Chemical nickel plating solution and aluminum silicon carbide plating method

Abstract

The invention discloses a chemical nickel plating solution and an aluminum silicon carbide plating method. The invention aims at the aluminum silicon carbide material with high silicon carbide content. According to the invention, the plated nickel layer has a good spreadability as a primer coat on the surface of an aluminum silicon carbide workpiece (metals such as gold, silver and tin can further be plated on the plated nickel layer), such that the method is suitable for batch productions. The plated layer can resist a temperature no less than 300 DEG C. After a high-temperature test, the plated layer has no peeling or blistering phenomenon when tested under a 10-time microscope. The method is suitable for modules and subassemblies, and can satisfy high-temperature welding of materials such as metal solders. The method is based on an aluminum alloy plating process, such that the method is advantaged in simple operation, stable process, low cost, and suitability for batch productions.

Description

technical field [0001] The invention relates to the technical field of metal electroplating, in particular to the batch electroplating production technology of carbon silicon aluminum materials. Background technique [0002] With the rapid development of information technology, the integration of chips in today's device components is getting higher and higher, the assembly density of microcircuits is also getting higher and higher, the size of chips is getting bigger and power is getting bigger and bigger, heat dissipation requirements At the same time, the chips are constantly developing towards larger sizes, and the substrates in modules and components are also transitioning from soft substrates (PCB, etc.) to hard substrates (LTCC, AlN, etc.). Although traditional packaging metals such as Al and Cu have excellent thermal conductivity, their thermal expansion coefficients and chips such as Si and GaAs, as well as ceramics and capacitor dielectric materials, have high therm...

AI Technical Summary

Problems solved by technology

Moreover, before electroplating, the crystal material must undergo a roughening process in order to improve the bonding force of the coating. The materials that can corrode and roughen the crystal surface are strong corrosive media such as strong acid and alkali, and these strong corrosive media are very corrosive to aluminum alloys. Strong, it will cause the aluminum on the surface of the material to be over-corroded, the roughness and porosity of the hollow surface will increase greatly, and even the silicon carbide particles will fall off from the material, affecting the airtightness of the material and even causing the material to fail

If the pre-treatment is not in place, the coating on the silicon carbide crystal will not grow (dew point) or the bonding force of the coating on the silicon carbide will be poor (the coating will blister)