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Lower-temperature sintered conductive ink

A low-temperature sintering, conductive ink technology, used in inks, printed circuit parts, metal pattern materials, etc., can solve the problem of not involving the sintering process and sintering temperature of conductive ink, limiting the speed of decomposition into metal elements, not inkjet printing, etc. problems, to achieve the effect of improving the substrate range, good electrical conductivity, and reducing the sintering temperature

Active Publication Date: 2014-05-07
NINGBO INST OF MATERIALS TECH & ENG CHINESE ACADEMY OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] Chinese Invention Patent Application Publication CN101010388A discloses a conductive ink whose main component is a metal complex, and the sintering temperature needs to be 200°C, which is still high; in addition, the nature of the complex limits the speed of decomposition into metal elements, namely Longer calcination time required
Chinese Invention Patent Application Publication CN101448904A discloses an inkjet ink composition containing a high molecular weight linear polymer, which can reduce satellite droplets formed during inkjet printing, but this patent does not involve the sintering process and sintering temperature of conductive ink
Chinese Invention Patent Application Publication CN1671805A discloses a method for preparing a conductive nano-metallic ink that requires a low sintering temperature, but the conductive nano-metallic ink prepared by this method is suitable for the coating method processing technology, not the conductive ink in the inkjet printing technology

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0045] Disperse 10 parts of spherical silver powder with a particle diameter of 50 to 80 nanometers in 70 parts of isopropanol, then add 10 parts of polyethylene glycol with a molecular weight of 10,000, and disperse the resulting solution with ultrasound for 30 minutes, 3000rpm Centrifuge for 10 minutes, then filter; after filtering, add 5 parts of glycerol as a humectant, 1 part of polysiloxane as an antifoaming agent, 2 parts of epoxy resin as an adhesive, and 2 parts of potassium sorbate As a preservative, stir at 200 rpm for 30 minutes to obtain a conductive ink that can be sintered at a low temperature.

[0046] Take a small amount of the above-mentioned conductive ink and dry it at 100°C for 1 hour, then use a field emission scanning electron microscope (SEM) to observe, as shown in figure 1 As shown, it can be seen that the metal particles in the conductive ink are distributed discretely.

[0047] The conductive ink prepared above is printed into a prefabricated patte...

Embodiment 2

[0049] Dissolve 20 parts of silver nitrate in 50 parts of water, add 10 parts of polyethylene glycol with a molecular weight of 100,000, stir at 500 rpm for 60 minutes, then heat in a water bath to 50°C and continue stirring and add 10 parts of 50% sodium borohydride dropwise as a reducing agent. After adding, keep stirring for 30 minutes, then centrifuge at 3000rpm for 30 minutes and then filter; after filtering, conduct electrodialysis on the resulting solution for 20 minutes, then add 5 parts of glycerol as a humectant, and 1 part of polysiloxane as a defoamer agent, 1 part of stearic acid as a surfactant, 2 parts of epoxy resin as an adhesive, 1 part of potassium sorbate as a preservative, and then stirred at 200 rpm for 30 minutes to obtain a low-temperature sinterable conductive ink.

[0050] The above-mentioned low-temperature sinterable conductive ink was printed into a prefabricated pattern on paper by self-made inkjet equipment, and sintered at 150°C for 30 minutes to...

Embodiment 3

[0052] Dissolve 25 parts of silver nitrate in 50 parts of water, add 10 parts of polymethacrylic acid with molecular weight of 200000, stir at 500rpm for 60 minutes, add 2 parts of polysiloxane as defoamer, stir at 1000rpm, then add 10 parts of 50% hydrated Hydrazine was used as a reducing agent, continuously stirred for 10 minutes, and then filtered at 3000 rpm for 30 minutes; after filtration, 3 parts of glycerol were added as a humectant in the resulting solution, and 1 part of potassium sorbate was used as a preservative. After stirring at 200 rpm for 30 minutes, The conductive ink that can be sintered at low temperature is obtained.

[0053] The above-mentioned conductive ink that can be sintered at low temperature is printed into a prefabricated pattern on paper by self-made equipment, and sintered at 130 ° C for 30 minutes to obtain a sintered product. Use SEM to observe the sintered product, and the result is similar to figure 2 As shown, it can be seen that the silve...

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Abstract

The invention discloses a low-temperature quickly sintered conductive ink for use in ink jet printing, which comprises 1 to 70 weight percent of nano metal particles, 0.1 to 10 weight percent of dispersant, 25 to 98 weight percent of solvent and 0.01 to 36 weight percent of additive, wherein the additive is one or a mixture of two or more of a surfactant, a reducer, a defoamer, an adhesive, a preservative and a humectants. Compared with the prior art, the low-temperature sintered conductive ink can reduce sintering temperature and keep the high conductivity of a wire. For example, at a sintering temperature of 150 DEG C, the conductive ink can make the resistance of a silver wire reach 10 to 7ohm.m. Therefore, the conductive ink can enlarge the range of substrates to which the conductive ink is applied in ink jet printing and reduce energy consumption, and has a great significance for the cost control and environmental protection of manufacturers.

Description

technical field [0001] The invention relates to a conductive ink for inkjet printing, in particular to a low-temperature sinterable conductive ink. Background technique [0002] Inkjet printing technology is a non-contact, pressure-free, and plate-free printing technology that is widely used in daily life. Inkjet printing technology can be applied on flexible solid substrates, such as producing electrical components on various thin films and rough substrates, so for radio frequency identification tags (RFID), printed circuit boards (PCB), flexible For industries such as displays and flexible solar photovoltaic cells, inkjet printing technology has attracted much attention. [0003] As far as circuit board production is concerned, traditional methods include etching and screen printing. Etching is a relatively traditional method of manufacturing circuit boards or electronic circuits with certain flexibility. The etching subtraction process requires a large amount of cleanin...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09D11/52H05K1/09
Inventor 王烨乌学东熊敬
Owner NINGBO INST OF MATERIALS TECH & ENG CHINESE ACADEMY OF SCI
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