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Method for processing an electronic part

a technology of electronic parts and adhesives, applied in the direction of adhesive additives, lamination, electrical appliances, etc., can solve the problems of unsatisfactory releasability of electronic parts from adhesive tapes, electronic parts are likely to be damaged by impact, and large number of semiconductor wafers of today are susceptible to breakage. , to achieve the effect of excellent releasability of electronic parts

Inactive Publication Date: 2005-08-11
ASAHI KASEI CHEM CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

The present invention provides a gas-generating, pressure-sensitive adhesive composition that can be used to temporarily attach electronic parts to a substratum for processing without causing breakage of the electronic part. The composition includes a pressure-sensitive adhesive and a gas generator compound that generates gas upon irradiation with a radiation. The gas effuses at the interface between the adhesive and the substratum to facilitate easy release of the electronic part from the adhesive after processing. The use of this adhesive composition allows for efficient processing of electronic parts without causing breakage.

Problems solved by technology

As a result, a large number of semiconductor wafers of today are susceptible to breakage due to external force.
However, the irradiation-curable adhesive tape. even after curing, still exhibits a high adhesion strength to the electronic part and, hence, the releasability of the electronic part from the adhesive tape is unsatisfactory.
In addition, trays conventionally used for transporting or mounting electronic parts also have a problem in that, when the electronic parts are placed on the trays, the electronic parts will move on the trays, so that the electronic parts are likely to be damaged by impact or to be influenced by static electricity.
However, the releasability of an electronic part from the adhesive tape disclosed in this patent document is unsatisfactory.

Method used

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  • Method for processing an electronic part
  • Method for processing an electronic part
  • Method for processing an electronic part

Examples

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Effect test

example 1

In which a glycidyl azide polymer (GAP), which is a polymer having an azido group, was solely used as a gas generator compound

[0105] A glycidyl aside polymer (GAP) having a weight average molecular weight of about 2,500 and having OH groups at both terminals thereof was synthesized in accordance with a method disclosed in U.S. Pat. No. 4,268,450. The GAP was spread over a substratum to form a thin coating having a thickness of about 3 mm. On the resultant GAP coating was placed a cover glass (for microscope observation) (width and length: 18 mm×18 mm, thickness: about 0.15 mm). The GAP coating was irradiated with an ultraviolet radiation (115 V, 60 Hz, 0.16 A) by means of a UV lamp (MODEL UVGL-58, manufactured and sold by San Gabriel. U.S.A.) for about 10 minutes, wherein the irradiation was conducted from a position about 1 cm above the glass plate. As a result, a number of nitrogen gas bubbles generated from the GAP coating were observed at an interface between the glass plate an...

example 2

In which a glycidyl azide polymer (GAP), which is a polymer having an azido group, was used in combination with a compound serving as a crosslinking agent

[0106] 100 g of a glycidyl azide polymer (GAP) (having a weight average molecular weight of about 2,500 and having OH groups at both terminals thereof) synthesized in substantially the same manner as in Example 1 was placed in a mold having its surface covered with a Teflon sheet. To the GAP were added and mixed well 3.6 g of IPDI (isophorone diisocyanate) (VESTANATA IPDI, manufactured and sold by Degussa-Hals Japan Co., Ltd., Japan) and 8.7 g of TPA-100 (one product of DURANATE series, manufactured and sold by ASAHI KASRI Corporation, Japan) which is a trifunctional isocyanate and an adduct of hexamethylene diisocyanate (which IPDI and TPA-100 were used as a crosslinking agent), thereby obtaining a gas-generating, pressure-sensitive adhesive composition. The obtained gas-generating, pressure-sensitive adhesive composition was spr...

example 3

In which a glycidyl azide polymer (GAP), which is a polymer having an azido group, was used in combination with an ultraviolet-curable resin

[0110] A glycidyl azide polymer (GAP) having a weight average molecular weight of about 2,500 and having OH groups at both terminals thereof was synthesized in the same manner as in Example 1. The obtained GAP and an APR resin (photosensitive resin manufactured and sold by ASAHI KASEI Corporation, Japan, which is a polyurethane resin modified with a carboxylic acid) were mixed in a weight ratio of 1:1 to obtain a gas-generating, pressue-sensitive adhesive composition. The obtained gas-generating, pressure-sensitive adhesive composition was spread over a substratum to form a thin coating having a thickness of about 2.5 mm. On the gas-generating, pressure-sensitive adhesive composition coating was placed the same glass plate as used in Example 1 so as to adhere the glass plate to the gas-generating, pressure-sensitive adhesive composition coating...

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Abstract

Disclosed is a gas-generating, pressure-sensitive adhesive composition comprising a pressure-sensitive adhesive (A) transmitting therethrough a radiation selected from the group consisting of an electromagnetic radiation, an electron radiation and an alpha radiation, and a gas generator compound (B) which generates a gas upon irradiation thereof with the radiation, wherein the gas generator compound (B) is operably combined with the pressure-sensitive adhesive (A), so that, in operation, when the gas-generating, pressure-sensitive adhesive composition which is adhered to an adherend is irradiated with the radiation, the gas generator compound (B) generates a gas and the gas effuses at an interface between the gas-generating, pressure-sensitive adhesive composition and the adherend to thereby facilitate release of the adherend from the gas-generating, pressure-sensitive adhesive composition.

Description

BACKGROUND OF THE INVENTION [0001] 1. Field of the Invention [0002] The present invention relates to a gas-generating, pressure-sensitive adhesive composition. More particularly, the present invention is concerned with a gas-generating, pressure-sensitive adhesive composition comprising: a pressure-sensitive adhesive (A) transmitting therethrough a radiation selected from the group consisting of an electromagnetic radiation, an electron radiation and an alpha radiation; and a gas generator compound (B) which generates a gas upon irradiation thereof with the radiation. In the gas-generating, pressure-sensitive adhesive composition of the present invention, the gas generator compound (B) is operably combined with the pressure-sensitive adhesive (A), so that, in operation, when the gas-generating, pressure-sensitive adhesive composition which is adhered to an adherend is irradiated with the radiation, the gas generator compound (B) generates a gas and the gas effuses at an interface be...

Claims

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Application Information

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Patent Type & Authority Applications(United States)
IPC IPC(8): B29C65/76C09J5/00C09J11/06H01L21/00H01L21/68
CPCB29C65/76Y10T156/1158C09J11/06C09J2203/326H01L21/67132H01L21/6835H01L21/6836H01L2221/68318H01L2221/68327H01L2924/19041C09J5/00Y10T428/287B29C66/9161Y10T428/2809Y10T156/19Y10T428/2891B29C65/00
Inventor MITARAI, YOSHIAKI
Owner ASAHI KASEI CHEM CORP
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