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Chemical copper plating solution for polyimide film and surface chemical copper plating method thereof

A technology of polyimide film and electroless copper plating, which is applied in the field of electroless plating, can solve the problems of no more than 50 mg/L, large environmental pollution, etc., and achieve good environmental protection effect

Active Publication Date: 2010-03-31
常熟华虞环境科技有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0005] The present invention aims at the shortcomings that the electroless copper plating solution in the prior art is not suitable for electroless copper plating on the surface of polyimide film and causes great environmental pollution, and provides a kind of electroless copper plating solution for polyimide film. The copper solution is an aqueous solution containing copper salt, ascorbic acid or soluble ascorbate, a complexing agent, a metal catalyst, a stabilizer, and a pH buffer. The pH value of the electroless copper plating solution is 5.5 to 8.0, and the concentration of the stabilizer is not Above 50 mg / L

Method used

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  • Chemical copper plating solution for polyimide film and surface chemical copper plating method thereof

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Embodiment 1

[0031] This embodiment is used to illustrate the electroless copper plating solution and surface electroless copper plating method for the polyimide film provided by the present invention.

[0032] Preparation of electroless copper plating solution: 8 grams of anhydrous copper sulfate, 3.2 grams of ascorbic acid, 25 grams of ethylenediamine tetraacetic acid, 7 mg of potassium ferrocyanide, 0.5 grams of sodium dodecylbenzenesulfonate , 0.8 grams of nickel sulfate hexahydrate, 0.5 milligrams of thiourea and 15 grams of boric acid were dissolved in deionized water to prepare 1 liter of electroless copper plating solution.

[0033] Adjust the pH value of the above electroless copper plating solution to 6.8 with sulfuric acid or ammonia water, and raise the temperature to 45°C, use nitrogen gas to bubble into the electroless copper plating solution, and introduce the polyimide film with active copper on the above electroless copper plating solution. Soak in liquid for 40 minutes. Th...

Embodiment 2

[0035] This embodiment is used to illustrate the electroless copper plating solution and surface electroless copper plating method for the polyimide film provided by the present invention.

[0036] Adopt the method identical with embodiment 1 to process above-mentioned polyimide film introducing active species copper, difference is:

[0037] Preparation of electroless copper plating solution: 20 grams of anhydrous copper sulfate, 8 grams of ascorbic acid, 60 grams of ethylenediaminetetraacetic acid, 7 mg of potassium ferrocyanide, 0.5 grams of sodium dodecylbenzenesulfonate , 3.6 grams of nickel sulfate hexahydrate, 8 milligrams of thiourea and 30 grams of boric acid were dissolved in deionized water to prepare 1 liter of electroless copper plating solution.

[0038] The polyimide plated piece obtained by the above method is denoted as A2.

Embodiment 3

[0040] This embodiment is used to illustrate the electroless copper plating solution and surface electroless copper plating method for the polyimide film provided by the present invention.

[0041] Adopt the method identical with embodiment 1 to process above-mentioned polyimide film introducing active species copper, difference is:

[0042] Preparation of electroless copper plating solution: 8 grams of anhydrous copper sulfate, 3.2 grams of ascorbic acid, 20 grams of potassium sodium tartrate tetrahydrate, 0.5 grams of n-octyl sodium sulfate, 0.9 grams of nickel chloride hexahydrate, 0.5 mg Thiourea and 15 grams of boric acid were dissolved in deionized water to prepare 1 liter of electroless copper plating solution.

[0043] The polyimide plated piece obtained by the above method is denoted as A3.

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Abstract

The invention provides a chemical copper plating solution for a polyimide film and a surface chemical copper plating method thereof, wherein the chemical copper plating solution is a water solution containing copper salt, ascorbic acid or soluble ascorbic acid salt, a complexing agent, a metal catalyst, a stabilizer and a pH buffering agent. The pH value of the chemical copper plating solution is5.5-8.0, and the concentration of the stabilizer is not higher than 50milligrams / liter. The chemical copper plating solution provided by the invention is a neutral copper plating solution, adopts thenontoxic environment-friendly ascorbic acid or soluble ascorbic acid salt as a reducer, is suitable for the surface chemical copper plating of the polyimide film, and has good effect on environment protection.

Description

【Technical field】 [0001] The invention relates to the technical field of electroless plating, in particular to an electroless copper plating solution for a polyimide film and a surface electroless copper plating method thereof. 【Background technique】 [0002] Polyimide materials have good insulation and sealing properties, and also have other outstanding properties such as high thermal stability, high temperature and low temperature resistance, good mechanical properties, low thermal expansion coefficient, non-toxic, especially low The dielectric constant can reduce the current interference and energy consumption between the wires. Therefore, polyimide has broad application prospects in the field of microelectronics. In the electronics industry and microelectronics industry, electroless plating technology is widely used because of its low cost and normal temperature operability. Polyimide films can be laser-induced, nano-TiO 2 Photocatalysis, surface modification and othe...

Claims

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Application Information

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IPC IPC(8): C23C18/38
Inventor 刘小云
Owner 常熟华虞环境科技有限公司
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