Chemical nickel plating solution for nickel plating of electronic component pin and use method of chemical nickel plating solution
An electroless nickel plating solution and technology for electronic components, applied in liquid chemical plating, metal material coating process, coating, etc., can solve problems such as high phosphorus concentration, difficulty in electroplating solution meeting the requirements of pin electroplating, brittle coating, etc. , to achieve the effect of reducing phosphorus content, enhancing wear resistance and uniform wear resistance
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[0022] As a preferred embodiment: the nickel source is selected from at least one of nickel sulfate, nickel chloride, nickel fluoride, nickel bromide, and nickel acetate, and the content of the nickel source is 15-30 g / L.
[0023] As a preferred embodiment: the complexing agent includes at least one of lactic acid, acetic acid, propionic acid, malic acid, citric acid, succinic acid, and pyrophosphoric acid.
[0024] Preferably, the complexing agent includes lactic acid and propionic acid, and the mass ratio of lactic acid and propionic acid is 1:(0.3-0.5).
[0025] Preferably, the content of the complexing agent in the electroless nickel plating solution is not less than 12 g / L.
[0026] When the pH in the system is greater than 6, nickel ions will spontaneously hydrolyze to form insoluble nickel hydroxide precipitation. In order to maintain the stable reaction of the system, it is necessary to add a complexing agent that can complex with nickel ions to reduce the concentratio...
Embodiment 1
[0050]Embodiment 1 provides an electroless nickel plating solution for nickel plating of electronic component pins. The preparation raw materials include nickel source 15g / L, complexing agent 12g / L, inorganic particles 3g / L, reducing agent 15g / L, stable 1mg / L of agent, 1mg / L of surfactant, 80mg / L of anhydrous sodium metasilicate, 10g / L of buffer, the reaction temperature is 85°C, and the pH of the system is 5.3.
[0051] The nickel source is nickel sulfate, the complexing agent is lactic acid and propionic acid, the mass ratio of lactic acid and propionic acid is 1:0.3, the inorganic particles are quartz, the particle size is 10 μm, the reducing agent is sodium hypophosphite, and the stabilizer is acetylthiourea , the surfactant is sodium dodecylbenzenesulfonate, and the buffer is sodium acetate.
Embodiment 2
[0053] Embodiment 2 provides an electroless nickel plating solution for nickel plating of electronic component pins, and the preparation raw materials include nickel source 30g / L, complexing agent 15g / L, inorganic particles 5g / L, reducing agent 30g / L, stable 10mg / L of agent, 10mg / L of surfactant, 1.2g / L of anhydrous sodium metasilicate, 20g / L of buffer, the reaction temperature is 85°C, and the pH of the system is 5.3.
[0054] The nickel source is nickel acetate, the complexing agent is lactic acid and propionic acid, the mass ratio of lactic acid and propionic acid is 1:0.5, the inorganic particles are quartz, the particle size is 10 μm, the reducing agent is potassium hypophosphite, and the stabilizer is thiosemicarbazide , the surfactant is sodium dioctyl succinate sulfonate, and the buffer is potassium acetate.
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