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Laser induced selective chemical plating process

A laser-induced and electroless plating technology, applied in liquid electroless plating, coating, electrical components, etc., to achieve the effect of less process, good bonding force and simple operation

Inactive Publication Date: 2008-07-30
SHANGHAI JIAO TONG UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Polyvinylpyrrolidone / silver colloid has not been reported as a precursor for electroless plating

Method used

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  • Laser induced selective chemical plating process
  • Laser induced selective chemical plating process

Examples

Experimental program
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Effect test

Embodiment 1

[0016] (1) Preparation of polyvinylpyrrolidone / silver colloid: weigh 0.10g of silver nitrate and add it to 10mL of ethanol solvent, stir and dissolve at 20°C, then weigh 0.2g of polyvinylpyrrolidone and add it to the silver nitrate ethanol solution , stirred at 20°C until completely dissolved to obtain polyvinylpyrrolidone / silver colloid;

[0017] (2) Coating of polyvinylpyrrolidone / silver colloid: the prepared polyvinylpyrrolidone / silver colloid is evenly coated on the polyimide film by spin coating, and dried naturally to obtain surface-covered polyvinylpyrrolidone / silver colloid. Polyimide film of silver colloid;

[0018] (3) The polyimide film whose surface is covered with polyvinylpyrrolidone / silver colloid is subjected to laser radiation: the polyimide film whose surface is covered with polyvinylpyrrolidone / silver colloid is placed on the sample stage of the laser device, figure 1 It is a schematic diagram of the laser device. The laser is focused, and the computer prog...

Embodiment 2

[0021] (1) Preparation of polyvinylpyrrolidone / silver colloid: weigh 0.05g of silver nitrate and add it to 10mL of N,N-dimethylformamide solvent, stir and dissolve at 20°C, then weigh 0.15g of polyethylene Pyrrolidone was added to silver nitrate N,N-dimethylformamide solution, stirred at 20°C until completely dissolved to obtain polyvinylpyrrolidone / silver colloid;

[0022] (2) Coating of polyvinylpyrrolidone / silver colloid: the prepared polyvinylpyrrolidone / silver colloid is evenly coated on a silicon wafer by dip coating, and dried naturally to obtain surface-covered polyvinylpyrrolidone / silver colloid. Silicon wafer;

[0023] (3) The silicon wafer covered with polyvinylpyrrolidone / silver colloid is subjected to laser radiation: the silicon wafer covered with polyvinylpyrrolidone / silver colloid is placed on the sample stage of the laser device, the laser is focused, and the computer program controls the beam or sample The movement of the stage, the wavelength of the laser i...

Embodiment 3

[0026] (1) Preparation of polyvinylpyrrolidone / silver colloid: weigh 0.15g of silver acetate and add it to 10mL of N,N-dimethylacetamide solvent, stir and dissolve at 20°C, then weigh 0.15g of polyethylene Pyrrolidone was added to silver acetate N,N-dimethylacetamide solution, stirred at 20°C until completely dissolved to obtain polyvinylpyrrolidone / silver colloid;

[0027] (2) Coating of polyvinylpyrrolidone / silver colloid: the prepared polyvinylpyrrolidone / silver colloid is uniformly coated on a glass sheet by dip coating, and dried naturally to obtain glass covered with polyvinylpyrrolidone / silver colloid piece;

[0028] (3) The glass sheet covered with polyvinylpyrrolidone / silver colloid is subjected to laser radiation: the glass sheet covered with polyvinylpyrrolidone / silver colloid is placed on the sample stage of the laser device, the laser is focused, and the computer program controls the beam or sample The movement of the stage, the wavelength of the laser is selecte...

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Abstract

The present invention discloses one kind of laser induced selective chemical plating process. The substrate is first coated with polyvinyl pyrrolidone / silver colloid and selectively irradiated with focused laser beam, so that the silver ions in the colloid silver within the irradiated areas are reduced into metal silver particles embedded into the substrate, with the colloid silver in the un-irradiated areas being eliminated. The substrate is then plated chemically to form micron level patterns of chemical plating on the substrate. The process is simple, simple in operation, low in cost and less polluted, the pattern is computer controllable and has high resolution and selectivity, and the plating has well combination to the substrate. The present invention has excellent application foreground in circuit board manufacture, integrated circuit and other electronic industry fields.

Description

Technical field: [0001] The invention belongs to a method for metallizing the surface of non-metallic materials, in particular to a method for reducing silver in polyvinylpyrrolidone / silver colloid induced by laser and performing chemical plating with the reduced silver particles as active species. Background technique: [0002] In the circuit board manufacturing industry, electroless plating technology is widely used because it can plate metal on non-metallic surfaces and is cheap and operable at room temperature. However, the steps of traditional electroless plating technology are cumbersome, and the surface treatment requires six steps of (alkali) cleaning, surface adjustment, micro-etching, pre-dipping, catalysis, and degumming. The operation is inconvenient and time-consuming, the pollution is large, and it is difficult to micronize Production thus limits some of its applications. With the development of integrated circuits, electroless plating technology is developing...

Claims

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Application Information

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IPC IPC(8): C23C18/14H05K3/02
Inventor 路庆华陈东升
Owner SHANGHAI JIAO TONG UNIV
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