Prepn process of low temperature double ion beam sputtered multilayer Ge/Si film with self-organized Ge quantum dots
The technology of ion beam sputtering and double ion beam is applied in the field of preparation of refrigerated near-infrared photon detector thin film materials, which can solve the problems of high production cost, unfavorable large-scale industrial production, complicated process and the like, and achieves low production cost, The effect of satisfying quantum size effect and improving film quality
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Examples
Embodiment 1
[0022] The equipment used is the FJL560III ultra-high vacuum magnetron and ion beam combined sputtering equipment of the prior art. Two ion beam sputtering guns are placed in the growth chamber, one ion gun is used for sputtering Ge targets, and the other ion gun is used for For sputtering Si targets. The used targets are high-purity Si square targets and high-purity Ge square targets with a purity of 5N (the content is above 99.999%). The Si substrate material used is a P-type single crystal Si wafer with a crystal orientation of (100), polished on one side, and the resistivity is 5Ω / cm. The sputtering gas uses high-purity argon with a purity of 5N. For ultrasonic cleaning, a commercially available ultrasonic cleaner was used. specifically is:
[0023] Carry out following treatment to Si(100) substrate with prior art:
[0024] A. Choose a Si single-sided polished substrate with a crystal orientation of (100), first use toluene to ultrasonically clean it for 20 minutes to ...
Embodiment 2
[0032] The equipment and materials used are all the same as in Example 1. specifically is:
[0033] Carry out following treatment to Si(100) substrate with prior art:
[0034] A. Choose a Si single-sided polished substrate with a crystal orientation of (100), first use toluene to ultrasonically clean it for 20 minutes to remove surface organic matter, then use acetone to ultrasonically clean it for 10 minutes, and then use absolute ethanol to circulate ultrasonically for 10 minutes. Acetone, Alternative ultrasonic cleaning with absolute ethanol is a cycle, and a total of 5 cycles are washed to remove toluene, acetone and inorganic impurity ions;
[0035] B, the cleaned Si substrate is put into the diluted hydrofluoric acid solution, that is, by the volume ratio of 40% HF solution: pure water=1:40, the solution obtained after diluting the hydrofluoric acid is soaked for 20s , bleach the oxide layer on the surface of the Si substrate, and then dry it with nitrogen with a purit...
Embodiment 3
[0042] The equipment and materials used are all the same as in Example 1. specifically is:
[0043] Carry out following treatment to Si(100) substrate with prior art:
[0044] A. Choose a Si single-sided polished substrate with a crystal orientation of (100), first use toluene to ultrasonically clean it for 20 minutes to remove surface organic matter, then use acetone to ultrasonically clean it for 10 minutes, and then use absolute ethanol to circulate ultrasonically for 10 minutes. Acetone, Alternative ultrasonic cleaning with absolute ethanol is a cycle, and a total of 4 cycles are washed to remove toluene, acetone and inorganic impurity ions;
[0045] B, the cleaned Si substrate is put into the dilute solution of hydrofluoric acid, that is, by the volume ratio of 40% HF solution: pure water=1:40 by concentration, the solution obtained after diluting hydrofluoric acid is soaked for 15s , float off the oxide layer on the surface of the Si wafer, and then dry it with nitroge...
PUM
Property | Measurement | Unit |
---|---|---|
thickness | aaaaa | aaaaa |
thickness | aaaaa | aaaaa |
size | aaaaa | aaaaa |
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com