The invention discloses a displacement type electroless
gold plating solution, which comprises monopotassium citrate monohydrate bis(
malononitrile alloy (I)), a conductive compound, a
buffering agent, a shielding complexing agent, a
nickel oxidation remover and water. The
nickel oxidation remover is one or more of
diethylenetriamine, pentamethyldiethylenetriamine,
triethylenetetramine, hexamethyltriethylenetetramine and tetraethylenepentamine. The present invention provides the source of gold ions with
potassium citrate monohydrate (
malononitrile alloy (I)) as the displacement type chemical
gold plating solution, thus does not need to use
potassium gold
cyanide as the gold source compound, and is an
environmentally friendly displacement chemical
Gold plating solution. Since the substrate
metal is easily corroded in the
electroless plating solution of the displacement type to produce more
nickel oxides, the
nickel oxide remover is used to remove the
nickel oxides on the surface of the substrate
metal. Experimental results show that the uniformity of the plating film formed by using the displacement type chemical
gold plating solution provided by the invention is good, the
grain boundary has no
corrosion condition, and the solder wettability is good.