Method for improving resistive storage performance of strontium titanate stannate thin film
A technology of resistive variable storage and strontium stannate, which is applied in the direction of electrical components, can solve problems such as no theoretical explanation, and achieve the effects of improving the performance of resistive variable storage, good lithography, and easy to distinguish
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[0042] The chemical raw material used in the preparation of the precursor solution is strontium acetate [Sr(CH 3 COO) 2 ], tin acetate [Sn(CH 3 COO) 4 ] and titanium isopropoxide [Ti(OC 3 h 7 ) 4 ], magnesium acetate [Mg(CH 3 COO) 2 ] and manganese acetate [Mn(CH 3 COO) 2 ]; The solvent is glacial acetic acid and ethylene glycol ether. First weigh strontium acetate, tin acetate, magnesium acetate and manganese acetate according to the corresponding stoichiometric ratio (magnesium acetate can be weighed by stoichiometric ratio or non-stoichiometric ratio) and dissolved in glacial acetic acid solution and heated to boiling, 10 Stop heating after 1 minute, and cool to room temperature; wherein, the molar ratio of the total amount of elements Sr and Sn to glacial acetic acid is 1:10. Add the mixed solution of titanium isopropoxide, ethylene glycol ethyl ether and acetylacetone (AcAc) into the glacial acetic acid solution containing strontium and tin, wherein: the molar r...
Embodiment 1
[0046] Preparation of Mg and Mn-doped SrTi for resistive variable memory with x=0.05, y=2, z=1 0.95 sn 0.05 o 3 thin film (SrTi 0.95 sn 0.05 o 3 +2%Mg+1%Mn): Take the precursor solution of strontium titanium stannate with a molar concentration of 0.1M aged for 24 hours, and place it on the substrate LaNiO 3 / Pt / Ti / SiO 2 / Si coated with one layer, the gel film is slowly pushed from room temperature into a tubular gradient furnace at 500°C, placed for 15 minutes for heat treatment, and this process is repeated until the film reaches the required thickness of 40-80 nm. Finally, the film was heat-treated at 700°C for 0.5 hours. Then on its upper surface adopt the method of DC magnetron reactive sputtering to sputter the upper titanium nitride electrode as the top electrode, its diameter is 0.2mm, the thickness is about 70nm, forms the bottom electrode / (SrTi 0.95 sn 0.05 o 3 +2%Mg+1%Mn) film / top electrode plate capacitor structure to test the resistance change performance ...
Embodiment 2
[0051] Preparation of Mg and Mn-doped SrTi for resistive memory with x=0.01, y=1, z=0.1 0.99 sn 0.01 o 3 thin film (SrTi 0.99 sn 0.01 o 3 +1%Mg+0.1%Mn): Take the precursor solution of strontium titanate stannate with a molar concentration of 0.05M aged for 24 hours, and place it on the substrate LaNiO 3 / Pt / Ti / SiO 2 / Si coated with one layer, the gel film is slowly pushed from room temperature into a tubular gradient furnace at 500°C, placed for 15 minutes for heat treatment, and this process is repeated until the film reaches the required thickness of 40-80 nm. Finally, the film was heat-treated at 650°C for 1 hour. Then on its upper surface adopt the method of DC magnetron reactive sputtering to sputter the upper titanium nitride electrode as the top electrode, its diameter is 0.2mm, the thickness is about 70nm, forms the bottom electrode / (SrTi 0.99 sn 0.01 o 3 +1%Mg+0.1%Mn) film / top electrode plate capacitor structure to test the resistance change performance of th...
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