree organosilicon polymer/metal composite microsphere and preparation method thereof
  • High-crosslinking-degree organosilicon polymer/metal composite microsphere and preparation method thereof
  • High-crosslinking-degree organosilicon polymer/metal composite microsphere and preparation method thereof

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preparation example Construction

[0050] The invention provides a preparation method of a high cross-linking degree organosilicon polymer / metal composite microsphere, and the preparation method comprises the following steps:

[0051] (1) dispersing the inorganic nanoparticles in a polar solvent, and then adding an aminosilane coupling agent for modification to obtain aminated inorganic nanoparticles;

[0052] (2) adding the high-crosslinking degree silicone polymer microspheres and the aminated inorganic nanoparticles into the acidic solution system and mixing them to obtain a high-crosslinking degree silicone polymer coated with the aminated inorganic nanoparticles Microspheres;

[0053] (3) performing activation treatment and chemical plating on the high-crosslinking degree organosilicon polymer microspheres coated with aminated inorganic nanoparticles obtained in step (2) to obtain the high-crosslinking degree organosilicon polymer / Metal composite microspheres.

[0054] It should be noted that, for the ...

Embodiment 1

[0105] (1) Amination modification: under the condition of flowing nitrogen, disperse 0.5g γ-glycidyloxypropyltriethoxysilane into 50g absolute ethanol, add 0.1g ethylenediamine, heat at 70°C After 20 hours of reaction, the aminosilane coupling agent was obtained by distillation under reduced pressure; 1 g of silica with an average particle size of 8 nm was dispersed in 100 g of methanol, 0.15 g of the prepared aminosilane coupling agent was added, and the reaction was carried out at 80 °C for 24 hours. , after twice centrifugation-ethanol washing and drying to obtain aminated silica nanoparticles;

[0106] (2) Coating: Add 3 g of high-crosslinking silicone polymer microspheres with an average particle size of 5.8 μm and 0.05 g of the aminated silica nanoparticles obtained in step (1) into 50 g of deionized water, and mix well Then, dilute hydrochloric acid was added dropwise to adjust its pH=4.5, stirred at room temperature for 60 min, filtered, washed with water, and dried to...

Embodiment 2

[0111] (1) Amination modification: Disperse 0.5g of γ-glycidyloxypropyltrimethoxysilane into 50g of absolute ethanol, add 0.15g of diethylamine, and react at 65°C under the condition of flowing nitrogen. After 18 hours, the aminosilane coupling agent was obtained by distillation under reduced pressure; 1 g of titanium dioxide with an average particle size of 15 nm was dispersed in 100 g of methanol, 0.1 g of the prepared aminosilane coupling agent was added, and the reaction was carried out at 80 °C for 30 hours. Second centrifugation-ethanol washing and drying to obtain aminated titanium dioxide nanoparticles;

[0112] (2) Coating: Weigh 3 g of high cross-linking degree silicone polymer microspheres with an average particle size of 8.0 μm and 0.07 g of the aminated titanium dioxide nanoparticles obtained in step (1) in 50 g of deionized water, and after mixing uniformly, Add dilute hydrochloric acid dropwise to adjust its pH=3.5, stir at room temperature for 60 minutes, filte...

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Abstract

The invention provides a preparation method of high-crosslinking-degree organosilicon polymer / metal composite microspheres, which comprises the following steps: (1) dispersing inorganic nanoparticles into a polar solvent, and then adding an amino silane coupling agent for modification to obtain aminated inorganic nanoparticles; (2) adding the high-crosslinking-degree organic silicon polymer microspheres and the aminated inorganic nanoparticles into an acidic solution system, and uniformly mixing to obtain high-crosslinking-degree organic silicon polymer microspheres coated with the aminated inorganic nanoparticles; and (3) carrying out activating treatment and chemical plating on the high-crosslinking-degree organosilicon polymer microspheres coated with the aminated inorganic nanoparticles obtained in the step (2) to obtain the high-crosslinking-degree organosilicon polymer / metal composite microspheres. The prepared high-crosslinking-degree organosilicon polymer / metal composite microspheres are good in monodispersity, stable in chemical property, high in crosslinking degree, excellent in ageing resistance and solvent swelling resistance, uniform in metal layer coating, firm in adhesion and not prone to falling off.

Description

technical field [0001] The invention relates to the technical field of functional microspheres, in particular to a high-crosslinking degree organosilicon polymer / metal composite microsphere and a preparation method thereof. Background technique [0002] Resin core conductive microspheres are conductive microspheres made of resin microspheres as the base material and plated with conductive metal materials. The conductive microspheres have good electrical conductivity by compounding high molecular polymer microspheres and metals, and at the same time greatly reduce the amount of metal, and have the advantages of both metal materials and polymer resin microspheres, so they are widely used in 3C technology field. [0003] In the preparation process of traditional resin core conductive microspheres, the resin microspheres need to be degreasing, roughened, sensitized, activated, electroless plating and other steps, and the preparation process is complicated. The patent with appl...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B22F1/18B22F1/145C23C18/18C23C18/36C23C18/44
CPCC23C18/1893C23C18/36C23C18/44Y02E60/10
Inventor 胡杨冯晓彤江一明
Owner LESCENT CHINA ADVANCED MATERIALS CO LTD