Magnetic field induced deposition method for preparing magnetic nano-gap electrode
A gap electrode and magnetic nanotechnology, which is applied in nanotechnology, nanotechnology, nanostructure manufacturing, etc., can solve the problem that the preparation method is limited to electroplating and electroless plating, the gap between prototype electrodes should not be too large, and magnetic nanogap electrodes are rare, etc. No need to invest in equipment, improve the surface structure and tip shape, and achieve the effect of simple method
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Embodiment 1
[0018] Embodiment 1: Gold, silver or copper electrode pairs with micron or submicron gaps are processed on silicon-based materials by ordinary photolithography technology, and used as prototype electrodes. After cleaning the surface of the prototype electrode, put bifunctional molecular sulfur-containing compounds such as mercaptoethylamine or 1,6-hexanedithiol or dimercaptosuccinic acid or thioglycolic acid or NH 2 -(CH 2 )n-S-S-(CH 2 )n-NH 2 (n>2) or NH 2 -(CH 2 )n-S-(CH 2 )n-NH 2 Molecular assembly is carried out in an ethanol solution of (n>2); the above-mentioned electrode assembled with bifunctional molecules is put into colloidal silver or palladium ion solution for electrode surface activation treatment. The above-mentioned electrodes activated by palladium surface are respectively put into nickel, cobalt or magnetic alloy electroless plating solution, and an external magnetic field (magnetic field strength is 0.01~2 tesla) is applied along the electrode pair dir...
Embodiment 2
[0019] Embodiment 2: A pair of gold, silver or copper electrodes with a micron or submicron gap is processed on a silicon-based material by a common photolithography process, and this is used as a prototype electrode. After cleaning the surface, the prototype electrode was put into ethanol solution of mercaptoethylamine for molecular assembly; the above electrode assembled with bifunctional molecules was put into colloidal nickel solution for activation. The above-mentioned nickel-activated electrodes are placed in the electroless plating solution of nickel or nickel alloy, and an external magnetic field (magnetic field strength is 0.01-2 Tesla) is applied along the direction of the electrode pair to induce magnetic nickel metal or nickel alloy on the electrode. The tip of the pair is preferentially deposited and oriented to grow, and finally a nano-gap electrode structure of magnetic nickel or nickel alloy is obtained respectively.
Embodiment 3
[0020] Embodiment 3: Gold, silver or copper electrode pairs with micron or submicron gaps are processed on silicon-based materials by ordinary photolithography technology, and used as prototype electrodes. After cleaning the surface of the prototype electrode, it was put into ethanol solution of mercaptoethylamine for molecular assembly; the above electrode assembled with bifunctional molecules was put into colloidal cobalt solution for activation. The above cobalt-activated electrodes are respectively placed in the electroless plating solution of cobalt or cobalt alloy, and an external magnetic field (magnetic field strength is 0.01-2 tesla) is applied along the direction of the electrode pair to induce magnetic cobalt or cobalt alloy on the electrode. The tip of the pair is preferentially deposited and grown oriented to obtain a nanogap electrode structure of magnetic cobalt or cobalt alloy, respectively.
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