Diamond wire saw manufactured by adopting diamond micropowder

A technology of diamond micropowder and diamond wire saw, which is applied in metal material coating process, ion implantation plating, liquid chemical plating, etc. It can solve the problems of easy falling off of diamond particles, short service life of wire saw, and poor bonding force. , to achieve the effect of increased sawing line speed and feed speed, improved production efficiency, and increased use times

Inactive Publication Date: 2012-08-22
YANSHAN UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

There is no chemical bond between the electroplated Ni and the brazing filler metal and the diamond interface. It is just a simple me...

Method used

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  • Diamond wire saw manufactured by adopting diamond micropowder
  • Diamond wire saw manufactured by adopting diamond micropowder
  • Diamond wire saw manufactured by adopting diamond micropowder

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0043] Select diamond powder with a diameter of 0.1~50 microns to make a diamond wire saw with a titanium carbide coating on the surface:

[0044] The first step: coating metal titanium on the surface of diamond micropowder:

[0045] Evenly mix 0.1~50 micron diamond and 50~500 micron titanium powder according to the mass ratio of 1:0.1 and put it into a self-made stainless steel container, put the container in the vacuum reaction furnace cavity; turn on the vacuum pump and heating valve, and gradually heat up to 600°C , when the vacuum degree is 1Pa, keep warm for 40 minutes, close the heating valve, cool down to below 300°C and turn off the vacuum pump; take out the container after it is completely cooled, and use the solution sedimentation method to separate the diamond powder coated with carbide. The mixture of diamond micropowder and metal powder of metal carbide is fully stirred in water. After the mixture is raised, it is left to stand for 90 seconds, and the suspension ...

Embodiment 2

[0051] Select diamond powder with a diameter of 50-100 microns to make a diamond wire saw with a titanium carbide-Ni composite coating on the surface:

[0052] Step 1: Evenly mix 50~100 micron diamond and 5~50 micron titanium powder according to the mass ratio of 1:0.6 and put them into a self-made stainless steel container, put the container in the vacuum reaction chamber; turn on the vacuum pump and heating valve, and gradually increase the temperature Heat to 750°C, keep warm for 80 minutes at a vacuum of 10Pa, close the heating valve, cool down to below 300°C and turn off the vacuum pump; take out the container after it is completely cooled, and use the solution sedimentation method to separate the diamond powder coated with carbide , Stir the mixture of diamond micropowder coated with metal carbide and metal powder in water fully, raise the mixture, let it stand for 70 seconds, take the suspension, and repeatedly settle for 10 times until there is no precipitation. The ob...

Embodiment 3

[0057] Select diamond powder with a diameter of 100-200 microns to make a diamond wire saw with a titanium carbide-Ni composite coating on the surface:

[0058] Step 1: Evenly mix 100~200 micron diamonds and 50~100 micron titanium powder according to the mass ratio of 1:0.9 and put them into a self-made stainless steel container, put the container in the vacuum reaction furnace cavity; turn on the vacuum pump and heating valve, and gradually increase the temperature Heat to 800°C, keep warm for 60 minutes at a vacuum of 10Pa, close the heating valve, cool down to below 300°C and turn off the vacuum pump; take out the container after it is completely cooled, and use the solution sedimentation method to separate the diamond powder coated with carbide , fully stir the mixture of diamond micropowder and metal powder coated with metal carbide in water, raise the mixture, let it stand for 30 seconds, take the suspension, and repeatedly settle for 7 times until there is no precipitati...

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Abstract

The invention relates to a diamond wire saw manufactured by adopting diamond micropowder and also relates to a wire saw for solidifying the diamond micropowder on a steel wire matrix by using nickel-plated layer, whereas the surface of the diamond micropowder is provided with a metal carbide-plated layer, and the metal of the metal carbide-plated layer refers to titanium carbide, tungsten carbide or chromium carbide. Preferably, a metal layer is plated on the metal carbide-plated layer on the surface of the diamond micropowder; the metal of the metal layer refers to Ni or Cu, and the metal layer and the metal carbide-plated layer form the diamond micropowder of which the surface is provided with a metal carbide-metal composite plated layer. According to the diamond wire saw manufactured by adopting the diamond micropowder, a wire saw matrix and the diamond micropowder are firmly combined, and the use frequency of diamond is obviously increased; the diamond is high in exposure and is strong in cutting capacity. Compared with traditional methods, the tangential velocity and the feed velocity of the saw are obviously increased, and the production efficiency of the diamond is greatly increased.

Description

technical field [0001] The invention relates to a diamond wire saw. Background technique [0002] Diamond wire saw uses high-strength steel wire as the substrate, and solidifies diamond powder of different sizes on the substrate of steel wire by electroplating or brazing. This wire saw has narrow cutting kerf, less loss of raw materials, and high cutting efficiency. , High-speed and high-efficiency cutting performance such as multi-wire simultaneous cutting. Therefore, it is widely used in the fields of semiconductor monocrystalline silicon slicing, solar cell silicon wafer cutting, and sapphire cutting in LEDs. [0003] Those skilled in the art know that the diamond particles of the wire saw need to be firmly bonded to the steel wire matrix, otherwise, when the wire saw is performing cutting operations, the exposed diamonds will easily fall off, causing the wire saw to lose its effective cutting ability. In the traditional diamond wire saw, the diamond surface is either u...

Claims

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Application Information

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IPC IPC(8): C25D15/00C25D7/06C23C14/24C23C18/36
Inventor 臧建兵王艳辉成晓哲
Owner YANSHAN UNIV
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