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Positive photosensitive organic-inorganic hybrid insulator composition

A photosensitive and insulating film technology, which is applied in the fields of photomechanical equipment, photosensitive material processing, optics, etc., can solve the problems of lower aperture ratio of displays, large evaporation device area, and burden of large-scale equipment, and achieve excellent panel reliability, The effect of simplifying the process and reducing power consumption

Active Publication Date: 2014-04-02
DONGJIN SEMICHEM CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In the case of SiNx film, it is obtained by CVD process, and in the case of acrylic photosensitive organic insulating film, it is obtained by photo (Photo) process, so the productivity problem due to process time is serious
[0003] In the conventional insulating film, when the SiNx film formed by the above-mentioned CVD is formed alone, there is a problem that the aperture ratio of the display decreases. Due to the increase in the size of the display, the area occupied by the vapor deposition device on the production line is also considerably large, resulting in large-scale equipment. brings a great burden
In addition, when the acrylic photosensitive organic insulating film passed through the conventional optical process is formed alone, it will cause electrical defects in the display, such as image retention, crosstalk, and threshold voltage drift.
A defect on the membrane known only as a defect of an organic substance leading to leakage is the cause

Method used

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  • Positive photosensitive organic-inorganic hybrid insulator composition
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  • Positive photosensitive organic-inorganic hybrid insulator composition

Examples

Experimental program
Comparison scheme
Effect test

Synthetic example 1

[0090] Synthesis example 1 (production of oligosiloxane compound (A))

[0091] In a flask equipped with a condenser tube and a stirrer, as reactive silanes, 55 parts by weight of phenyltriethoxysilane, 20 parts by weight of tetraethoxysilane, and 25 parts by weight of triethoxysilane were respectively put in, and ethanol was added 100 parts by weight were used as a solvent, and after nitrogen replacement, it stirred slowly. After adding 40 parts by weight of ultrapure water and 3 parts by weight of oxalic acid as a catalyst to the reaction solution, it was stirred again gently. After 1 hour, the temperature of the reaction solution was raised to 60° C., and the temperature was maintained for 10 hours to carry out solution polymerization, and then cooled to normal temperature to complete the reaction. Further quenching to below 0°C resulted in precipitation of the reactants. In addition, after removing the supernatant containing unreacted silane, the solvent of alcohols and r...

Synthetic example 2

[0092] Synthesis example 2 (production of oligosiloxane compound (B))

[0093] In a flask equipped with a condenser tube and a stirrer, as reactive silanes, 55 parts by weight of phenyltriethoxysilane, 20 parts by weight of tetraethoxysilane, and 25 parts by weight of triethoxysilane were respectively placed, and no Add the solvent, replace with nitrogen, and stir slowly. After adding 40 parts by weight of ultrapure water and 2 parts by weight of nitric acid as a catalyst to the reaction solution, it was stirred again gently. After 1 hour, the temperature of the reaction solution was raised to 60° C., and the temperature was maintained for 10 hours to carry out bulk polymerization, and then cooled to normal temperature to complete the reaction. Further quenching to below 0°C resulted in precipitation of the reactants. In addition, after removing the supernatant liquid containing unreacted silane, the alcohol solvent and residual moisture generated during the reaction were re...

Synthetic example 3

[0094] Synthesis example 3 (production of oligosiloxane compound (C))

[0095] In the above synthesis example 1, 60 parts by weight of diphenyldimethoxysilane, 20 parts by weight of tetraphenoxysilane, 20 parts by weight of tetraphenoxysilane, Except for 20 weight part of ethoxysilanes, it implemented by the method similar to the said synthesis example 1. Finally, as a result of GPC analysis, the oligosiloxane compound of a) whose polystyrene conversion weight average molecular weight (MW) was 3000 was produced.

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Abstract

The present invention relates to a positive photosensitive organic-inorganic hybrid insulator composition that comprises: i) a reactive silane containing 1-3 phenyl groups represented by chemical formula (1); and ii) a siloxane oligomer compound that is obtained by hydrolysis and condensation polymerization of a silane monomer of a tetra-functional silane represented by chemical formula (2) under a catalyst and has the average molecular weight (converted to polystyrene) of 1,000-2,0000. The positive photosensitive organic-inorganic hybrid insulator composition according to the present invention simplifies the process and reduces costs by forming a double structure of existing SiNx Passivation / acrylic photo-sensitive organic insulator into a mono-layer, improves sensitivity, resolution, process margin, transparency, and anti-thermochromism, reduces electric power consumption by obtaining an insulator having a low dielectric constant, and removes an afterimage, crosstalk, and a shift phenomenon of threshold voltage. In addition, the composition can increase reliability of a panel by enabling low outgassing through high thermal endurance. Therefore, the composition can be applied to a passivation insulator, a gate insulator, and a plate insulator in various displays.

Description

technical field [0001] The present invention relates to a positive photosensitive organic-inorganic hybrid insulating film composition, and more specifically relates to forming a double structure of the existing SiNx passivation / acrylic photosensitive organic insulating film into a layer (layer), thereby being able to bring The simplification of the process and the saving of production cost not only have excellent performances such as sensitivity, resolution, process margin, transparency, heat discoloration resistance, etc., especially make the low dielectric constant insulating film possible, thereby reducing power consumption and eliminating Afterimages, crosstalk, and threshold voltage drift phenomena, and also enable low outgassing due to excellent heat resistance, thereby ensuring excellent panel reliability, and thus can be usefully applied to various displays The positive-type photosensitive organic-inorganic hybrid insulating film composition can be usefully applied to...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G03F7/039
CPCG03F7/0757G03F7/40G03F7/0233
Inventor 金柄郁尹赫敏金东明丘冀赫吕泰勋尹柱豹申洪大崔守延金珍善李相勋
Owner DONGJIN SEMICHEM CO LTD