Hardenable resin composition, hardened body thereof, and printed wiring board

A curable resin and compound technology, applied in printed circuits, electrical components, optics, etc., can solve problems such as inability to obtain surface curability, incomplete development, incomplete coating surface, etc., and achieve excellent surface curability.

Active Publication Date: 2006-05-31
TAIYO INK MFG
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0009] However, when a solder resist film, which is one of the photocurable resin compositions used in the prior art, is exposed at 405 nm using a direct drawing device equipped with a semiconductor laser, development is incomplete due to insufficient curing, Sufficient surface curability cannot be obtained
That is, since the surface curability cannot be obtained, the following problems arise: the resistance to solder, the resistance to gold plating, which are the basic characteristics of the solder resist film, and the reduction of the resistance to gold plating and the failure of the solder mask by the pressure cooker (PCT) and the highly accelerated life test (HAST). The reliability of the evaluation is reduced
Other reasons are considered to be that components of prior art photopolymerization initiators, such as photosensitive resin compositions using oxime ester (oxime ester) compounds (see JP-A-2001-235858 ), benzoin and derivatives thereof, Many substances such as substituted or unsubstituted benzoquinones are known (Fotopolyma-Handbook, Chapter 6 (Industrial Investigation Society, 1989 edition)), and any of them is difficult to obtain a concentration of 350 nm or more. Sufficient sensitivity in the low energy range, so the surface of the developed coating film is incomplete

Method used

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  • Hardenable resin composition, hardened body thereof, and printed wiring board
  • Hardenable resin composition, hardened body thereof, and printed wiring board
  • Hardenable resin composition, hardened body thereof, and printed wiring board

Examples

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Embodiment

[0095]The present invention is specifically described below by giving specific examples and comparative examples, and the present invention is not limited to the content described in the following examples.

Synthetic example 1

[0097] Into a 2-liter separable flask equipped with a stirrer, a thermometer, a reflux condenser, a dropping funnel, and a nitrogen inlet tube, 508 g of dipropylene glycol monomethyl ether (MFDG manufactured by Nippon Emulsifier Co., Ltd.) was added, and heated to 110° C. Afterwards, 174g of ethylenically unsaturated group-containing carboxylic acid (in the above formula (I), R is a methyl group, and n is a compound of 2), 174g of methacrylic acid, 77g of methacrylic acid was added dropwise in a total of 3 hours. Ethyl ester, 222 g of MFDG, and 12.0 g of t-butylperoxy-2-ethylhexanoate (Perbull O manufactured by NOF Corporation). After the addition, it was aged for 3 hours to synthesize a dry polymer (copolymer) containing a carboxyl group, and then 289 g of 3,4-epoxycyclohexyl methacrylate (cycroma-A200 manufactured by DAICEL Chemical Industry Co., Ltd.) was added to the dry polymer. , 3.0 g of triphenylphosphine, and 1.3 g of methyl hydroquinone were reacted at a temperature ...

Synthetic example 2

[0099] In a 2-liter separable flask equipped with a stirrer, a thermometer, a reflux condenser, a dropping funnel, and a nitrogen inlet tube, 660 g of cresol novolac-type epoxy resin (manufactured by Nippon Kayaku Co., Ltd. EOCN- 104S, softening point 92°C, epoxy equivalent 220), 421.3g carbitol acetate and 180.6g solvent naphtha, heated and stirred to 90°C to dissolve them. Next, after cooling to a temperature of 60° C., 216 g of acrylic acid, 4.0 g of triphenylphosphine, and 1.3 g of methylhydroquinone were added and reacted at a temperature of 100° C. for 12 hours. Thus, a reaction product having an acid value of 0.2 mgKOH / g was obtained. Then add 241.7g tetrahydrophthalic acid, heat to 90°C and stir to dissolve it, and react for 6 hours, thus obtaining an acid value of 50 mg KOH / g, double bond equivalent (the quality of the resin per 1 mole of unsaturated group ( g)) A solution of active energy ray curable resin B (cresol novolac type epoxy-modified polybasic acid anhydri...

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Abstract

The purpose of the present invention is to provide a hardenable resin composition which can have superior surface hardenable property by irradiation with an active energy beam of 350 to 420 nm in wavelength. The hardenable resin composition contains: a compound (A) having at least one unsaturated double bond; a compound (B) having an oxime ester group; and a benzophenone compound (C ) containing sulfur atoms and hardened with an active energy beam of 350 to 420 nm in wavelength.

Description

technical field [0001] The present invention relates to a curable resin composition cured by active energy rays of 350 nm to 420 nm, its cured product, and a printed circuit board. Background technique [0002] In recent years, with the development of miniaturization and high performance of electronic equipment, the demand for photocurable resin compositions used in these electronic equipment is also increasing. Regardless of whether it is a solder resist using a photocurable resin composition, an interlayer insulating material, a plating protection layer, an ink for sandblasting resistance, a polymer optical waveguide, a component for a flat panel display (FPD), or a plating protection film , color filter protective film, insulating spacers such as touch panels, etc., which have nothing to do with the application, such as improvement of reliability, higher density of circuit patterns, and improvement of pattern accuracy. [0003] The photocurable resin composition is gener...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G03F7/004H05K1/00
CPCG03F7/0045G03F7/027
Inventor 加藤贤治糸川弦
Owner TAIYO INK MFG
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