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Flexible printed circuit board, inlet sheet using the same, RFID media, and method for producing the rfid media

A flexible printed circuit and manufacturing method technology, applied in printed circuit manufacturing, printed circuit, printed circuit and other directions, can solve the problems of uneven quality, uneven quality, no indication of adhesive layer, etc., and achieve mechanical strength or Superior heat resistance, simplified production process, and superior environmental suitability

Inactive Publication Date: 2010-09-15
TOYOBO CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0046] However, in the method of Patent Document 8, laminated films, etc. are not considered, and the methods of manufacturing these are ultimately produced by a molding process in the methods of Patent Documents 10, 13, and 14, so the improvement in productivity has not been sufficiently achieved. and the reduction of the defect rate, in the methods of Patent Documents 9 and 11-15, an adhesive is used after all, so it is difficult to improve the thickness unevenness of the adhesive layer, and it is not proposed that the production speed and the defect rate, Technology to improve all unevenness in quality
[0047] That is, in the prior art, it is not disclosed to use a web-shaped biaxially stretched polyester film in which an adhesive layer is preliminarily formed by co-extrusion, and to use a lamination roll bonding process without a molding process without using an adhesive. And manufacturing, and thereby can improve the production speed, defective rate, and quality unevenness of the RFID medium manufacturing method
In addition, there is neither description nor suggestion of a technology for making the thickness of the adhesive layer uniform by forming the adhesive layer by co-extrusion to improve the dielectric properties of the RFID medium, or a lamination bonding process without a molding process, Technology for improving the defect rate, no technology capable of improving all the production speed, defect rate, and quality variation in the above-mentioned manufacturing method has been proposed

Method used

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  • Flexible printed circuit board, inlet sheet using the same, RFID media, and method for producing the rfid media
  • Flexible printed circuit board, inlet sheet using the same, RFID media, and method for producing the rfid media
  • Flexible printed circuit board, inlet sheet using the same, RFID media, and method for producing the rfid media

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0271] [Manufacture of heat-adhesive biaxially stretched polyester film]

[0272] A mixture comprising 8% by mass of the above-mentioned pore former-containing master particles, 8% by mass of the above-mentioned titanium oxide-containing master particles, and 84% by mass of the above-mentioned PET resin was used as a raw material M. In addition, 80% by mass of the above-mentioned amorphous polyester resin A1 and 10% by mass of atactic polystyrene resin (manufactured by Nippon Polystyrene Co., Ltd., G797N; glass transition temperature of 95° C.), wax-containing mother particles The mixture of W1 was used as feedstock C.

[0273] The raw material M and the raw material C are vacuum-dried to a moisture content of 80 ppm, supplied to another extruder, melted, guided to the feeding mechanism, and laminated on both sides of the intermediate layer (substrate) formed of the raw material M. After the heat-adhesive layer was bonded by a feeding mechanism, it was extruded as a film from...

Embodiment 2

[0288] A mixture comprising 30% by mass of the above-mentioned titanium oxide-containing mother particles, 35% by mass of the above-mentioned PET resin, and 35% by mass of the amorphous polyester resin A2 was used as a raw material M. In addition, a mixture comprising 85% by mass of the above-mentioned amorphous polyester resin A2 and 15% by mass of a linear low-density polyethylene resin (manufactured by Ube Maruzen Polyethylene Co., Ltd., Tamerit 2040F; melting point 116° C.) was used as raw material C. In addition, the thickness of each layer co-extruded when manufacturing the unstretched film was changed, and the thickness of each layer of the thermal adhesive layer Aa / intermediate layer / thermal adhesive layer Ab with a thickness of 250 μm was set to 12 / 26 / 12( Unit: μm). Otherwise, a heat-adhesive biaxially stretched polyester film was produced in the same manner as in the examples.

[0289] In addition, the surface of the metal foil laminate obtained in the same manner ...

Embodiment 3

[0292] A mixture comprising 6% by mass of the pore former-containing master particles and 94% by mass of the above PET resin was used as the raw material M. In addition, a mixture including 87% by mass of the above-mentioned amorphous polyester resin A2, 3% by mass of copolymerized polypropylene resin (manufactured by Prepolymer Co., Ltd., melting point 138° C.), and 10% by mass of wax-containing mother particles W2 was used as raw material C. In addition, the thickness of each layer co-extruded when manufacturing the unstretched film was changed, and the thickness of each layer of the thermal adhesive layer Aa / intermediate layer / thermal adhesive layer Ab with a thickness of 125 μm was set to 10 / 100 / 15 ( Unit: μm). Otherwise, a heat-adhesive biaxially stretched polyester film was produced in the same manner as in the examples.

[0293] Using the film obtained here, FPC was produced in the same manner as in Example 1. However, instead of aluminum foil, copper foil (CU-JIS C ...

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Abstract

Disclosed is an FPC suitable for use in RFID media. Also disclosed are RFID media improved in production speed, rejection rate, electrical quality and product appearance, and a method for producing such RFID media. Specifically disclosed is a flexible printed circuit board which is produced by etching a laminate that is composed of a biaxially stretched polyester film having a thermal adhesive layer and a base layer formed by co-extrusion and a metal foil bonded to a surface of the biaxially stretched polyester film through the thermal adhesive layer. This flexible printed circuit board is characterized in that the base layer of the biaxially stretched polyester film has a melting point of 200-300 DEG C, and the thermal adhesive layer is made of a polyester resin containing a wax.

Description

technical field [0001] The present invention relates to a flexible printed circuit wiring board, an inlet sheet and an RFID medium using the same. In addition, it relates to a method of manufacturing an RFID medium. Background technique [0002] In recent years, information management and operation systems (RFID systems) based on cards with built-in IC chips or tags have been popularized. The RFID media used in these are generally called "IC cards" or "IC tags". Compared with conventional printing, note-type, magnetic recording-type cards, labels, etc., they can record and hold a large amount of information. Because it is practically useful, it is applied in various fields to manage and use various information of people and objects. [0003] As a plastic material constituting an RFID medium, polyvinyl chloride (PVC) has conventionally been used as a mainstream. However, in recent years, from the viewpoint of environmental protection, there has been a growing demand for al...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/03B32B15/09G06K19/077H05K1/02H05K3/00
CPCH05K2203/122H05K2201/0145H05K3/022H05K1/0393B32B15/08B32B27/36H05K2201/0355H05K3/386B32B15/09B32B2307/518B32B2457/08
Inventor 西睦夫斋宫芳纪佐佐木靖横山诚一郎
Owner TOYOBO CO LTD
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