Monitoring device for dynamically sensing single-sided chemical mechanical planarization processing

A technology of chemical machinery and monitoring devices, applied in the control of workpiece feed movement, grinding devices, metal processing equipment, etc., can solve the problems of large external interference, single testing methods, and low precision, and achieve simplified process flow, The effect of reducing clamping and improving processing and manufacturing efficiency

Pending Publication Date: 2022-07-29
SHANGHAI UNIV OF ENG SCI
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  • Abstract
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  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The purpose of the present invention is to design a multi-sensing, anti-interference and high-accuracy online real-time monitoring device for the existing ultra-precision chemical mechanical flattening online monitoring devices, which have single testing means, are greatly affected by external interference, and have low precision. monitoring device

Method used

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  • Monitoring device for dynamically sensing single-sided chemical mechanical planarization processing

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Experimental program
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Effect test

Embodiment 1

[0037]For example, in the process of grinding sapphire with free abrasives, the acoustic emission sensor and the three-dimensional force sensor arranged in a cross shape on the sensor fixture respectively collect the physical quantities of stress waves generated by abrasive rolling and scribing the workpiece surface and convert them into analog signals of sound and force. , through the signal conditioner to amplify the perceived analog signal and filter the clutter, the 10M sampling rate, 16-bit channel data collector collects the adjusted analog signal and converts it into a digital signal, and then through digital filtering, Noise reduction, preprocessing of stored data, transfer of preprocessed data to computer and data signal processing for standardization and sparseness, time-frequency conversion, feature extraction, modal identification, and display of acoustic emission time-frequency-intensity curve and time - Friction coefficient curve, the time-material removal rate cu...

Embodiment 2

[0039] For example, in the process of grinding silicon carbide with bonded abrasives, the acoustic emission sensor and temperature sensor arranged in a multi-ring layout on the sensor fixture respectively collect the stress waves and frictional thermal physical quantities generated on the surface of the workpiece due to the frictional mechanical action of the abrasive pads. The hot analog signal is amplified, amplified and filtered by the signal conditioner. The 15M sampling rate, 19-bit channel data collector collects the adjusted analog signal and converts it into a digital signal. After digital filtering, noise reduction, and preprocessing of stored data, the preprocessed data is transferred to the computer and subjected to data signal processing of standardization and sparseness, time-frequency conversion, feature extraction, and modal recognition, showing that the acoustic emission time-frequency- Intensity curve and time-temperature curve, the time-surface roughness curve...

Embodiment 3

[0041] For example, in the chemical mechanical polishing of silicon wafer from copper layer to tantalum layer, the three-dimensional force sensor and temperature sensor on the sensor fixture in a star-shaped layout respectively collect the stress wave and frictional heat generated on the surface of the workpiece and convert them into sound and heat. The analog signal is amplified, amplified and filtered by the signal conditioner. The 20M sampling rate, 15-bit channel data collector collects the adjusted analog signal and converts it into a digital signal. Filtering, noise reduction, stored data preprocessing, the preprocessed data is transferred to the computer and subjected to data signal processing for standardization and sparseness, time-frequency conversion, feature extraction, and modal identification, showing the time-friction coefficient curve and time -Temperature curve, qualitatively analyze the type of wafer based on the friction coefficient and temperature signal, mo...

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Abstract

The invention discloses a monitoring device for dynamically sensing single-sided chemical mechanical planarization processing, and belongs to the technical field of ultra-precision processing monitoring. The monitoring device is installed on a single-face grinding and polishing machine, can achieve online real-time monitoring of the state of a workpiece in the plane finishing process, and is characterized by comprising a sensor unit which comprises at least two sensors for collecting monitoring signals for joint monitoring; the signal adjusting unit is used for carrying out amplitude amplification, attenuation and/or frequency spectrum filtering on the acquired signals; the data acquisition unit is used for converting the analog signal processed by the signal conditioning unit into a digital signal and carrying out data preprocessing of digital filtering, noise reduction and storage; and the processor unit is used for performing pattern recognition on the data preprocessed by the data acquisition unit to realize visualization of workpiece processing dynamic indexes. The online real-time monitoring device designed by the invention has the advantages of multiple sensing, interference resistance, high accuracy, wide application range, low cost, convenience in operation, high intelligent level and the like.

Description

technical field [0001] The invention relates to the field of ultra-precision machining monitoring, in particular to a monitoring device for dynamic perception of single-sided chemical-mechanical planarization machining. Background technique [0002] With the increasing progress of optics, optoelectronics, and materials technology, it has also promoted the wide application and rapid development of semiconductor, optical and optoelectronic devices in the fields of electronics, optics, instrumentation, aerospace, and national defense. [0003] Photofinishing of semiconductor, optical and optoelectronic materials is generally realized by ultra-precision chemical mechanical planarization (Chemical Mechanical Planarization, CMP). Efficient, high-quality ultra-precision CMP processing (nanometer to sub-nanometer precision) depends not only on processing equipment, methods, materials, and precision, but also on detection accuracy, sensitivity, resolution, and depth. The depth is no...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B24B37/015B24B37/005B24B49/00B24B49/16
CPCB24B37/015B24B37/005B24B49/003B24B49/16
Inventor 陈佳鹏彭亚男林杰郝晓东何安捷
Owner SHANGHAI UNIV OF ENG SCI
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