Liquid crystal sealing agent and liquid crystal display cell using the same
A liquid crystal sealant, epoxy resin technology, applied in the directions of liquid crystal materials, adhesive additives, non-polymer adhesive additives, etc., can solve the problems of reducing the specific resistance of liquid crystal, insufficient adhesive strength, contamination of the sealant, etc. Best dispensing processability and lamination, low possibility of contamination of liquid crystal, effect of improving yield and productivity
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment 1
[0087] 75 parts by weight of epoxy acrylate resin KAYARAD R-94220 (epoxy acrylate of bisphenol F epoxy resin, manufactured by Nippon Kayaku Co., Ltd.), 25 parts by weight of epoxy resin RE-203 (ethylene oxide added bisphenol S epoxy resin; epoxy equivalent: 233 g / equivalent, manufactured by Nippon Kayaku Co., Ltd.), 5 parts by weight of photopolymerization initiator KAYACURERPI-4 (2-isocyanate Reaction product of acidoethyl methacrylate and 2-hydroxy-1-[4-(2-hydroxyethoxy)phenyl]-2-methylpropan-1-one, manufactured by Nippon Kayaku Co., Ltd. ) and 1.5 parts by weight of silane coupling agent Sila-Ace S-510 (3-glycidoxypropyltrimethoxysilane, manufactured by ChissoCorp.) were mixed to obtain a resin solution. Then, in a bead mill, 17.5 parts by weight of NanoTek Alumina SPC (spherical alumina, average particle size: 50 nm, manufactured by C.I. Kasei Co., Ltd.) and 1.5 parts by weight of butadiene / alkyl methacrylate / styrene copolymer (Paraloid EXL-2655, manufactured by Rohm and ...
Embodiment 2
[0089] 75 parts by weight of epoxy acrylate resin KAYARAD R-94220 (the epoxy acrylate of bisphenol F epoxy resin, manufactured by Nippon Kayaku Co., Ltd.), 25 parts by weight of epoxy resin RE-203 (ethylene oxide plus into bisphenol S epoxy resin; epoxy equivalent: 233 grams / equivalent, manufactured by Nippon Kayaku Co., Ltd.), 5 parts by weight of photopolymerization initiator KAYACURE RPI-4 (2-isocyanatoethyl methacrylate A reaction product with 2-hydroxy-1-[4-(2-hydroxyethoxy)phenyl]-2-methylpropan-1-one, manufactured by Nippon Kayaku Co., Ltd.) and 1.5 parts by weight of silane coupling Sila-Ace S-510 (3-glycidoxypropyltrimethoxysilane, manufactured by Chisa Corporation) was mixed to obtain a resin solution. Then, in a sand mill, 17.5 parts by weight of NanoTek Alumina SPC (spherical aluminum oxide, average particle size: 50 nm, manufactured by CI Casa Corporation) and 1.5 parts by weight of butadiene·alkyl methacrylate were used as fillers. · Styrene copolymer (Paraloid ...
Embodiment 3
[0091] 75 parts by weight of epoxy acrylate resin KAYARAD R-94220 (the epoxy acrylate of bisphenol F epoxy resin, manufactured by Nippon Kayaku Co., Ltd.), 25 parts by weight of epoxy resin RE-203 (ethylene oxide plus into bisphenol S epoxy resin; epoxy equivalent: 233 grams / equivalent, manufactured by Nippon Kayaku Co., Ltd.), 5 parts by weight of photopolymerization initiator KAYACURE RPI-4 (2-isocyanatoethyl methacrylate A reaction product with 2-hydroxy-1-[4-(2-hydroxyethoxy)phenyl]-2-methylpropan-1-one, manufactured by Nippon Kayaku Co., Ltd.) and 1.5 parts by weight of silane coupling Sila-Ace S-510 (3-glycidoxypropyltrimethoxysilane, manufactured by Chisa Corporation) was mixed to obtain a resin solution. Then, in a sand mill, 17.5 parts by weight of NanoTek Alumina SPC (spherical aluminum oxide, average particle size: 50 nm, manufactured by CI Casa Corporation) and 1.5 parts by weight of butadiene·alkyl methacrylate were used as fillers. · Styrene copolymer (Paraloid ...
PUM
| Property | Measurement | Unit |
|---|---|---|
| particle size | aaaaa | aaaaa |
| particle size | aaaaa | aaaaa |
| epoxy equivalent | aaaaa | aaaaa |
Abstract
Description
Claims
Application Information
Login to View More - R&D
- Intellectual Property
- Life Sciences
- Materials
- Tech Scout
- Unparalleled Data Quality
- Higher Quality Content
- 60% Fewer Hallucinations
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2025 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com



