Ternary nitride coating prepared by microwave plasma chemical vapor deposition and method thereof

Abstract

The invention provides a ternary nitride coating prepared through microwave plasma chemical vapor deposition and a method, and belongs to the technical field of coating preparation. The invention discloses a ternary nitride coating for microwave plasma chemical vapor deposition. The molecular form of the ternary nitride coating is M < 1-x > DxNy. The invention discloses a method for preparing a ternary nitride coating through microwave plasma chemical vapor deposition. The method comprises the following steps: (1) cleaning and pretreating a substrate; (2) performing microwave plasma chemical vapor deposition for the first time to form a solid solution and/or an intermetallic compound on the surface of the metal matrix; and (3) performing microwave plasma chemical vapor deposition for the second time, and beginning to deposit the ternary nitride coating. Trace solid solutions or intermetallic compounds are evenly distributed in the ternary nitride coating, the effects of dispersion strengthening and coating performance enhancing are achieved, and the coating shows the better high-temperature service characteristic; the method provided by the invention has higher deposition efficiency, and a thicker ternary nitride coating can be obtained.

Description

technical field [0001] The invention belongs to the technical field of coating preparation, in particular to a ternary nitride coating prepared by microwave plasma chemical vapor deposition and a method thereof. Background technique [0002] Cutting-edge equipment in the fields of aerospace, marine engineering, and national defense and military industries has harsh and extreme operating conditions (such as ultra-high temperature, large temperature difference, high-speed erosion, cyclic impact, thermochemical corrosion, etc.), its ability to protect key materials and its safe use Higher requirements have been put forward for durability and service reliability. This requires that the surface coating must have the characteristics of high hardness, high temperature resistance, oxidation resistance and ablation resistance. Among them, improving the oxidation resistance and ablation resistance of the surface coating becomes the important direction of development. Although metal (...

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Problems solved by technology

However, the efficiency of physical vapor deposition is low, and generally only thinner coatings can be obtained. The manufacturing process of the required target is complicated and costly, and it is affected by the quality of the target (density, grain size, etc.) and the different deposition processes. The interaction between the target material and different sputtering conditions will lead to structural defects such as large particles and pores in the coating, which will affect the coating performance

Compared with physical vapor deposition, chemical vapor deposition has a faster rate and can obtain micron or even millimeter-scale coatings, but it is difficult to introduce a variety of metal elements, and is generally only used to prepare binary nitride coatings

Although there are a few reports in the literature, some ternary nitride coatings can be prepared using metal-organic compounds as raw materials by chemical vapor deposition technology, but the available metal-organic compound raw materials are very limited, expensive and have certain toxicity. In addition, chemical The relatively high preparation temperature of vapor deposition can also have an adverse effect on the protective substrate

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