Impregnant for preparing copper clad plates

A technology of impregnating materials and copper-clad laminates, which is applied in the field of impregnating materials for spherical barium sulfate, can solve problems such as inappropriateness, and achieve the effects of reducing dosage, reducing wear and prolonging service life

Inactive Publication Date: 2009-11-11
KUSN SIBEITE ELECTRONICS MATERIALS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, the traditional Glauber's salt method barium sulfate is judged as an inorganic material that is not suitable for copper clad laminate fillers.

Method used

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  • Impregnant for preparing copper clad plates
  • Impregnant for preparing copper clad plates

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Embodiment Construction

[0024] The formula of the embodiment of the invention is referring to Table 1:

[0025] Table 1: (unit: weight percentage)

[0026]

[0027] The spherical barium sulfate has a molecular formula whose main body is BaSO 4 Powder material (prepared by sulfuric acid method).

[0028] The resin is at least one of epoxy resin, phenolic resin and cyanophosphoester.

[0029] The hardener is at least one of melamine and diamine-based.

[0030] The accelerator is at least one of imidazoles and aromatic diamines.

[0031] The solvent is at least one of dimethylformamide, butanone, methanol, acetic acid and ethylene glycol.

[0032] The inorganic filler also contains at least one of aluminum hydroxide, magnesium hydroxide, silicon dioxide, kaolin and talc.

[0033] Spherical barium sulfate used in the present invention is prepared by the sulfuric acid method, and the product obtained after processing is a colorless orthorhombic crystal, forming a core-shell structure with a comple...

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Abstract

The invention discloses an impregnant for preparing copper clad plates, which consists of a resin, a hardening agent, an accelerant, solvent and inorganic filler, wherein the inorganic filler contains spherical barium sulfate. Compared with the adding of aluminum hydroxide, the impregnant for preparing the copper-clad plates, for the reason that the added inorganic filler contains the spherical barium sulfate prepared by a sulfuric acid method, can improve the thermal stability and chemical stability of resin materials, strengthen the toughness of the resin, improve the planeness and the fire retardance of the copper clad plates, and improve the electrical properties and the manufacturability of plates; during the production processing and subsequent processing of copper clad plate products, compared with the adding of silicon oxide, the impregnant can reduce the abrasion of equipment, prolong the service life of the equipment, and improve processing accuracy; the spherical barium sulfate is added, so that the impregnant can reduce the consumption of the resin and the solvent, and is favorable for reducing the cost; and the adding of the spherical barium sulfate is favorable for enhancing environmental protection quality of the impregnant so as to improve the comprehensive benefit of the impregnant.

Description

technical field [0001] The invention relates to an impregnating material for glass fiber cloth in the preparation process of copper-clad laminates, in particular to an impregnating material containing spherical barium sulfate prepared by a sulfuric acid method. Background technique [0002] Resin materials are widely used in copper foil substrates, electrodeposition coatings, packaging materials for electronic components, adhesives for heavy anti-corrosion coatings, canned coatings, powder coatings, composite materials, flooring materials, etc. Organic resin materials are expensive, have poor high temperature resistance, and are easy to burn. In order to improve performance and reduce cost, people use some inorganic materials as fillers in resins through a large number of research experiments to improve and improve their performance indicators, enhance flame retardancy, reduce costs, and improve the overall benefits of products. Especially in the printed circuit board indus...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L101/00C08L63/00C08L61/06C08K3/30
Inventor 周洪
Owner KUSN SIBEITE ELECTRONICS MATERIALS
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