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A displacement chemical gold plating solution

An electroless gold plating and alloy technology, applied in the field of displacement electroless gold plating solution, can solve the problems of difficult control of electroless plating, harm to operators, influence on welding quality, etc., to avoid poor adhesion, good uniformity, and solder wettability. good effect

Inactive Publication Date: 2011-12-21
SHENZHEN FARCIEN APPLIED MATERIALS
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  • Abstract
  • Description
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  • Application Information

AI Technical Summary

Problems solved by technology

Though this reduction type electroless gold plating solution can not produce corrosion to nickel layer, because when utilizing this reduction type electroless gold plating solution to carry out electroless plating, must analyze and supplement to reducing agent at any time and be used for guaranteeing the balance with complexing agent, It makes the control of electroless plating more difficult, thus affecting the welding quality
[0005] As can be seen from the above reports, the traditional displacement type electroless gold plating solutions all use gold potassium cyanide as the main salt of gold plating. During the reaction, gold is reduced to gold atoms and deposited on the metal of the plated substrate, and the cyanide that plays a complexing role Potassium presents free cyanide residues in the plating solution, which must be treated to break cyanide before being discharged into nature, otherwise the highly toxic free cyanide will cause serious environmental pollution problems. Free cyanide also poses a serious hazard to operators

Method used

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  • A displacement chemical gold plating solution
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Embodiment 1

[0045] The test board used in this embodiment is an FR-4 substrate with a thickness of 2.0mm, the copper coverage area is about 15%, and the remaining part is coated with solder resist ink.

[0046] Pre-treatment steps: The test plate was pre-treated in the manner shown in Table 1, and the drugs used in the pre-treatment process were all products of Shenzhen Huaxun Applied Materials Co., Ltd. The plating time of electroless nickel plating is 25 minutes to form an electroless nickel thickness of 4 μm.

[0047] The test plate pretreatment process and condition that table 1 embodiment 1 adopts

[0048]

[0049] In a 500ml beaker, prepare the components and proportions shown in Table 2 to obtain a displacement type chemical gold plating solution. After adjusting the pH value to 5.2, heat the beaker to 86°C with a magnetic heating stirrer;

[0050] The substrate treated in the pretreatment step was washed with water, and immersed in the above-mentioned displacement chemical gol...

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Abstract

The invention discloses a displacement type electroless gold plating solution, which comprises monopotassium citrate monohydrate bis(malononitrile alloy (I)), a conductive compound, a buffering agent, a shielding complexing agent, a nickel oxidation remover and water. The nickel oxidation remover is one or more of diethylenetriamine, pentamethyldiethylenetriamine, triethylenetetramine, hexamethyltriethylenetetramine and tetraethylenepentamine. The present invention provides the source of gold ions with potassium citrate monohydrate (malononitrile alloy (I)) as the displacement type chemical gold plating solution, thus does not need to use potassium gold cyanide as the gold source compound, and is an environmentally friendly displacement chemical Gold plating solution. Since the substrate metal is easily corroded in the electroless plating solution of the displacement type to produce more nickel oxides, the nickel oxide remover is used to remove the nickel oxides on the surface of the substrate metal. Experimental results show that the uniformity of the plating film formed by using the displacement type chemical gold plating solution provided by the invention is good, the grain boundary has no corrosion condition, and the solder wettability is good.

Description

technical field [0001] The invention relates to the technical field of coating, in particular to a displacement type chemical gold plating solution. Background technique [0002] In order to improve the solderability or linear solderability of electronic components such as printed wiring boards and ceramic substrates, it is necessary to plate nickel layers on the surface of mounting parts and terminals of printed wiring boards and other substrates. However, since the nickel layer is prone to oxidation reaction and affects the solderability and welding strength, it is necessary to plate a gold layer on the surface of the nickel layer. In the formed composite layer of nickel layer and gold layer, the nickel layer has an important barrier function on the printed circuit board, preventing the atoms of the copper layer and the gold layer from migrating to each other, and at the same time, the gold layer protects the nickel layer from being oxidized At the same time, it has good ...

Claims

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Application Information

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IPC IPC(8): C23C18/42
Inventor 邱文裕
Owner SHENZHEN FARCIEN APPLIED MATERIALS
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