Method for processing an electronic part

a technology of electronic parts and adhesives, applied in the direction of adhesive additives, lamination, electrical appliances, etc., can solve the problems of unsatisfactory releasability of electronic parts from adhesive tapes, electronic parts are likely to be damaged by impact, and large number of semiconductor wafers of today are susceptible to breakage. , to achieve the effect of excellent releasability of electronic parts

Inactive Publication Date: 2005-08-11
ASAHI KASEI CHEM CORP
View PDF13 Cites 14 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

[0018] In this situation, the present inventors have made extensive and intensive studies with a view toward developing an adhesive composition for temporarily attaching an electronic part (such as a semiconductor wafer) to a substratum (working platform), which has an excellent releasability from an electronic part and, hence, is advantageous in that, after the electronic part is securely attached to the adhesive composition and worked, the electronic part can be easily released from the adhesive composition without putting a high load on the electronic part.
[0019] As a result, it has unexpectedly been found that the desired adhesive composition can be realized by a specific gas-generating, pressure-sensitive adhesive composition comprising: a pressure-sensitive adhesive (A) transmitting therethrough a radiation selected from the group consisting of an electromagnetic radiation, an electron radiation and an alpha radiation; and a gas generator compound (B) which generates a gas upon irradiation thereof with the radiation. More specifically, in the specific gas-generating, pressure-sensitive adhesive composition, the gas generator compound (B) is operably combined with the pressure-sensitive adhesive (A), so that, in operation, when the gas-generating, pressure-sensitive adhesive composition which is adhered to an adherend is irradiated with the radiation, the gas generator compound (B) generates a gas and the gas effuses at an interface between the gas-generating, pressure-sensitive adhesive composition and the adherend to thereby facilitate release of the adherend from the gas-generating, pressure-sensitive adhesive composition. Further, in the working (e.g., grinding or cutting) of an electronic part, such as a precision electronic part, a substrate for an electronic appliance, or a semiconductor part (e.g., a semiconductor wafer), when the gas-generating, pressure-sensitive adhesive composition is used as an adhesive for temporarily attaching the electronic part to a substratum (working platform) or the like, various advantageous are brought about. That is, it is possible not only to attach the electronic part securely to the substratum or the like, but also to remarkably improve the releasability of the electronic part from the gas-generating, pressure-sensitive adhesive composition upon irradiation of the composition with a radiation (which is generally applied to in the processing of the electronic part), so that, after the working (e.g., grinding or cutting) of the electronic part, the electronic part can be easily released from the gas-generating, pressure-sensitive adhesive composition without putting a high load on the electronic part. Based on these novel findings, the present invention has been completed.
[0020] Accordingly, it is a primary object of the present invention to provide a gas-generating, pressure-sensitive adhesive composition which can be used for efficiently conducting the processing of the electronic part without causing breakage of the electronic part.
[0021] It is another object of the present invention to provide a method for efficiently processing an electronic part without causing breakage of the electronic part, wherein a specific gas-generating, pressure-sensitive adhesive reagent, such as the above-mentioned gas-generating, pressure-sensitive adhesive composition, is used.

Problems solved by technology

As a result, a large number of semiconductor wafers of today are susceptible to breakage due to external force.
However, the irradiation-curable adhesive tape. even after curing, still exhibits a high adhesion strength to the electronic part and, hence, the releasability of the electronic part from the adhesive tape is unsatisfactory.
In addition, trays conventionally used for transporting or mounting electronic parts also have a problem in that, when the electronic parts are placed on the trays, the electronic parts will move on the trays, so that the electronic parts are likely to be damaged by impact or to be influenced by static electricity.
However, the releasability of an electronic part from the adhesive tape disclosed in this patent document is unsatisfactory.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Method for processing an electronic part
  • Method for processing an electronic part
  • Method for processing an electronic part

Examples

Experimental program
Comparison scheme
Effect test

example 1

In which a glycidyl azide polymer (GAP), which is a polymer having an azido group, was solely used as a gas generator compound

[0105] A glycidyl aside polymer (GAP) having a weight average molecular weight of about 2,500 and having OH groups at both terminals thereof was synthesized in accordance with a method disclosed in U.S. Pat. No. 4,268,450. The GAP was spread over a substratum to form a thin coating having a thickness of about 3 mm. On the resultant GAP coating was placed a cover glass (for microscope observation) (width and length: 18 mm×18 mm, thickness: about 0.15 mm). The GAP coating was irradiated with an ultraviolet radiation (115 V, 60 Hz, 0.16 A) by means of a UV lamp (MODEL UVGL-58, manufactured and sold by San Gabriel. U.S.A.) for about 10 minutes, wherein the irradiation was conducted from a position about 1 cm above the glass plate. As a result, a number of nitrogen gas bubbles generated from the GAP coating were observed at an interface between the glass plate an...

