Rare earth elements doped sealing by fusing glass powder without lead, and manufacturing method

A technology of rare earth elements and manufacturing methods, which is applied in the field of sealing materials and lead-free low-melting glass powder, can solve the problems of difficult preparation, high working temperature of sealing glass powder, poor chemical stability, etc., to reduce the expansion coefficient, process and manufacture The process is simple and the effect of improving production efficiency

Active Publication Date: 2007-02-21
CHINA BUILDING MATERIALS ACAD
View PDF2 Cites 27 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] In order to solve the problems of high working temperature, poor chemical stability and difficulty in preparation of the sealing glass frit of electronic components in the prior art, the o

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Rare earth elements doped sealing by fusing glass powder without lead, and manufacturing method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0033] Step 1: Calculate and select raw materials according to the composition of Example 1 in Table 1, weigh 30 grams of vanadium pentoxide, 10 grams of phosphorus pentoxide, 8 grams of antimony trioxide, 30.6 grams of lithium carbonate, 25.7 grams of soda ash, and potassium carbonate 14.8 grams, 10 grams of magnesium oxide, 14.4 grams of calcium carbonate, 3.5 grams of strontium chloride, 16.0 grams of barium chloride, 8.5 grams of zinc oxide, 10 grams of tin (II) oxide, 44.9 grams of boric acid, 5 grams of aluminum oxide, trioxide 3 grams of bismuth, 8 grams of ferric oxide, 8 grams of silicon dioxide, 2 grams of tin (IV) oxide, 5 grams of lanthanum oxide, 0.001 grams of cerium oxide, 8 grams of yttrium oxide and 6 grams of neodymium oxide.

[0034] Step 2: Mix the above-mentioned weighed raw materials evenly, and dry them at 280° C., grind and pulverize them after processing, and mix 0.3 g of carbon powder as a reducing agent (0.1-0.3 wt% of the raw materials in step 1 can ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

This invention relates to lead-free and low-melting-point sealing glass powder doped with rare earth oxides. The sealing glass powder is composed of base glass oxides (V2O5-P2O5-Sb2O3) and mixed rare earth oxides at a weight ratio of 100: (0.0013-10), preferential 100: (0.3-6.0). The mixed rare earth oxides are La2O3, CeO2, Y2O3 and Nd2O3 at a weight ratio of (0.001-5.0): (0.1-10.0): (0.001-8.0): (0.001-6.0). This invention adopts the modification technique by adopting rare earth oxides, thus can reduce the sealing temperature of the glass, save energy, raise productivity, improve chemical stability of the glass, and reduce expansion coefficient of the glass. The glass powder can be used for nontoxic and nonpollutive sealing of electronic elements.

Description

technical field [0001] The invention relates to a sealing material applied to the sealing of electronic components, in particular to a lead-free low-melting glass powder doped with rare earth elements and a method for manufacturing the glass powder material, belonging to the technical field of glass production. Background technique [0002] Glass powder materials with low melting point and low expansion coefficient are commonly used sealing materials in the production process of electronic components. [0003] At present, the material selected for sealing most electronic components is lead-containing sealing glass, such as PbO-B 2 o 3 -SiO 2 system or PbO-ZnO-B 2 o 3 Department of glass. The softening temperature of these glasses is less than 400°C, and the coefficient of thermal expansion is 90-100×10 -7 / °C, a good sealing material (particle size 10-40 μm) can flow for a long time during the sealing process without complete crystallization. But the lead oxide conten...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
IPC IPC(8): C03C8/24C03C3/068
CPCC03C3/062C03C12/00C03C3/066C03C3/21C03C3/064C03C3/068
Inventor 黄幼榕李长久崔竹高锡平
Owner CHINA BUILDING MATERIALS ACAD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products