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Preparation method of diamond composite material

A composite material and diamond technology, which is applied in the field of diamond composite material preparation, can solve the problems of non-wetting between diamond and substrate, poor packaging effect, poor bonding force, etc., and achieve high ionization energy, high density, and improved performance. Effect

Active Publication Date: 2022-08-09
邵阳市东昇超硬材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The diamond / metal composite material has a thermal expansion coefficient that matches the chip material, excellent thermal conductivity and strength, and low density. It is an ideal new electronic packaging material. The high interface energy makes the diamond and the substrate non-wetting, resulting in poor bonding force and poor packaging effect, so improving the bonding problem between diamond and metal interface has become the focus of current research

Method used

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  • Preparation method of diamond composite material
  • Preparation method of diamond composite material
  • Preparation method of diamond composite material

Examples

Experimental program
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Effect test

Embodiment 1

[0028] A preparation method of diamond composite material:

[0029] Add 10g of diamond powder with a particle size of 10-20μm to 100mL of acetone, soak for 60min, pour out the acetone, rinse with 60°C hot water and 25°C cold water in turn, add it to 2mol / L NaOH solution, stir at 90°C for 6h, pump Filter and wash with water until neutral, dry at 80°C for 10h, add it to the fluorosurfactant solution for 60min, suction filter, and dry at 80°C for 10h. The preparation method of the fluorosurfactant solution is as follows: Phosphorus and 240 mL of perfluorohexyl ethanol were mixed, stirred and heated to 110 °C for 8 h. After cooling to room temperature, the pH of the reaction solution was adjusted to neutrality with ammonia water, and then a mixed solution consisting of 400 mL of water and 400 mL of isopropanol was added, and the Continue stirring at 80°C for 3h, mix the obtained diamond powder with 150g potassium nitrate uniformly and place it in a muffle furnace, then heat the mu...

Embodiment 2

[0031] A preparation method of diamond composite material:

[0032] Add 10g of diamond powder with a particle size of 10-20μm to 100mL of acetone, soak for 10min, pour out the acetone, rinse with 60°C hot water and 25°C cold water in turn, add it to 2mol / L NaOH solution, stir at 80°C for 4h, pump Filtered and washed with water until neutral, dried at 80°C for 10h, added to the fluorosurfactant solution for 10min soaking, suction filtered, and dried at 80°C for 10h. The preparation method of the fluorosurfactant solution was as follows: Phosphorus and 240 mL of perfluorohexyl ethanol were mixed, stirred and heated to 100 °C for 6 h. After cooling to room temperature, the pH of the reaction solution was adjusted to neutrality with ammonia water, and then a mixed solution consisting of 400 mL of water and 400 mL of isopropanol was added, Continue stirring at 60 °C for 1 h, mix the obtained diamond powder with 120 g of potassium nitrate uniformly and place it in a muffle furnace, ...

Embodiment 3

[0034] A preparation method of diamond composite material:

[0035] Add 10 g of diamond powder with a particle size of 10-20 μm to 100 mL of acetone, soak for 60 min, pour out the acetone, rinse with 60 °C hot water and 25 °C cold water in turn, add it to 2 mol / L NaOH solution, stir at 80 °C for 6 hours, and pump Filtered and washed with water until neutral, dried at 80°C for 10h, added to the fluorosurfactant solution for 10min soaking, suction filtered, and dried at 80°C for 10h. The preparation method of the fluorosurfactant solution was as follows: Phosphorus and 240 mL of perfluorohexyl ethanol were mixed, stirred and heated to 110 °C for 6 h. After cooling to room temperature, the pH of the reaction solution was adjusted to neutrality with ammonia water, and then a mixed solution consisting of 400 mL of water and 400 mL of isopropanol was added, Continue stirring at 80 °C for 1 h, mix the obtained diamond powder with 150 g of potassium nitrate uniformly and place it in a...

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Abstract

The invention relates to the field of composite materials, in particular to a preparation method of a diamond composite material, diamond powder is sequentially subjected to pretreatment, surface etching and nickel plating to obtain nickel-plated diamond powder, the nickel-plated diamond powder is fully mixed with titanium powder, silicon powder, titanium carbide powder and copper powder, and the mixture is subjected to plasma sintering to obtain the diamond composite material. The heat-conducting property is good, and the bending strength, the hardness and the impact toughness are very excellent.

Description

technical field [0001] The invention relates to the field of composite materials, in particular to a preparation method of a diamond composite material. Background technique [0002] With the rapid development of 5G microelectronic components and high-power electronic devices, the heat flux density per unit area of ​​the chip is getting larger and larger, and dissipating the heat in a timely and effective manner is the key to ensuring the stability of electronic devices. Existing electronic packaging materials It is not enough to meet the heat dissipation requirements of large-scale integrated circuits. The diamond / metal composite material has a thermal expansion coefficient that matches the chip material, excellent thermal conductivity and strength, and low density. It is an ideal new electronic packaging material. The high interfacial energy makes the diamond and the substrate not wet, resulting in poor bonding force and poor packaging effect. Therefore, improving the bon...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C22C1/05B22F1/18C25D5/54C25D3/06C01B32/28B22F1/12B22F3/14C22C26/00C22C30/02C22C1/10C22C32/00H01L23/373
CPCC22C1/058B22F1/18C25D5/54C25D3/06C01B32/28B22F1/12B22F1/09B22F3/14C22C26/00C22C30/02C22C9/00H01L23/3732B22F2999/00C22C2026/006B22F2202/13
Inventor 黄迪曹晓君袁七一
Owner 邵阳市东昇超硬材料有限公司