Cmp Polishing Slurry and Method of Polishing Substrate
a technology of polishing slurry and substrate, which is applied in the direction of lapping machines, manufacturing tools, other chemical processes, etc., can solve the problems of not having practical useable shallow trench isolation properties, reducing the difference in residual film thickness, and lowering the polishing speed. , to achieve the effect of small residual film thickness differen
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Example 1
Preparation of Supplementary Solution
[0084]1,000 g of deionized water and 200 g of 2-propanol were placed in a 3-L preparative flask and heated to 90° C. under nitrogen gas atmosphere; a mixture of 561 g of a methacrylic acid and 64 g of deionized water and a solution of 64 g of 2,2′-azobis[2-(2-imidazolin-2-yl)propane]bisulfate dihydrate salt dissolved in 536 g of deionized water were added respectively into the flask over 2 hours. The mixture was then kept at 90° C. for 3 hours and cooled, to give a supplementary solution, a polymethacrylic acid solution containing a polymer (D).
[0085]The content of the nonvolatile matter therein was found to be 25 mass %. The weight-average molecular weight of the polymethacrylic acid solution thus obtained, as determined with a HPLC pump (Model No. L-7100, manufactured by Hitachi, Ltd.) equipped with a differential refractometer (Model No. L-3300, manufactured by Hitachi, Ltd.) and a GPC column (Model No. Gelpack GL-W550, manufactured b...
example 2
Preparation of Supplementary Solution
[0095]600 g of deionized water and 600 g of 2-propanol were placed in a 3-L preparative flask and heated to 85° C. under nitrogen gas atmosphere; a mixture of 536 g of a methacrylic acid and 45 g of an acrylic acid and a solution of 32 g of ammonium persulfate dissolved in 600 g of deionized were added respectively into the flask over 2 hours. The mixture was then kept at 85° C. for 3 hours and cooled, to give a supplementary solution, a polyacrylic acid-90 mol % methacrylic acid copolymer solution (methacrylic acid:acrylic acid=9:1). The content of the nonvolatile matter therein was found to be 25 mass %. The weight-average molecular weight of the polyacrylic acid-90 mol % methacrylic acid copolymer thus obtained, as determined in the same manner as in Example 1, was 23,000 (as polyethylene glycol).
[0096](Preparation of Polishing Slurry)
[0097]36 g of the supplementary solution thus obtained, polyacrylic acid-90 mol % methacrylic acid copolymer s...
example 3
Preparation of Supplementary Solution
[0100]1,000 g of deionized water and 200 g of 2-propanol were placed in a 3-L preparative flask and heated to 90° C. under nitrogen gas atmosphere; a mixture of 401 g of a methacrylic acid and 134 g of an acrylic acid and a solution of 59 g of 2,2′-azobis[2-(2-imidazolin-2-yl)propane] dissolved in 589 g of aqueous 5 mass % sulfuric acid were added respectively into the flask over 2 hours. The mixture was then kept at 90° C. for 3 hours and cooled, to give a supplementary solution, polyacrylic acid-70 mol % methacrylic acid copolymer solution. The content of the nonvolatile matter therein was found to be 25 mass %. The weight-average molecular weight of the polyacrylic acid-70 mol % methacrylic acid copolymer thus obtained, as determined in the same manner as in Example 1, was 22,000 (as polyethylene glycol).
[0101](Preparation of Polishing Slurry)
[0102]36 g of the supplementary solution thus obtained, polyacrylic acid-70 mol % methacrylic acid cop...
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