Fixing glue for cutting crystalline materials and preparation method thereof

A technology of crystal material and fixing glue, applied in the field of fixing glue, can solve the problems of not being able to meet the cutting production process of crystal silicon materials, poor anti-crystallization performance, difficult mixing of glue, etc., to achieve short curing and degumming time and good anti-crystallization performance , Improve the effect of cutting efficiency

Inactive Publication Date: 2012-11-21
东莞市永固绝缘材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, there are still many problems with the fixing glue for cutting crystal materials, such as: it is not easy to mix the glue evenly when mixing the glue, and the spreadability is not good when applying the glue; The defect rate is high; the curing time is long, and it takes more than 6 to 8 hours after the glue is applied to enter the cutting process; during the degumming process, it must be soaked in hot water at 70°C for more than 30 minutes, and soaked in lactic acid solution for more than 15 minutes before completely degumming. It cannot meet the needs of the cutting production process of crystalline silicon materials

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0023] A kind of fixing glue for crystal material cutting, comprising A component and B component, wherein

[0024] Component A: by mass percentage including:

[0025] Bisphenol A type epoxy resin 60%

[0026] o-cresol novolak epoxy resin 2%

[0027] Anhydrous Calcium Oxide 20%

[0028] Hydroxyl terminated nitrile rubber 11.7%

[0029] Silane coupling agent KH550 5%

[0030] Defoamer 1%

[0031] Toner 0.3%

[0032] Component B: Include by mass percentage:

[0033] Polythiol resin 60%

[0034] Polyamide resin 2%

[0035] Triethylamine 5%

[0036] Lecithin 1%

[0037] Anhydrous Calcium Oxide 31.5%

[0038] Defoamer 0.5%

[0039] The preparation method of the fixing glue for cutting the above-mentioned crystal material is as follows:

[0040] Preparation of component A: first put 60% of bisphenol A epoxy resin, 2% of o-cresol novolac epoxy resin and 11.7% of hydroxyl-terminated nitrile rubber into the reaction kettle, set the heating temperature to 50°C, and stir for...

Embodiment 2

[0044] A kind of fixing glue for crystal material cutting, comprising A component and B component, wherein

[0045] Component A: by mass percentage including:

[0046] Bisphenol A type epoxy resin 30%

[0047] O-Cresol Novolak Epoxy Resin 10%

[0048] Anhydrous calcium sulfate 33.7%

[0049] hydroxy-terminated nitrile rubber 20%

[0050] Silane coupling agent KH560 5%

[0051] Defoamer 1%

[0052] Toner 0.3%

[0053] Component B: Include by mass percentage:

[0054] Polythiol resin 40%

[0055] Polyamide resin 15%

[0056] Dimethylbenzylamine 0.5%

[0057] Fatty acid salt 1%

[0058] Calcium Sulphate Anhydrous 43%

[0059] Defoamer 0.5%

[0060]The preparation method of the fixing glue for cutting the above-mentioned crystal material includes:

[0061] Preparation of component A: first put 30% bisphenol A epoxy resin, 10% o-cresol novolac epoxy resin and 20% hydroxyl-terminated nitrile rubber into the reaction kettle, set the heating temperature to 100°C, and stir...

Embodiment 3

[0065] A kind of fixing glue for crystal material cutting, comprising A component and B component, wherein

[0066] Component A: by mass percentage including:

[0067] Bisphenol A type epoxy resin 40%

[0068] O-Cresol Novolak Epoxy Resin 15%

[0069] Anhydrous Calcium Oxide 36.99%

[0070] hydroxy-terminated nitrile rubber 5%

[0071] Silane coupling agent KH570 2.5%

[0072] Defoamer 0.5%

[0073] Toner 0.01%

[0074] Component B: Include by mass percentage:

[0075] Polythiol resin 60%

[0076] Polyamide resin 15%

[0077] Triethanolamine 2.5%

[0078] Quaternary ammonium salt 0.6%

[0079] Anhydrous Calcium Oxide 34.5%

[0080] Defoamer 0.9%

[0081] The preparation method of the fixing glue for cutting the above-mentioned crystal material, the specific preparation steps are as follows:

[0082] Preparation of component A: first put 40% bisphenol A epoxy resin, 15% o-cresol novolac epoxy resin and 5% hydroxyl-terminated nitrile rubber into the reaction kettle,...

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PUM

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Abstract

The invention discloses a fixing glue for cutting crystalline materials and a preparation method of the fixing glue. The fixing glue comprises a component A and a component B, wherein the component A comprises the following components by mass percent: 30-60 percent of bisphenol-A epoxy resin, 2-10 percent of o-crosel novolac epoxy resin, 20-50 percent of calcareous filler, 5-20 percent of hydroxyl acrylonitrile-butadiene rubber, 0.1-5 percent of coupling agent, 0.1-1 percent of antifoaming agent and 0.01-3 percent of toner; and the component B comprises the following components by mass percent: 30-60 percent of poly mercaptan resin, 2-10 percent of polyamide resin, 0.5-5 percent of activating agent, 0.5-1 percent of degumming slow release agent, 20-50 percent of calcareous filler and 0.5-1 percent of antifoaming agent. The components A and B are uniformly mixed by the mass ratio of 1:(0.5-1) so as to prepare the fixing glue for cutting the crystalline materials. The fixing glue is short in curing and degumming time and greatly improves the cutting efficiency of the crystalline materials.

Description

technical field [0001] The invention belongs to the technical field of fixing glue, and particularly provides a fixing glue for crystal material cutting and a preparation method thereof. Background technique [0002] Crystal material cutting is an upstream enterprise in the entire solar energy industry, and the fixing glue for crystal material cutting plays an important role in the crystal material industry. In the prior art, the cutting of the crystal material is to glue the crystal material on the glass horizontally with cutting glue; Soak in lactic acid solution to make it fall off and separate from the glass. [0003] However, there are still many problems with the fixing glue for cutting crystal materials, such as: it is not easy to mix the glue evenly when mixing the glue, and the spreadability is not good when applying the glue; The defect rate is high; the curing time is long, and it takes more than 6 to 8 hours after the glue is applied to enter the cutting proces...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J163/02C09J163/04C09J109/02C09J181/00C09J177/00C09J11/04
Inventor 汝宗林刘屹
Owner 东莞市永固绝缘材料有限公司
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