Method for preparing colorful TiN film by utilizing direct current magnetron sputtering
A technology of DC magnetron sputtering and thin film, which is applied in the direction of sputtering plating, ion implantation plating, metal material coating process, etc., can solve the problems that have not been reported, and achieve the effect of low deposition temperature and high surface finish
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Embodiment 1
[0033] Equipment used: SA-6T vacuum ion coating machine
[0034] Preparations before the experiment: immerse the smooth-surfaced high-speed steel or stainless steel substrate in 95% ethanol solution for ultrasonic excitation for 10 minutes, then soak it in acetone solution, dry it with a hair dryer, and then fix it in the sample of the vacuum deposition chamber on the shelf.
[0035] Coating process parameters:
[0036] Background vacuum degree: 3×10 -3 Pa, sputtering ion source process parameters: sputtering voltage 200 V, sputtering beam 2 A, sputtering energy 400 W.
[0037] Other process parameters: Acceleration voltage is 0, auxiliary energy is 0, auxiliary beam current is 0; the temperature of the substrate is not heated.
[0038] Nitrogen is used as the sputtering gas during the deposition process, and the flow rates are maintained at 0.59, 0.84, 1.99, 2.21, 2.37 sccm (standard cubic centimeters per minute) through the flow controller, and the corresponding working ...
Embodiment 2
[0040] Equipment used: SA-6T vacuum ion coating machine
[0041] Preparations before the experiment: immerse the smooth-surfaced high-speed steel or stainless steel substrate in 95% ethanol solution for ultrasonic excitation for 20 minutes, then soak it in acetone solution, dry it with a hair dryer, and then fix it in the vacuum deposition chamber. on the shelf.
[0042] Coating process parameters:
[0043] Background vacuum degree: 3×10 -3 Pa, sputtering ion source process parameters: sputtering voltage 200 V, sputtering beam 2 A, sputtering energy 400 W.
[0044] Other process parameters: Acceleration voltage is 0, auxiliary energy is 0, auxiliary beam current is 0; the temperature of the substrate is not heated.
[0045]Nitrogen was used as the sputtering gas during the deposition process, and the flow rates were maintained at 0.59, 0.84, 1.99, 2.21, and 2.37 sccm (standard cubic centimeters per minute) through the flow controller; the working pressure was 0.42 Pa. The...
Embodiment 3
[0047] (1) Use polished, smooth surface high-speed steel or stainless steel as the substrate coating;
[0048] (2) Immerse the substrate to be coated in 95% ethanol solution for ultrasonic excitation for 15 minutes, then soak in acetone solution and dry with a hair dryer;
[0049] (3) Then fix the substrate to be coated on the sample rack in the vacuum deposition chamber for coating, and vacuum the back and bottom before coating to 3×10 -3 Pa, and clean the surface by ion bombardment for 3 minutes; the distance between the substrate and the sputtering target is 150 mm, and no bias is applied;
[0050] (4) Keep the sputtering power at 200 W when coating the substrate, and plate TiN film samples of different colors under different nitrogen flow rates and different deposition pressures; the nitrogen flow rates used are controlled by flow meters, which are 0.59, 0.84, 1.99, 2.21, 2.37 sccm, the corresponding deposition pressures are 0.11, 0.16, 0.36, 0.39, 0.42 Pa; the deposition...
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