Circuit substrate and manufacturing method thereof

A technology of circuit substrate and manufacturing method, which is applied in the fields of printed circuit manufacturing, circuit substrate material, multilayer circuit manufacturing, etc. It can solve the difficulty of transmitting signals, the difficulty of providing high-quality signal current in high-frequency areas, and the difficulty of circuit substrates adapting to high-frequency signals, etc. problem, to achieve low adhesion, suppress crosstalk or radiation noise
CN1961622AInactive Publication Date: 2007-05-09大见忠弘 +1
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
大见忠弘
Publication Date
2007-05-09
Estimated Expiration
Not applicable · inactive patent

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Abstract

A circuit board having high adhessiveness contact between electrically insulating layers and having a low interlayer electric resistance is provided. A circuit board is provided with a first conductive layer formed on a core ( 1 ) and a first electrically insulating layer formed thereon. In the circuit board, a first conductor layer has a surface roughness Ra of 0.1 nm or more but less than 100 nm, and a first primer layer having a thiol compound as a main material is provided between the first conductive layer and the first electrically insulating layer. Thus, the circuit board which has excellent adhesiveness between the first conductor layer and the first electrically insulating layer and is also applicable to high frequency signal is provided.
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Description

technical field

[0001] The present invention relates to a circuit board, and more specifically, relates to a high adhesiveness between a conductor layer and an electrical insulating layer or between electrical insulating layers, and the noise of the conductor layer and the crosstalk or radiation noise between adjacent conductors (wiring) are not easy. Circuit boards used in high-frequency signals passing through circuits, electronic devices using circuit boards, and methods of manufacturing circuit boards. Here, the conductor layer may be either a layer composed only of a conductor or a layer including a circuit formed of a conductor. Background technique

[0002] Along with miniaturization and multifunctionalization of electronic equipment, circuit boards used in electronic equipment are required to be further dense.

[0003] Multilayering of circuit boards is well known as a general method for increasing the density of circuit boards. A multilayered circuit board (multil...

Claims

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