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Substrate for flexible organic optoelectric device and preparation thereof

A technology for optoelectronic devices and substrates, which is applied in the fields of electro-solid devices, semiconductor/solid-state device manufacturing, photovoltaic power generation, etc., can solve problems such as poor adhesion between conductive films and substrates, reduce production costs and process difficulties, and achieve excellent results. The effect of improving flatness

Inactive Publication Date: 2009-05-06
UNIV OF ELECTRONICS SCI & TECH OF CHINA
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] The technical problem to be solved by the present invention is how to provide a flexible organic optoelectronic device substrate and its preparation method. The substrate solves the problem of poor adhesion between the deposited conductive film and the substrate due to the low surface energy of the flexible substrate, and improves the The barrier properties of the substrate to water and oxygen, and at the same time have a good smoothing effect on the substrate surface; the preparation method is simple and effective, can greatly reduce the production cost and process difficulty of the substrate, and improve the yield rate of the substrate in the etching process

Method used

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  • Substrate for flexible organic optoelectric device and preparation thereof
  • Substrate for flexible organic optoelectric device and preparation thereof
  • Substrate for flexible organic optoelectric device and preparation thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0102] Such as figure 1 As shown in the substrate structure, the flexible substrate 1 adopts a flexible polyethylene terephthalate polymer (PET) substrate, the adhesive layer 2 adopts a single-layer structure, and the conductive film 3 is ITO transparent and conductive by DC magnetron sputtering. film. The transmittance test curve is as figure 2 shown.

[0103] The preparation method is as follows:

[0104] ①Use detergent, acetone solution, ethanol solution and deionized water to ultrasonically clean the PET substrate, and dry it with dry nitrogen after cleaning;

[0105] ② Stir the adhesive diluted 1:10 with ethanol for 20 hours, then spin-coat on the PET surface at a speed of 2000 rpm for one minute, and the film thickness is about 100 nanometers.

[0106] Wherein the ratio of adhesive raw material components is:

[0107] Polythiol-polyene system 95%

[0108] Monofunctional or polyfunctional acrylic acid 1%

[0109] Photoinitiator 1.5%

[0110] Photosensitizers and ...

Embodiment 2

[0116] Such as figure 1 In the shown substrate structure, the flexible substrate 1 is made of a flexible metal foil, the adhesive layer 2 is made of a single-layer adhesive, and the conductive film 3 is an ITO transparent conductive film made by DC magnetron sputtering.

[0117] The preparation method is as follows:

[0118] ①Use detergent, acetone solution, ethanol solution and deionized water to ultrasonically clean the flexible metal foil, and dry it with dry nitrogen after cleaning;

[0119] ② Stir the adhesive diluted 1:1 with ethanol for 30 hours, then spin-coat it on the surface of the flexible metal foil at a speed of 3000 rpm for 1 minute, and the film thickness is about 200 nanometers;

[0120] Wherein the ratio of adhesive raw material components is:

[0121] Polythiol-polyene system 98%

[0122] Monofunctional or polyfunctional acrylic acid 1.5%

[0123] Photoinitiator 1.5%

[0124] Photosensitizers and additives 2%

[0125] ③UV curing treatment on the surfac...

Embodiment 3

[0129] Such as figure 1 In the substrate structure shown, the flexible substrate 1 is a PET substrate, the bonding layer 2 is a single-layer adhesive, and the conductive film 3 is a metal conductive film prepared by thermal evaporation.

[0130] ①Use detergent, acetone solution, ethanol solution and deionized water to ultrasonically clean the surface of the PET substrate, and dry it with dry nitrogen after cleaning;

[0131] ② Stir the adhesive diluted 1:10 with ethanol for 20 hours, then spin-coat on the PET surface at a speed of 2000 rpm for one minute, and the film thickness is about 100 nanometers;

[0132] ③Irradiate the surface of the substrate with ultraviolet light for 30 seconds;

[0133] ④Put the substrate into a vacuum chamber, and evaporate a 100nm thick metal conductive film on the surface of the PET substrate by thermal evaporation at room temperature;

[0134] ⑤After taking the substrate out of the vacuum chamber, irradiate with ultraviolet light for 60 second...

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Abstract

The invention discloses a base plate for a flexible optoelectronic device, which comprises a flexible underlay. The base plate is characterized in that a binding layer and a conducting film are arranged on the surface of the flexible underlay; the conducting film is deposited on the surface of the binding layer; the binding layer is made of an adhesive required to be solidified by ultraviolet light; the raw material of the adhesive comprises the following componentsof polythiol-polyene system, simple function group or polyfunctional group acrylic acid, a photoinitiator, a photosensitizer and an additive. The base plate solves the problem that the cohesion of the conducting film deposited and the underlay is bad due to low energy on the surface of the flexible underlay, improves the blocking performance of the underlay to water oxygen, and simultaneously plays a good smoothing role in the surface of the underlay; and the preparation method is simple and effective, the production cost and the process difficulty of the base plate can be greatly reduced, and the yield rate of the base plate during the etching process is improved.

Description

technical field [0001] The invention relates to the technical field of organic optoelectronic devices, in particular to a flexible organic optoelectronic device substrate and a preparation method thereof. Background technique [0002] Optoelectronics technology is a rapidly developing industry with high technological content after microelectronics technology. With the rapid development of optoelectronic technology, optoelectronic products such as solar cells, optical image sensors, plasma flat panel displays, electroluminescent displays, thin film transistors, and liquid crystal display panels have gradually matured, and they have greatly improved human life. At the same time, the wide application of optoelectronic information technology in various fields of social life has also created a huge growing market. Developed countries regard the optoelectronic information industry as one of the key development areas, and the competition in the optoelectronic information field is ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L51/00H01L51/44H01L51/46H01L51/48H01L51/52H01L51/54H01L51/56C09J4/00H10K99/00
CPCY02E10/50Y02E10/549Y02P70/50
Inventor 于军胜蒋亚东李璐林慧
Owner UNIV OF ELECTRONICS SCI & TECH OF CHINA
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