example 2

In which a glycidyl azide polymer (GAP), which is a polymer having an azido group, was used in combination with a compound serving as a crosslinking agent

[0106] 100 g of a glycidyl azide polymer (GAP) (having a weight average molecular weight of about 2,500 and having OH groups at both terminals thereof) synthesized in substantially the same manner as in Example 1 was placed in a mold having its surface covered with a Teflon sheet. To the GAP were added and mixed well 3.6 g of IPDI (isophorone diisocyanate) (VESTANATA IPDI, manufactured and sold by Degussa-Hals Japan Co., Ltd., Japan) and 8.7 g of TPA-100 (one product of DURANATE series, manufactured and sold by ASAHI KASRI Corporation, Japan) which is a trifunctional isocyanate and an adduct of hexamethylene diisocyanate (which IPDI and TPA-100 were used as a crosslinking agent), thereby obtaining a gas-generating, pressure-sensitive adhesive composition. The obtained gas-generating, pressure-sensitive adhesive composition was spr...

example 3

In which a glycidyl azide polymer (GAP), which is a polymer having an azido group, was used in combination with an ultraviolet-curable resin

[0110] A glycidyl azide polymer (GAP) having a weight average molecular weight of about 2,500 and having OH groups at both terminals thereof was synthesized in the same manner as in Example 1. The obtained GAP and an APR resin (photosensitive resin manufactured and sold by ASAHI KASEI Corporation, Japan, which is a polyurethane resin modified with a carboxylic acid) were mixed in a weight ratio of 1:1 to obtain a gas-generating, pressue-sensitive adhesive composition. The obtained gas-generating, pressure-sensitive adhesive composition was spread over a substratum to form a thin coating having a thickness of about 2.5 mm. On the gas-generating, pressure-sensitive adhesive composition coating was placed the same glass plate as used in Example 1 so as to adhere the glass plate to the gas-generating, pressure-sensitive adhesive composition coating...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

PropertyMeasurementUnit
thicknessaaaaaaaaaa
sizeaaaaaaaaaa
decomposition temperatureaaaaaaaaaa
Login to view more

Abstract

Disclosed is a gas-generating, pressure-sensitive adhesive composition comprising a pressure-sensitive adhesive (A) transmitting therethrough a radiation selected from the group consisting of an electromagnetic radiation, an electron radiation and an alpha radiation, and a gas generator compound (B) which generates a gas upon irradiation thereof with the radiation, wherein the gas generator compound (B) is operably combined with the pressure-sensitive adhesive (A), so that, in operation, when the gas-generating, pressure-sensitive adhesive composition which is adhered to an adherend is irradiated with the radiation, the gas generator compound (B) generates a gas and the gas effuses at an interface between the gas-generating, pressure-sensitive adhesive composition and the adherend to thereby facilitate release of the adherend from the gas-generating, pressure-sensitive adhesive composition.

Description

BACKGROUND OF THE INVENTION [0001] 1. Field of the Invention [0002] The present invention relates to a gas-generating, pressure-sensitive adhesive composition. More particularly, the present invention is concerned with a gas-generating, pressure-sensitive adhesive composition comprising: a pressure-sensitive adhesive (A) transmitting therethrough a radiation selected from the group consisting of an electromagnetic radiation, an electron radiation and an alpha radiation; and a gas generator compound (B) which generates a gas upon irradiation thereof with the radiation. In the gas-generating, pressure-sensitive adhesive composition of the present invention, the gas generator compound (B) is operably combined with the pressure-sensitive adhesive (A), so that, in operation, when the gas-generating, pressure-sensitive adhesive composition which is adhered to an adherend is irradiated with the radiation, the gas generator compound (B) generates a gas and the gas effuses at an interface be...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Applications(United States)
IPC IPC(8): B29C65/76C09J5/00C09J11/06H01L21/00H01L21/68
CPCB29C65/76Y10T156/1158C09J11/06C09J2203/326H01L21/67132H01L21/6835H01L21/6836H01L2221/68318H01L2221/68327H01L2924/19041C09J5/00Y10T428/287B29C66/9161Y10T428/2809Y10T156/19Y10T428/2891B29C65/00
Inventor MITARAI, YOSHIAKI
Owner ASAHI KASEI CHEM CORP
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap