Grinding fluid for processing LED (light-emitting diode) substrate and preparation method thereof

A technology of grinding liquid and substrate, which is applied in the field of precision grinding, can solve the problems of unsatisfactory processing efficiency, low surface processing quality, and low hardness value, so as to reduce surface scratches and microcracks, reduce surface roughness, and improve Effect of Surface Finish Quality

Inactive Publication Date: 2012-02-01
ZHENGZHOU RES INST FOR ABRASIVES & GRINDING CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Since the hardness of micron-sized diamond is higher than that of the LED substrate, the surface of the substrate is prone to brittle chipping and chipping during the grinding process, resulting in poor surface processing quality
[0006] Non-diamond nano-scale polishing materials, such as: alumina, silicon oxide, cerium oxide, chromium oxide, etc., have fine particle size and low hardness value, and have little force on the surface of the workpiece, which can effectively reduce the diamond generated during processing. processing defects, but the processing efficiency is not satisfactory

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0018] Embodiment 1: A kind of water-based abrasive liquid, comprises solvent, additive and grinding agent, and abrasive agent is made up of diamond micropowder and nanoscale polishing material; Diamond micropowder, purity is more than 99%, particle size is: W0.5~W20; Nanoscale Polishing material, the particle size is 10~100nm, and the purity is above 99%.

[0019] The solvent is deionized water, and the additives are wetting agent, dispersing agent and suspending agent.

[0020] Its preparation method comprises the following steps:

[0021] 1) Each raw material is selected by weight, 0.4 parts of diamond micropowder, 0.01 part of wetting agent, 3 parts of dispersant, 1 part of suspending agent, 2 parts of non-diamond nano-scale polishing material, and 94 parts of deionized water. The purity of the diamond micropowder is above 99%, and the particle size is W0.5; the wetting agent is oxalic acid and citric acid, each accounting for 0.005 parts; the dispersing agent is: 1,2-pro...

Embodiment 2

[0028] Embodiment 2: A kind of water-based abrasive liquid is prepared by weight ratio from the following raw materials: 0.6 parts of diamond micropowder, 0.03 parts of wetting agent, 3 parts of dispersant, 3 parts of suspending agent, 2 parts of aluminum oxide, 92 parts of deionized water share.

[0029] The preparation method includes the following steps: 1) The raw materials are selected in parts by weight, the diamond powder has a purity of more than 99%, and a particle size of W1.5; the wetting agent is oxalic acid; the dispersing agent is diethylene glycol, polyethylene glycol, etc. Accounting for 1.5 parts; the suspending agent is polyvinylpyrrolidone and sodium carboxymethylcellulose each accounting for 1.5 parts; the particle size of the alumina is 10-100nm, and the purity is above 99%.

[0030] Others are the same as embodiment 1.

[0031] The surface roughness Ra value of the LED substrate processed by using the abrasive liquid reaches 8nm, and the surface has no obv...

Embodiment 3

[0032] Embodiment 3: A kind of water-based abrasive liquid is prepared by weight ratio from the following raw materials: 1.0 parts of diamond micropowder, 0.20 parts of wetting agent, 4 parts of dispersant, 6 parts of suspending agent, 3 parts of cerium oxide, 87 parts of deionized water share.

[0033] The preparation method includes the following steps: 1) The raw materials are selected by weight, the diamond powder has a purity of more than 99% and a particle size of W7; the wetting agent is oxalic acid; the dispersing agent is sodium dodecylsulfonate, hexameta Sodium phosphate each accounts for 2 parts; the suspending agent is gelatin and polyvinyl alcohol accounts for 3 parts; the particle size of the cerium oxide is 10-100nm, and the purity is above 99%.

[0034] Others are the same as embodiment 1.

[0035] The surface roughness Ra value of the LED substrate processed by using the abrasive liquid reaches 16nm, and the surface has no obvious fine scratches and microcrac...

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Abstract

The invention relates to a grinding fluid for processing an LED (light-emitting diode) substrate. The grinding fluid comprises a solvent, an additive and a grinding agent, wherein the grinding agent consists of diamond micropowder and non-diamond nano polishing material; the purity of the diamond micropowder is more than 99%, and the particle size of the diamond micropowder is W0.5-W20; and the non-diamond nano polishing material is any one or a mixture of any of alumina, silicon dioxide, cerium oxide and chromic oxide, the particle size of the non-diamond nano polishing material is 10-100nm, and the purity of the non-diamond nano polishing material is more than 99%. According to the invention, micron diamond is used as a grinding material while the non-diamond nano polishing material is also compositely added, thereby ensuring the grinding rate and well guaranteeing the processing quality of the surface of a workpiece.

Description

technical field [0001] The invention belongs to the field of precision grinding and processing, and is specifically applied to the precise and efficient grinding and polishing of silicon, silicon carbide, sapphire and other substrates in the manufacture of LEDs in the optoelectronic industry. Background technique [0002] LED products have the advantages of miniaturization, power saving, low heat generation, shock resistance, long service life, high photoelectric conversion efficiency, monochromatic light emission and fast response speed, etc. They are widely used in daily life, such as indicator lights of household appliances and anti-fog in the rear of automobiles. lights, LED display, etc. LEDs are usually manufactured using silicon, silicon carbide, and sapphire as substrates. In the LED manufacturing process, the surface of the substrate must be ground and polished extremely precisely, and the processing quality requirements are very high. For example, the surface roug...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09G1/02H01L33/00
Inventor 王志强方伟
Owner ZHENGZHOU RES INST FOR ABRASIVES & GRINDING CO LTD
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