Halogen-and-rosin-free antibacterial no-clean soldering flux for lead-free solder

A lead-free solder, halogen-free technology, used in welding/cutting media/materials, welding media, welding equipment, etc., can solve problems such as affecting the conductivity of solder joints, affecting the shelf life of fluxes, and the solderability of lead-free solders. To achieve the effect of improving wetting force, good anti-oxidation effect and good welding activity

Inactive Publication Date: 2012-02-22
苏州之侨新材料科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] In recent years, many researchers have begun to develop fluxes with deionized water as the main solvent. Although they have advantages in terms of environmental protection, safety and no-cleaning, the growth of some mi

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0031] Halogen-free rosin-free antibacterial no-clean flux for lead-free solder, its composition and weight percentage content are:

[0032] Crotonic acid 1.0%

[0033] Salicylic Acid 1.0%

[0034] Succinic acid 1.0%

[0035] Adipic acid 1.5%

[0036] Phthalic acid 0.5%

[0037] Diethylene glycol ether 5.0%

[0038] Terpineol 2.5%

[0039] Acetamide 5.0%

[0040] Glyceryl monostearate 0.15%

[0041] Octylphenol ethoxylate 0.15%

[0042] Hydroquinone 0.1%

[0043] tert-butylhydroquinone 0.1%

[0044] Tea polyphenols 0.01%

[0045] Benzotriazole 0.01%

[0046] Tolylbenzotriazole 0.01%

[0047] Polyethylene glycol 600 1.0%

[0048] Polyethylene glycol 2000 4.0%

[0049] Deionized water 76.97%

[0050] Specific preparation method:

[0051] Weigh each component by weight percentage, first add deionized water, organic acid activator and co-solvent into the reaction kettle, gradually raise the...

Embodiment 2

[0054] Halogen-free rosin-free antibacterial no-clean flux for lead-free solder, its composition and weight percentage content are:

[0055] Crotonic acid 2.0%

[0056] Succinic acid 3.0%

[0057] Adipic acid 3.0%

[0058] Phthalic acid 2.0%

[0059] Diethylene glycol butyl ether 0.5%

[0060] Diethylene glycol 0.5%

[0061] Absolute Ethanol 3.0%

[0062] Triethanolamine 0.5%

[0063] Acetamide 0.5%

[0064] Sucrose fatty acid ester 1.0%

[0065] Hydroquinone 0.01%

[0066] Tea polyphenols 0.05%

[0067] Benzotriazole 0.01%

[0068] Polyethylene glycol 2000 0.1%

[0069] Deionized water 83.83%

[0070] Specific preparation method:

[0071] Weigh each component by weight percentage, first add deionized water, organic acid activator and co-solvent into the reactor, gradually raise the temperature to 65°C, and stir for 15 minutes; then add non-ionic surfactant and corrosion inhibitor in sequence , antibacteri...

Embodiment 3

[0074] Halogen-free rosin-free antibacterial no-clean flux for lead-free solder, its composition and weight percentage content are:

[0075] Salicylic Acid 0.1%

[0076] Succinic acid 0.15%

[0077] Adipic acid 0.15%

[0078] Maleic acid 0.1%

[0079] Diethylene glycol ether 5%

[0080] Diethylene glycol butyl ether 5%

[0081] Terpineol 5%

[0082] Diethylene glycol 5%

[0083] Mannitol 5%

[0084] Glycerol 5%

[0085] Glyceryl monostearate 0.05%

[0086] Octylphenol ethoxylate 0.05%

[0087] tert-butylhydroquinone 0.05%

[0088] Tea polyphenols 0.1%

[0089] Benzotriazole 0.02%

[0090] Polyethylene glycol 400 1.0%

[0091] Polyethylene glycol 2000 2.0%

[0092] Deionized water 66.23%

[0093] Specific preparation method:

[0094] Weigh each component by weight percentage, first add deionized water, organic acid activator and co-solvent into the reaction kettle, gradually raise the temperature to...

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PUM

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Abstract

The invention discloses a halogen-and-rosin-free antibacterial no-clean soldering flux for a lead-free solder. The halogen-and-rosin-free antibacterial no-clean soldering flux comprises the following components in percentage by weight: 0.5-10.0% of an organic acid activator, 5.0-30.0% of a cosolvent, 0.1-1.0% of a nonionic surfactant, 0.01-0.2% of a phenolic antioxidant, 0.01-0.1% of a bactericide, 0.01-0.02% of a corrosion inhibitor, 0.1-5.0% of a film-forming agent and the balance of deionized water. The soldering flux for the lead-free solder has the advantages of no halogen and rosin, antibacterial effect, excellent weld-aid property, bright and full welding spots, good spreadability, fewer post-welding residues and being free from a cleaning procedure; and in addition, a welded copper mirror is non-corrosive and nontoxic, and the surface insulation resistance of a welded substrate is more than 1*10+8 ohms, which meets the requirements of the electronical industry standard.

Description

technical field [0001] The invention relates to a flux for lead-free solder, in particular, it is suitable for flux for lead-free solder of tin-silver-copper (SnAgCu) series or tin-copper (SnCu) series. Background technique [0002] At present, the use of tin-lead solder has been restricted in the electronics industry, and lead-free solder has been developed rapidly due to its own environmental protection advantages. Reduced, and the melting point of lead-free solder is high, causing serious problems such as high-temperature oxidation during the soldering process and high-temperature volatilization of the active agent in the flux, which cannot achieve good activation and protection. At present, there are still obvious deficiencies and defects in the soldering flux matched with lead-free solder. [0003] The traditional rosin-based flux has reliable and stable effects and is widely used. However, there are obvious rosin residues on the substrate after soldering with ros...

Claims

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Application Information

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IPC IPC(8): B23K35/363
Inventor 黄德欢赵晓青肖文君曹敬煜杨欢
Owner 苏州之侨新材料科技有限公司
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