Solder resist composition and printed-circuit board

A technology for printed circuit boards and compositions, applied in the directions of printed circuit, printed circuit, printed circuit manufacturing, etc., can solve the problems of deterioration of white solder mask, reduced reflectivity, deterioration of solder mask, etc., and achieves excellent resolution, improved Acid resistance effect

Inactive Publication Date: 2012-12-26
TAIYO INK MFG
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0009] However, the light and heat emitted from the LED on the printed circuit board directly packaged with the LED promotes the deterioration and coloring of the white solder resist layer, causing a decrease in reflectivity
Especi

Method used

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  • Solder resist composition and printed-circuit board
  • Solder resist composition and printed-circuit board
  • Solder resist composition and printed-circuit board

Examples

Experimental program
Comparison scheme
Effect test

Example Embodiment

[0081] Example

[0082] Examples and comparative examples are shown below to specifically describe the present invention, but the present invention is not limited by them.

[0083] (A) Synthesis of carboxyl-containing resin

Example Embodiment

[0084] Synthesis example 1

[0085] In a 2-liter separable flask equipped with a stirrer, a thermometer, a reflux condenser, a dropping funnel, and a nitrogen introduction tube, 900 g of diethylene glycol dimethyl ether as a solvent and 21.4 g of peroxide as a polymerization initiator (2 -Ethylhexanoic acid) tert-butyl ester (manufactured by NOF Corporation, trade name; PERBUTYL O), heated to 90°C. After heating, 309.9 g of methacrylic acid, 116.4 g of methyl methacrylate, and 109.8 g of lactone-modified 2-hydroxyethyl methacrylate (manufactured by Daicel Corporation, trade name; Placcel FM1) were added dropwise thereto over 3 hours. ) And 21.4 g of bis(4-tert-butylcyclohexyl)peroxydicarbonate (manufactured by NOF Corporation, trade name; PEROYL TCP) as a polymerization initiator. This was further aged for 6 hours to obtain a carboxyl group-containing copolymer resin. Among them, these reactions proceed under a nitrogen atmosphere.

[0086] Next, 363.9 g of 3,4-epoxycyclohexyl m...

Example Embodiment

[0087] Synthesis Example 2

[0088] In a flask equipped with a thermometer, a stirrer, a dropping funnel, and a reflux condenser, add diethylene glycol monoethyl ether acetate as a solvent and azobisisobutyronitrile as a catalyst, and heat it to 80 under a nitrogen atmosphere. ℃, the monomer which mixed methacrylic acid and methyl methacrylate in a molar ratio of 0.40:0.60 was added dropwise over about 2 hours. After further stirring this for 1 hour, the temperature was increased to 115° C. to inactivate the resin solution.

[0089] After cooling the resin solution, using tetrabutylammonium bromide as a catalyst, butyl glycidyl ether was added at a molar ratio of 0.40 to the carboxyl group of the obtained resin under the conditions of 95~105°C for 30 hours. React and cool.

[0090] Furthermore, tetrahydrophthalic anhydride was subjected to an addition reaction at a molar ratio of 0.26 under the conditions of 95 to 105°C for 8 hours with respect to the OH group of the resin obtained...

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Abstract

Disclosed is a solder resist composition with high reflectivity and high resolution that includes (A) a carboxyl group-containing resin, (B) a photopolymerization initiator, (C) melamine or a derivative thereof, (D) a photopolymerizable monomer, (E) rutile titanium dioxide, (F) an epoxy compound, and (G) an organic solvent, and that prevents decreases in reflectivity that are attributable to discoloration and deterioration. Also disclosed is a printed circuit board obtained by forming a solder resist using the solder resist composition.

Description

technical field [0001] The present invention relates to a solder resist composition capable of forming a high-reflectance solder resist layer suitable for use as a permanent mask of a printed circuit board, and the use of the solder resist composition to form a solder resist on the surface of a printed circuit board on which a circuit is formed Patterned printed circuit boards. Background technique [0002] In printed wiring boards, unnecessary portions of copper foil bonded on laminates are usually removed by etching to form circuit wiring, and electronic components are arranged at predetermined positions by soldering. In such a printed wiring board, a solder resist layer formed by coating and curing a base material is used as a protective film for a circuit when electronic components are soldered. [0003] As for this solder resist layer, it prevents solder from adhering to unnecessary parts at the time of soldering, and prevents circuit conductors from being directly exp...

Claims

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Application Information

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IPC IPC(8): G03F7/038G03F7/004G03F7/029G03F7/031H05K3/28
CPCH05K2201/2054H05K3/287G03F7/029G03F7/038H05K2201/0209G03F7/004G03F7/0045G03F7/0382
Inventor 依田爱子能坂麻美岛宫步宇敷滋
Owner TAIYO INK MFG
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