Front electrode structure of schottky diode and process manufacturing method of front electrode structure
A technology of Schottky diodes and front electrodes, applied in semiconductor/solid-state device manufacturing, circuits, electrical components, etc., can solve problems such as low packaging yield, device damage, physical characteristics, and electrical characteristics, and achieve anti-ESD Ability improvement and damage reduction effect
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[0034] The following is a further description of the entire Schottky diode manufacturing process with reference to the drawings. As described in the background art, the front electrode structure of a conventional Schottky diode chip is mostly composed of Ti (titanium)-Ni (nickel)-Ag (silver). ), V (vanadium)-Ni (nickel)-Ag (silver) and other three-layer structure composition, the realization steps are as follows:
[0035] The voltage divider ring of the conventional planar high voltage transistor is formed at the same time as the main junction, and the implementation steps are as follows:
[0036] 1. Clean the Schottky diode chip before vacuum evaporation and coating, as shown in Figure 1(a);
[0037] 2. Vacuum evaporate the contact layer metal Ti or V, as shown in Figure 1(b);
[0038] 3. Vacuum evaporation of transition layer metal Ni, as shown in Figure 1(c);
[0039] 4. Vacuum evaporate the conductive layer of Ag, as shown in Figure 1(d);
[0040] 5. Perform photolithography on the ...
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