Diamond film polishing method
A diamond film and alloy technology, applied in the polishing field of diamond film, can solve problems such as unsatisfactory methods, and achieve the effects of reducing polishing cost, high polishing efficiency and strong etching ability
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Embodiment 1
[0024] The polishing method of diamond film, it comprises the steps:
[0025] 1) Deposit Ti metal, a strong carbide-forming element, on the surface of a clean diamond film by magnetron sputtering deposition method, with a power of 200W, and the diamond film is heated to 300°C for 10 minutes, and the thickness of the Ti film (coating) is about 10μm;
[0026] 2), heat the diamond film coated with Ti film on the surface in a vacuum furnace, and heat it at 1150°C with a vacuum degree of 10 -2 Pa vacuum heat treatment for 30 minutes, a titanium carbide layer is formed on the surface, and the thickness of titanium carbide is about 0.5 μm;
[0027] 3) On the UNIPOL802 precision polishing machine, use SiC as the abrasive to polish at room temperature, the abrasive particle size is below 0.5 μm, and the speed is 200 rpm, and the polishing is performed for 5 minutes.
[0028] 4), the diamond film is ultrasonically cleaned with acetone solvent, and oxygen plasma etching is carried out ...
Embodiment 2
[0031] Mix the strong carbide forming element Ti metal powder and copper powder (mass ratio 7: 3) in acetone evenly, apply it on the clean diamond film surface with a thickness of about 1 mm, dry, vacuum heat treatment and other follow-up steps are the same as in the embodiment 1. Repeat the above process 5 times, the surface roughness reaches about 0.1 μm, and the flatness is less than 150 nm.
Embodiment 3
[0033] The polishing method of diamond film, it comprises the steps:
[0034] 1), using the electron beam evaporation plating method, the metal W capable of forming strong carbides with carbon is coated on the surface of the diamond film to obtain a diamond film coated with metal W on the surface, and the thickness of the W film is about 5 μm;
[0035] 2), heating in a vacuum furnace, vacuum degree 10 -1 Pa, the heating temperature is 1000°C, the time is 15 minutes, a carbide layer is formed on the surface, and the thickness of the WC layer is about 0.2 μm;
[0036] 3), on commercially available common mechanical polishing machine, adopt SiC that hardness is lower than diamond as abrasive, diamond film is polished, time 5 minutes, remove the protruding part of crystal grain tip portion on the surface of diamond film; Low, only the carburized part of the protruding part of the grain on the surface of the diamond film can be thrown away, and the tungsten carbide layer in other ...
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